Patents Assigned to Rheem Manufacturing Company
  • Publication number: 20230375228
    Abstract: The disclosed technology includes a tankless liquid heater system for detecting buildup on a heating element, including: a chamber; at least one heating element to heat liquid in the chamber; at least one sensor to detect data associated with identifying buildup on the at least one heating element; and at least one device to: receive the data detected by the at least one sensor; determine, based on the data, an amount of the buildup on the at least one heating element; and adjust an operation of the at least one heating element based on the amount of the buildup on the at least one heating element.
    Type: Application
    Filed: May 22, 2023
    Publication date: November 23, 2023
    Applicant: Rheem Manufacturing Company
    Inventors: Christopher Mark Hayden, Harsha Satyanarayana, Sean Nolan, Divakar Mantha, Eric Jurczyszak, Sergiu Mihu
  • Patent number: 11821662
    Abstract: The disclosed technology includes a heat pump having a thermal energy storage (TES) material. The heat pump can include a first heat exchanger to exchange heat between ambient air and refrigerant, a second heat exchanger to exchange heat between the refrigerant and air supplied to a climate-controlled space, and a third heat exchanger to exchange heat between the TES material and the refrigerant in a first fluid path and the refrigerant in a second fluid path. The heat pump can include a first compressor to circulate refrigerant to the first, second, and third heat exchangers and a second compressor to circulate refrigerant to the second and third heat exchangers. The first compressor can facilitate heat exchange between the ambient air and the TES material and the second compressor can facilitate heat exchange between the TES material and the air supplied to the climate-controlled space.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 21, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Patent number: 11821658
    Abstract: A water heater and a cover assembly for the water heater is provided. The water heater includes a mixing valve disposed in fluid communication with each of a hot water conduit and a cold water pipe, to regulate temperature of hot water received from the hot water conduit. The cold water pipe branches from a cold water conduit and extends along a longitudinal axis of the tank to connect with the mixing valve. The cover assembly is mounted on a tank of the water heater. The cover assembly includes a first cover to conceal the cold water pipe, and a second cover to conceal the mixing valve and the hot water conduit extending between the tank and the mixing valve. The second cover is removably coupled to the first cover via one or more coupling elements.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 21, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Piyush Porwal, Miguel Ubaldo, Tobey Fowler, Damian Weitherspoon
  • Patent number: 11815298
    Abstract: A combination water heating, air conditioning refrigerant system is described. The combined system includes a plurality of independently adjustable electronic expansion valves. The expansion valves can independently modulate the delivery of high-temperature, high-pressure refrigerant to either a water heat exchanger or an outside condenser. A controller can receive input signals, including temperature signals from one or more temperature sensors that indicate the temperature at various locations of the system. The temperature signals include one or more of water temperature signals, ambient air temperature signals, or refrigerant super heat temperatures signals. In response to the input signals, the controller can output control signals to one or more of the plurality of electronic expansion valves.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: November 14, 2023
    Assignee: Rheem Manufacturing Company
    Inventor: Robert L. Long
  • Patent number: 11808530
    Abstract: The present disclosure provides a louvered fin including a leading edge, a trailing edge, and a surface extending between the leading edge and the trailing edge. The surface defines a first set of holes along a first axis, a second set of holes along a second axis and offset from the first set of holes, and a third set of holes along a third axis and offset from the second set of holes. Each of the first axis, the second axis, and the third axis extends substantially parallel to a longitudinal axis of the fin. A first offset distance between the second and first set of holes is greater than a second offset distance between the third and second set of holes. The second and the third set of holes define a substantially obtuse trapezoidal matrix.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: November 7, 2023
    Assignee: Rheem Manufacturing Company
    Inventor: Kevin Mercer
  • Patent number: 11808494
