Abstract: A plurality of FPGA dice is disposed upon a semiconductor substrate. In order both to connect thousands of signal interconnect lines between the plurality of FPGA dice and to supply the immense power required, it is desired that the substrate construction include two different portions, each manufactured using incompatible processes. The first portion is a signal interconnect structure containing a thin conductor layers portion characterized as having a plurality of thin, fine-pitch conductors. The second portion is a power connection structure that includes thick conductors and vertical through-holes. The through-holes contain conductive material and supply power to the FPGA dice from power bus bars located at the other side of the semiconductor substrate. The portions are joined at the wafer level by polishing the wafer surfaces within a few atoms of flatness and subsequent cleaning. The portions are then fusion bonded together or combined using an adhesive material.

Abstract: Kappa opioid receptor antagonists are provided that yield significant improvements in functional binding assays to kappa opioid receptors, and the use of these antagonists in treatment of disease states that are ameliorated by binding of the kappa opioid receptor such as heroin or cocaine addictions.

Abstract: An electrostatic actuator having a base including a first electrode and a flexible membrane including at least two material layers of different materials in contact with each other. At least one of the material layers includes a second electrode electrically isolated from the first electrode. The flexible membrane includes a fixed end connected to the base and a free end opposite the fixed end and spaced apart from the base. The second electrode has at least first and second portions separated by a third portion and in combination defining a first and second step provided in a vicinity of the fixed end.

Abstract: Hexahydroindenopyridine compounds are provided which act as spermicides and/or fungicides, spermicidal and/or fungicidal compositions containing the same, and methods for killing motile sperm and/or fungi using the compounds and compositions.

Abstract: Compounds are provided having agonistic activity against G protein-coupled receptor 35 (GPR35). The compounds are useful for providing antinociception, providing neuroprotection in case of stroke or ischemia, or treating gastric inflammation.

Abstract: Kappa opioid receptor antagonists are provided that yield significant improvements in functional binding assays to kappa opioid receptors, and the use of these antagonists in treatment of disease states that are ameliorated by binding of the kappa opioid receptor such as heroin or cocaine addictions.

Abstract: The present invention relates to an optical scanning apparatus and an optical scanning system The optical system includes an optical engine connected to an optical scanning probe The optical scanning probe images a sample at different lateral positions of the sample The optical scanning probe includes a housing having a longitudinal axis extending in a direction towards a sample to be scanned, a first base having a first moveable mirror supported thereon by a first cantilever connecting the first moveable mirror to the first base, a second base having a second moveable mirror supported thereon by a second cantilever connecting the second moveable mirror to the second base, and a support attaching the first and second bases so that the first moveable mirror and the second moveable mirror are disposed along the longitudinal axis apart from each other

Abstract: A plurality of FPGA dice is disposed upon a semiconductor substrate. In order to supply the immense power required by the plurality of FPGA dice, power is routed through the semiconductor substrate vertically from thick metal layers and large integral metal structures located on the other side of the semiconductor substrate. Because the semiconductor substrate has a different coefficient of thermal linear expansion than metal layers in contact with the substrate, delamination may occur when the structure is subject to changes in temperature. To prevent delamination of metal layers connected to the semiconductor substrate and in electrical contact with the integral metal structures, the integral metal structures are manufactured with an array of post portions. During changes in temperature, the post portions of the integral metal structures bend and slide relative to metal layers connected to the semiconductor substrate and prevent linear stresses that may otherwise cause delamination.

Abstract: A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substrate and the second substrate an entrance through-hole extending through a thickness of the first substrate or the second substrate, forms in at least one of the first substrate and the second substrate an exit through-hole extending through a thickness of the first substrate or the second substrate, forms respective bonding elements on at least one of the first and second substrates, and bonds the first and second substrates at the respective bonding elements to form a seal between the first and second substrates and to form a first coolant channel in between the first and second substrates.

Abstract: A chemical sensor and a system and method for sensing a chemical species. The chemical sensor includes a plurality of nanofibers whose electrical impedance varies upon exposure to the chemical species, a substrate supporting and electrically isolating the fibers, and a set of electrodes connected to the plurality of fibers at spatially separated points to permit the electrical impedance of the plurality of fibers to be measured. The system includes the chemical sensor, an impedance measuring device coupled to the electrodes and configured to determine an electrical impedance of the plurality of fibers, and an analyzer configured to identify the chemical species based on a change in the electrical impedance. The method measures at least one change in an electrical impedance between spatially separated electrodes, and identifies the chemical species based on the measured change in the electrical impedance.

Abstract: A stimulated lighting device for stimulatable light emission including a luminescent sheet including light stimulatable particles which emit secondary light upon receiving primary light. The lighting device includes a source configured to generate and direct the primary light obliquely onto the luminescent sheet, at least one reflector configured to reflect at least a part of the primary light and a part of the secondary light onto the luminescent sheet and configured to reflect at least a part of scattered primary light and a part of the secondary light from the luminescent sheet toward the light exit, and a light exit configured to emanate light as a combination of the primary light and the secondary light.

