Abstract: A debris collection and metrology system for collecting and analyzing debris from a tip used in nanomachining processes, the system including an irradiation source, an irradiation detector, an actuator, and a controller. The irradiation source is operable to direct incident irradiation onto the tip, and the irradiation detector is operable to receive a sample irradiation from the tip, the sample irradiation being generated as a result of the direct incident irradiation being applied onto the tip. The controller is operatively coupled to an actuator system and the irradiation detector, and the controller is operable to receive a first signal based on a first response of the irradiation detector to the sample irradiation, and the controller is operable to effect relative motion between the tip and at least one of the irradiation source and the irradiation detector based on the first signal.

Abstract: A debris collection and metrology system for collecting and analyzing debris from a tip used in nanomachining processes, the system including an irradiation source, an irradiation detector, an actuator, and a controller. The irradiation source is operable to direct incident irradiation onto the tip, and the irradiation detector is operable to receive a sample irradiation from the tip, the sample irradiation being generated as a result of the direct incident irradiation being applied onto the tip. The controller is operatively coupled to an actuator system and the irradiation detector, and the controller is operable to receive a first signal based on a first response of the irradiation detector to the sample irradiation, and the controller is operable to effect relative motion between the tip and at least one of the irradiation source and the irradiation detector based on the first signal.

Abstract: A method and apparatus for removing a pellicle from a photomask wherein the adhesive between the pellicle frame and photomask is cooled sufficiently to allow the adhesive property of the adhesive to diminish to the point where the adhesive will release from the photomask with little or no mechanical force and leaving minimal adhesive on the photomask. The adhesive is cooled by way of manifolds containing coolant being brought in contact with the pellicle frame or by way of a coolant spray nozzles spraying coolant directly onto the pellicle frame.

Abstract: A method and apparatus for removing a pellicle from a photomask wherein the adhesive between the pellicle frame and photomask is cooled sufficiently to allow the adhesive property of the adhesive to diminish to the point where the adhesive will release from the photomask with little or no mechanical force and leaving minimal adhesive on the photomask. The adhesive is cooled by way of manifolds containing coolant being brought in contact with the pellicle frame or by way of a coolant spray nozzles spraying coolant directly onto the pellicle frame.

Abstract: A photomask includes at least one feature disposed thereon. The at least one feature has an associated design location, where a distance between a location of the at least one feature and the associated design location defines a positional error of the at least one feature. A method for improving a performance characteristic of the photomask includes directing electromagnetic radiation toward the photomask, the electromagnetic radiation having a wavelength that substantially coincides with a high absorption coefficient of the photomask; generating a thermal energy increase in the photomask through incidence of the electromagnetic radiation thereon; and decreasing the positional error as a result of the generating the thermal energy increase in the photomask.

Abstract: A photomask includes at least one feature disposed thereon. The at least one feature has an associated design location, where a distance between a location of the at least one feature and the associated design location defines a positional error of the at least one feature. A method for improving a performance characteristic of the photomask includes directing electromagnetic radiation toward the photomask, the electromagnetic radiation having a wavelength that substantially coincides with a high absorption coefficient of the photomask; generating a thermal energy increase in the photomask through incidence of the electromagnetic radiation thereon; and decreasing the positional error as a result of the generating the thermal energy increase in the photomask.

Abstract: A system for removing debris from a surface of a photolithographic mask is provided. The system includes an atomic force microscope with a tip supported by a cantilever. The tip includes a surface and a nanometer-scaled coating disposed thereon. The coating has a surface energy lower than the surface energy of the photolithographic mask.

Abstract: A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.

Abstract: A method for fabricating high aspect ratio nanostructures is provided. The method uses a nanomachining tip of an atomic force microscope to create an orthogonal series of isolated cuts that define a grid of high aspect ratio nanostructures in a work area on a substrate. Additional material can then be removed to smooth out at least one of the nanostructures in the work area.

Abstract: A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.

Abstract: A method for fabricating high aspect ratio nanostructures is provided. The method uses a nanomachining tip of an atomic force microscope to create an orthogonal series of isolated cuts that define a grid of high aspect ratio nanostructures in a work area on a substrate. Additional material can then be removed to smooth out at least one of the nanostructures in the work area.

Abstract: This invention provides the user the ability to accurately nanomachine surfaces with reduced tip induced errors. Nanomaching has two types of errors, a first type of error is brought about by the tip's shape and its aspect ratio. A second type of error due to the tip's deflection as it works the material. Therefore, embodiments of the present invention minimizes tip deflection errors allowing allow high aspect Nano-bits to reliably and accurately nanomachine small high aspect three dimensional structures to repair and rejuvenate photomasks.

Abstract: This invention provides the user the ability to accurately nanomachine surfaces with reduced tip induced errors. Nanomaching has two types of errors, a first type of error is brought about by the tip's shape and its aspect ratio. A second type of error due to the tip's deflection as it works the material.

Abstract: A scan data collection operation includes performing a scanning operation using a scan path that includes a directional component that is additional to a data collection directional component. The collected scan data is mapped to another set of locations, thus allowing for detection of surface features using fewer scans.

Abstract: A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material.

Abstract: A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material.

Abstract: A scan data collection operation includes performing a scanning operation using a scan path that includes a directional component that is additional to a data collection directional component. The collected scan data is mapped to another set of locations, thus allowing for detection of surface features using fewer scans.

Abstract: A scan data collection operation includes performing a scanning operation using a scan path that includes a directional component that is additional to a data collection directional component. The collected scan data is mapped to another set of locations, thus allowing for detection of surface features using fewer scans.