Abstract: A hyperspectral imaging method includes: providing time-domain synchronous mid-infrared ultrashort pulse and near-infrared ultrashort pulse as pump light and signal light, respectively; subjecting the signal light to optical time-stretching to broaden a pulse width of the signal light; directing the time-stretched signal light to a target sample to be detected; directing the pump light to a time delayer to adjust the time when the pump light reaches a silicon-based camera; spatially combining the time-stretched signal light from the target sample with the pump light from the time delayer; directing combined light to a silicon-based camera where the signal light is detected through non-degenerate two-photon absorption of the signal light under the action of the pump light to acquire hyperspectral imaging data; and obtaining an image of the target sample based on the hyperspectral imaging data.

Abstract: Provided is a method for preparing a graphene material from an industrial hemp material by laser induction, which uses a skin, a stem and/or a root of industrial hemp as a carbon precursor-containing material and reduce the carbon precursor-containing material into graphene by laser induction, so as to prepare graphene, graphene quantum dots, a graphene mesoporous material and a graphene composite material.

Abstract: The present invention encompasses a diagnostic test and method to authenticate the veracity of a vaccine. The diagnostic test and method are especially useful in a specific and sensitive immunochromatographic assay, performable within about 15 minutes for the authentication, validation, and veracity of a vaccine, such as a COVID-19 vaccine, in a vial prior to administration to a human.

Abstract: In one aspect, a shoe component is described. The shoe component comprises a body of continuous fabric having at least a first zone and a second zone. The first zone of the fabric has a first modulus of elasticity and the second zone of the fabric has a second modulus of elasticity that is different than the first modulus of elasticity. More than two zones can be provided per shoe component, in some cases.

Abstract: A bicomponent fiber comprises a core component formed from a rate-sensitive material; and a sheath component surrounding the core component, the sheath component being formed from a non-rate-sensitive polymer.

Abstract: The invention relates to a continuous-flow synthesis process for the preparation of high quality indium phosphide/zinc sulfide core/shell semiconduting nanocrystals in particular quantum dots (QD) conducted in a micro-reaction system comprising at least one mixing chamber connected to one reaction chamber.

Abstract: A magnetic recording head includes a write pole having alternating layers of Fe and Co and a return pole magnetically coupled to the write pole. The layers of Fe may have a thickness from about 1.0 angstroms to about 40.0 angstroms and the layers of Co may have a thickness from about 1.0 angstroms to about 20.0 angstroms. The write pole may have a saturation magnetization greater than about 2.45 Tesla. A method for forming a write pole for a magnetic recording head is also disclosed.

Abstract: In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and good adhesion to both the substrate and the device attached thereto.

Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

Abstract: In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparation of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the thixotropic nature thereof, and the like.

Abstract: In accordance with the present invention, there are provided novel propargyl ether-based compositions that are very effective when used in underfill applications. Aromatic propargyl ether compounds are believed to represent the most robust resin chemistry currently available to meet the many performance requirements associated with underfill applications. Propargyl ether resins are hydrophobic, hydrolytically stable, low toxicity monomers that can be cured to high T.sub.g, thermally stable thermosets. Liquid propargyl ether monomers have been found and/or described in the literature which can be used alone or in combination to yield diluent free underfill compositions. Alternatively, mixtures of two or more propargyl ether monomers (wherein one or more of these monomers may be solids at room temperature) can be used to create diluent-free, room temperature stable, eutectic or peritectic liquid resin compositions.

Abstract: A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.

Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

Abstract: A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The present invention also contemplates a unique, essentially resin-free organic system that utilizes the novel glass composition described above and has a ratio of silver to glass (solids) of from about 3 to 1 to about 8 to 1.

Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid monomer vehicle comprising at least two monomers wherein at least one monomer is a polycyanate ester monomer, electrically conductive filler, and a curing catalyst. Compositions of the invention remain homogeneous at room temperature for at least eight hours.

Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler, and a curing catalyst, in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes.

Abstract: An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.

Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.