Abstract: A memory system (preferably implemented as an integrated circuit) including an array of memory cells, a control unit for controlling operations of the system (such as programming, reading, and erasing the cells), at least one data storage unit which stores control parameter data determining at least one control parameter for the system, and default parameter circuitry for asserting at desired times one or both of: default control parameter data (regardless of the control parameter data stored in each data storage unit); and at least one default voltage level (in place of an otherwise asserted voltage level). In preferred embodiments, the default control parameter data (or voltage levels) are asserted during a test initialize mode in response to an initialization signal generated by the control unit, for use in initializing internal control registers (and voltage levels) of the system so that an external program for controlling the system during the test mode can start from a known condition.

Abstract: A method for verifying the status of selected nonvolatile memory cells of an integrated memory circuit, such as during a memory erase or programming operation, and an integrated nonvolatile memory circuit including circuitry for performing this verification method. Preferably, the invention employs simple logic circuitry including a flip-flop to assert successful verification data only in response to a continuous validity of a verification signal throughout a sampling period, thereby avoiding false assertion of successful verification data. The sampling period is preferably longer than the expected duration of fluctuations due to noise in the verification signal. During the sampling period of a verification operation, the logic circuitry receives a raw verification signal indicative of the instantaneous relation between a measured threshold voltage of a selected memory cell and a reference voltage.

Abstract: A memory system including means for verifying the contents of a memory cell contained in a memory array to determine if a shift in the threshold voltage level has occurred. The memory system is placed into a test mode of operation in which an internal program or erase verify operation is executed under the control of the system's internal state machine. Once in the mode, the memory system steps through each memory cell, address by address, and reads the contents of the cell using the appropriate reference voltage for a programming or erase operation. A status register bit is set indicating successful completion of the verification operation for a block of memory cells. A register bit is also set if a cell fails the verification operation. This provides a more accurate determination of the state of a memory cell than can be achieved by performing an external read operation using read operation or data verification reference voltage levels.

Abstract: A flash memory array arrangement having a plurality of erase blocks which can be separately erased, preferably using negative gate erase techniques. The memory cells are arranged in each erase block to form an array of cell rows and cell columns, with the sources of the cells in each erase block connected to a common source line so as to permit separate erasure. Cells located in row have their control gates connected to a common word line and cells located in one of the columns having their drains connected to a common bit line. The cells located in each erase block have their sources connected to a common source line. Word line control circuitry functions to control the state of the word lines in read, program and erase operations. Separate erase transistors are connected to each word line for the purpose of connecting the word lines of a block to be erased to a negative voltage.

Abstract: An integrated circuit selectively operable in either a first mode (consuming low power) or a second mode (consuming relatively high power). The circuit includes MOS transistors and a supply voltage circuit for at least one of the transistors. In both modes, the supply voltage circuit holds the body of each transistor at a fixed voltage (e.g., a voltage V.sub.CC in a range from 5 to 5.5 volts, where each transistor is a PMOS device). In the second mode the supply voltage circuit supplies this fixed voltage to the source of each transistor, but in the first mode it supplies a voltage equal to or slightly offset from the fixed voltage to the source of each transistor. In some embodiments, the supply voltage circuit (in the first mode, after an initial transient state) supplies a first voltage to a well shared by a plurality of PMOS transistors, and a second voltage to the source of each PMOS device.

Abstract: A CMOS buffer circuit having a trip point which is insensitive to variations in temperature, supply voltages and manufacturing processes. The circuit output stage has three series-connected MOS transistors including an N channel pull-down transistor connected between the buffer output and the circuit common, a first P channel pull-up transistor connected to a positive supply voltage and a second P channel pull-up transistor connected between the first P channel transistor and the buffer output. The gates of the first P channel transistor and the N channel transistor are connected together to form the buffer input. An N channel reference transistor is used to generate a reference current which is mirrored into the output stage by a third P channel transistor which is connected to the second P channel transistor of the output stage so as to form a current mirror.