Abstract: Apparatus and method for producing fibrous materials in which the apparatus includes an enclosure having an inlet configured to receive a substance from which the fibrous materials are to be composed, a common electrode disposed in the enclosure, and plural extrusion elements provided in a wall of the enclosure opposite the common electrode so as to define between the plural extrusion elements and the common electrode a space in communication with the inlet to receive the substance in the space. In the method, a substance from which the fibrous materials are to be composed is fed to the enclosure having the plural extrusion elements, a common electric field is applied to the extrusion elements in a direction in which the substance is to be extruded, the substance is extruded through the extrusion elements to tips of the extrusion elements, and the substance is electrosprayed from the tips to form the fibrous materials.

Abstract: A three-dimensional interconnect includes a first substrate bonded to a second substrate, the first substrate including a device layer and a bulk semiconductor layer, a metal pad disposed on the second substrate, an electrically insulating layer disposed between the first and second substrates. The structure has a via-hole extending through the device layer, the bulk semi-conductor layer and the electrically insulating layer to the metal pad on the second substrate. The structure has a dielectric coating on a sidewall of the via-hole, and a plasma-treated region of the metal pad disposed on the second substrate. The structure includes a via metal monolithically extending from the plasma-treated region of the metal pad through the via-hole and electrically interconnecting the device layer of the first substrate to the metal pad of the second substrate.

Abstract: A chemical sensor and a system and method for sensing a chemical species. The chemical sensor includes a plurality of nanofibers whose electrical impedance varies upon exposure to the chemical species, a substrate supporting and electrically isolating the fibers, and a set of electrodes connected to the plurality of fibers at spatially separated points to permit the electrical impedance of the plurality of fibers to be measured. The system includes the chemical sensor, an impedance measuring device coupled to the electrodes and configured to determine an electrical impedance of the plurality of fibers, and an analyzer configured to identify the chemical species based on a change in the electrical impedance. The method measures at least one change in an electrical impedance between spatially separated electrodes connected to a plurality of fibers upon exposure of the fibers to the chemical species, and identifies the chemical species based on the measured change in the electrical impedance.

Abstract: Apparatus and method for producing fibrous materials in which the apparatus includes an electrospinning element configured to electrospin a substance from which the fibers are to be composed by an electric field extraction of the substance from a tip of the electrospinning element, a collector disposed from the electrospinning element and configured to collect the fibers, a chamber enclosing the collector and the electrospinning element, and a control mechanism configured to control a gaseous environment in which the fibers are to be electrospun.

Abstract: Kappa opioid receptor antagonists are provided that yield significant improvements in functional binding assays to kappa opioid receptors, and the use of these antagonists in treatment of disease states that are ameliorated by binding of the kappa opioid receptor such as heroin or cocaine addictions.

Abstract: A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one of the first and second substrates including at least one circuit element, an entrance through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, an exit through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, a bonding element forming a seal between the first and second substrates and forming a space between the first and second substrate, and a coolant channel formed in the space between the first and second substrates such that a fluid entering the entrance through-hole transits the coolant channel and the exit through-hole to provide cooling to the circuit element.

Abstract: An electronic package and methods by which the package reduces thermal fatigue failure of conductors in the electronic package. The electronic package includes a carrier substrate having first and second surfaces and a plurality of anchor vias having a via material extending from the first surface toward the second surface. The electronic package includes a first conducting layer having a length and a width extending laterally in two dimensions across a major part of the first surface of the carrier substrate. The anchor vias have plural attachments along the length and the width of the first conducting layer to secure the first conducting layer to the carrier substrate.

Abstract: A structure and method for transferring electronic charge or heat or light between substrates. The structure includes first and second substrates separated from one another and a plurality of localized spacers connecting the first and second substrates together. At least one of the localized spacers having a lateral dimension less than 350 nm. A sub-micron separation distance between the first and second substrates is configured to provide carrier tunneling or to provide heat transfer or light transfer between the first and second substrates. The method provides charge carriers or heat or light to a first substrate. The first substrate is separated from a second substrate by at least one localized spacer having a lateral dimension less than 350 nm and tunnels the charge carriers or couples the heat or couples light from the first substrate to the second substrate across a sub-micron gap between the first and second substrates formed by the at least one localized spacer.

Abstract: An apparatus includes a volume of insulator disposed over a top surface of a semiconductor substrate, a tube of soft dielectric, and a metal conductor. The insulator has a hardness of more than approximately three gigapascals (gPa) and the soft dielectric has a hardness of less than three gPa. The tube of soft dielectric and the metal conductor are both embedded within the volume of insulator. The tube defines a central volume and the metal conductor extends in a direction through the central volume for a distance of at least one inch. The metal conductor is encircled by the soft dielectric when the apparatus is viewed in a cross-sectional plane perpendicular to the direction. The metal conductor may include a plurality of bend portions. The metal conductor does not break when the apparatus is temperature cycled over a range from zero to eighty five degrees Celsius.