Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.

Abstract: A manually operable apparatus for selectively assembling chips to substrates comprises a support base having a first support for supporting a substrate preparatory to attachment of a chip thereto, second support for supporting a chip preparatory to selection for attachment to a substrate, a manually operable swing arm assembly mounted on the support base and having a first arm for placement of an adhesive paste to a surface of a substrate on the first support and a second arm for selecting and placing a chip on the substrate.

Abstract: A connector assembly for connecting to a chip and a substrate for testing the bond between a chip and a substrate in a testing apparatus, the connector assembly comprises a pair of connector blocks, each block having a generally square planar connecting face for bonding to oppositely directed faces of a chip and substrate, and a coupling end for mounting in a tensile testing machine, and a swivel connector assembly for connecting to the coupling and mounting in a tensile testing machine for the application of aligned tension to the chip and substrate.

Abstract: An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.

Abstract: An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.

Abstract: Improved soldering paste for surface mounting of electronic components comprises a novel fluxing agent selected from formylated polyhydric compounds. The paste enables circuit boards to be washed with water to remove flux residues.

Abstract: Improved soldering paste for the surface mounting of electronic components comprises a novel fluxing agent selected from quaternary ammonium hydroxides and mixtures thereof. Use of these agents as fluxes eliminates the problem of ionic residues on circuit boards and permits the boards to be washed with water to remove any non-ionic residues.

Abstract: Glass frit and silver particles are combined with a vehicle gel comprising a cross-linked resin dispersed in an organic solvent. The resin comprises a polymerized monomer selected from a first group consisting of C.sub.1 to C.sub.4 alkyl methacrylates and mixtures thereof and from a second group consisting of glycol dimethacrylates and mixtures thereof. The paste may consist of 60 to 80 weight percent silver particles, 12 to 20 weight percent glass frit and 8 to 20 weight percent vehicle gel. The resin content of the vehicle gel may be one to ten weight percent.

Abstract: A silver glass paste consists of 60-75% silver flake having a tap density greater than 2.8 gm/cc and less than 5.0 gm/cc. The silver flake has a poly-modal flake size distribution. The paste further consists of 12-20% glass frit, 0.5-2% of a suitable organic resin and 8-20% of a suitable organic solvent. The resin may be acrylic and the organic solvent may be an ester alcohol or an ester alcohol mixed with a glycol ether or glycol ether ester.

Abstract: Silver flake and lead borate glass frit are suspended in a liquid organic vehicle of resin and solvent. The silver flakes are present in two different size ranges. The plate is applied between the silicon die and the substrate and is oven fired to provide a bond that accommodates the different coefficients of thermal expansion of the silicon and ceramic substrate. The smaller silver particles improve the sintering of the silver and glass and thereby increase the bond strength while the larger silver particles minimize undersirable shrinkage and cracking of the resultant bond. Silver oxide particles or a special solvent mixture are also used in the paste.