Abstract: A data input/output circuit used to program the cells of a memory array or to determine the state of those cells. The circuit includes a data write path used for programming the memory cells in the array and a data read path for reading data indicative of the state of the cells. The data write path includes switching means for electrically disconnecting the high capacitance elements of the write path from the read path. The switching means is under the control of a control means which acts to enable or disable the switching means. The switching means serves to electrically isolate the high capacitance elements of the write path from the read path, thereby increasing the speed with which a read operation be performed.

Abstract: An integrated memory circuit (chip) and methods for testing the chip. The chip has an array of memory cells, a sense amplifier for reading selected ones of the cells, and a switch having a first state allowing an external device connected to an external pad to sink a reference current from the sense amplifier and a second state disconnecting the pad from the sense amplifier (so that an internally generated reference current can be supplied to the sense amplifier with the switch in the second state). In the first state, the switch preferably is tolerant of a broad and continuous range of voltages on the pad. In some test modes, cells are read using a sense amplifier of the chip while selected voltages are applied to each cell and external equipment sinks reference current flowing from the sense amplifier through an external pad, thus sensing data from each cell with all the timing constraints usually placed on a read of the cell in the normal mode.

Abstract: A low cost LED array is formed from a plurality of modular units that are snapped together. Each modular unit consists of one or more U-shaped lead frame substrates which are overmolded with a thermoplastic insulator material. The lead frame substrates act as heat dissipators. The LEDs are then bonded onto the upper surfaces of the lead frame substrates. A reflector unit is separately molded and has one cone-shaped reflector for each light emitting diode. The reflector unit is aligned and affixed to the top of the lead frame unit such that the LED is disposed in the center of each cone. Each of the reflector units has several dovetail-shaped connectors which enable the completed module to be connected to adjacent modules to form the array. The modules are then electrically connected together in series or in parallel according to the particular application. The arrays may be used for plant growth or in photodynamic therapy.

Abstract: A memory chip and method for operating a memory chip, in which one or more nodes are monitored to identify an illegal condition, and a halt signal is asserted in response to the illegal condition. If an illegal condition is identified during a high voltage mode in which high voltage is applied across transistors of the chip, assertion of the halt signal is delayed until the end of the high voltage mode. In response to the halt signal, the chip halts an operation such as a memory cell erase operation. By avoiding halt signal assertion during a high voltage mode, the invention avoids problems (e.g., due to the snap back bipolar effect) which could otherwise result due to switching of transistors of the chip during the process of halting chip operation in the high voltage mode.

Abstract: An arrangement of non-volatile memory cells, such as flash memory cells which includes erase blocks which can be separately erased and which require a reduced amount of circuit area. The erase blocks each include an array of the cells arranged in rows and columns. Each cell in a row has its control gate connected to a common word line and its drain connected to a common bit line. All of the sources of one of the erase blocks are connected together by a source line structure which includes non-metallic source lines, such as doped semiconductor lines, which run generally parallel with respect to the word line and interconnect the sources of cell located in a row. The source line structure further includes at least one metallic source line which functions to interconnect the source regions of cells located in one of the erase block cell columns.

Abstract: An apparatus which allows the pulse duration of the high voltage pulses used in the programming and erase operations of a non-volatile memory system to be determined by an external timing signal instead of the internal timer normally used. Control of the pulse duration by the internal timer is disabled by gating the timer output signal with the external signal in a manner such that the gate output signal (which triggers the end of the high voltage pulse) is only generated when the external timing signal has a predetermined value. By controlling the value of the external timing signal, the pulse duration can be varied and have values other than those which would result from use of the internal timer.

Abstract: A flash memory array having a reduced number of metal source lines and increased storage density. The cells are arranged in rows and columns, with the cells in a row having their control gates connected to a common word line and the cells in a column having their drains connected to a common bit line. All of the cell sources of the array are connected together with a combination of doped semiconductor and metal lines. The source metal lines are disposed generally in parallel with the bit lines. In order to reduce the number of source metal lines, the lines are spaced apart by, typically, eight, sixteen or more cell columns. The metal source lines define a sub-array therebetween. The array includes a decoder for accessing two cells in different columns of each sub-array during single reading and programming operations. Thus, each sub-array provides two bits of data rather than the customary one bit.

Abstract: An adjustable timer circuit capable of producing accurate pulse outputs having a wide range of periods. The timer circuit includes a timing capacitor and an associated current source for producing a reference current having a magnitude which is derived from a reference voltage. A current divider is used to divide the reference current down to a smaller current used for charging the timing capacitor. A comparator circuit is provided for comparing the voltage produced across the timing capacitor with a comparison voltage also derived from the reference voltage. The timing capacitor is discharged in response to the comparator output so that subsequent output pulses can be produced. The current divider is adjustable in response to a mode control signal so that different magnitude charging currents can be produced which results in different magnitude pulse width outputs.

Abstract: A memory system capable of being configured for optimum operation after fabrication and method of controlling same. The system includes an array of memory cells arranged in a multiplicity of rows and a multiplicity of columns, with each cell located in one of the rows being coupled to a common word line and with each cell located in one of the columns being coupled to a common bit line. Control circuitry is included for controlling memory operations, with the memory operations including programming the memory cells; reading the memory cells and preferably programming the cells. A plurality of non-volatile data storage units are provided for storing control parameter data used by the control means for controlling the memory operations. Such control parameters may can include, for example, parameters for adjusting the magnitude and duration of voltage pulses applied to the memory for carrying out programming and erasing operations.

Abstract: A parallel processing redundancy memory circuit. The circuit includes parallel data paths for regular memory columns and redundant columns. An input/output buffer is coupled to the parallel paths and receives I/O selection bits. In operation, address drivers simultaneously access both the regular memory and the redundant columns. The input/output buffer then selects the appropriate data path, as determined by the I/O selection bits, for writing or reading data.

Abstract: A non-volatile memory system having means for altering the sequence of operations carried out under the control of an internal state machine which controls the data processing operations performed on the memory system. A flow control register is used to bypass an operation that would be carried out during the normal functioning of the memory system, where the register contains data bits which can be set to alter the operation of the internal state machine. The memory system is first placed into a test mode which is not accessible under the normal operating conditions. After entering the test mode, data can be written to or read from the flow control register. The data in the flow control register is used to alter the process flow of the memory system, thereby allowing a system designer to monitor how changes in the process flow improve the operation of the system.

Abstract: A memory system having a test mode which can be used to access signals internally generated by the system during its operation. The signals accessible in the test mode are not available to a standard user of the system, but can be used by a memory chip designer to determine the cause of a device failure. The memory system includes a test signal switch which is used to route one of a multitude of internal signals to an input/output (I/O) pad where the information can be accessed by a chip designer. In order to access the internal signals, the memory system is first placed into a test mode, which acts to shut off the data paths used for reading the output of the sense amplifier included as part of the data read path or for reading the contents of the status register. A signal specifying a particular test signal of interest is then input. Decode logic is used to verify the coded input signal and control the multiplexer to route a specified internal signal through the switch to the I/O pad.

Abstract: An asymmetric switch which minimizes transistor exposure to high voltage includes one pair of P-channel transistors with both N-wells coupled back to the programming voltage source and one, pair of P-channel transistors with independent N-wells. Two pairs of N-channel transistors and an inverting circuit are also included to provide complementary input voltages to the switch. The P-channel and N-channel transistors used as guard devices may be biased by the same voltage or separate voltages.

Abstract: A memory system (preferably implemented as an integrated circuit) including an array of memory cells, a control unit for controlling operations of the system (such as programming, reading, and erasing the cells), at least one data storage unit which stores control parameter data determining at least one control parameter for the system, and default parameter circuitry for asserting at desired times one or both of: default control parameter data (regardless of the control parameter data stored in each data storage unit); and at least one default voltage level (in place of an otherwise asserted voltage level). In preferred embodiments, the default control parameter data (or voltage levels) are asserted during a test initialize mode in response to an initialization signal generated by the control unit, for use in initializing internal control registers (and voltage levels) of the system so that an external program for controlling the system during the test mode can start from a known condition.