    Abstract: The disclosed technology includes devices, systems, and methods for heat pump systems configured to operate in low ambient temperatures. The disclosed technology can include a heat pump water heater system having an evaporator, a first compressor configured to compress refrigerant to a first pressure, and a second compressor configured to compress the refrigerant to a second pressure. The second pressure can be greater than the first pressure. The heat pump water heater system can include a preheater configured to receive the refrigerant at the first pressure and heat water and a condenser configured to receive the refrigerant at the second pressure and heat water. The water can be passed through the preheater before being passed through the condenser.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 7, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Patent number: 11795717
    Abstract: Disclosed herein are fluid chemistry systems comprising fluid chemistry manifolds. The fluid chemistry manifolds can comprise an inlet, two flow paths in fluid communication with the inlet, one or more probe apertures, and an outlet in fluid communication with the two flow paths. The one or more probe apertures can be configured to receive at least a portion of a corresponding fluid chemistry probe. The probe can be configured to detachably attach to the one or more probe apertures and fluidly communicate with the flow path. The probe can include one or more of a pH sensor, an oxidation reduction potential (ORP) sensor, and a total dissolved solids (TDS) sensor. The systems can also comprise an adjustable valve configured to selectively permit a predetermined amount of fluid flow through the at least one of the two flow paths.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: October 24, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Jorge Miguel Gamboa Revilla, Sergio Montalgo Salazar, Satya Kiran Gullapalli, Kaela Malaki
  • Patent number: 11788769
    Abstract: The disclosed technology includes an on-demand water heater which uses a heat pump to heat the fluid. The on-demand heat pump water heater can have a low fluid capacity heating chamber which has an inlet and an outlet, a heat pump for heating the fluid, and a controller to control the heat pump and maintain the temperature of the fluid at a predetermined temperature. The on-demand heat pump water heater can include one or more temperature sensors, flow sensors, fluid mixing valves, or supplemental heat sources.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: October 17, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Jozef Boros, Christopher M. Hayden
  • Patent number: 11781760
    Abstract: The disclosed technology includes an integrated system including a space conditioning system, a liquid heating system, and a controller. The space conditioning system can include a refrigerant circuit fluidly connecting a compressor, a first heat exchanger, a second heat exchanger, a third heat exchanger, an expansion valve, and a reversing valve such that refrigerant can flow through the circuit. The liquid heating system can include a liquid heating device and a liquid circuit configured to direct liquid from the liquid heating device through the first heat exchanger. The controller can be in electrical communication with the space conditioning system and the liquid heating system. The controller can be configured to determine a demand of the space conditioning system and the liquid heating system, and in response, output instructions to a plurality of valves to direct the refrigerant through the refrigerant circuit and direct the liquid through the liquid circuit.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: October 10, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Baojie Mu, Sivakumar Gopalnarayanan
  • Patent number: 11774179
    Abstract: A tube for a thermal transfer device can include at least one wall having an inner surface and an outer surface, where the inner surface forms a cavity. The inner surface can be non-cylindrical. The cavity can be configured to receive a fluid that flows continuously along a length of the at least one wall.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 3, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Reza Khatami, Qian Zhang, Troy E. Trant, Tanjir Hasan Ratul
  • Patent number: 11774140
    Abstract: A heating unit for heating fluid is described having at least one electrical resistance heating element on an outer surface of a tube. At least one indexed groove is provided around a surface of the tube allowing for at least one retention clip to hold the electrical resistance heating element. A heating chamber is also provided to enclose a portion of the tube and to provide a flow channel therebetween. The heating chamber includes an optical sensor to detect overheating of the at least one electrical resistance heating element. Fluid is heated by flowing over the surface of the at least one electrical resistance heating element and through the tube.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: October 3, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Christopher M. Hayden, Eric R. Jurczyszak, Jeff Hankins
  • Patent number: 11761641
    Abstract: Disclosed herein are heat pump systems for water heaters. The heat pump systems can comprise a housing defining an interior chamber, an air inlet, and an air outlet. The air inlet and the air outlet can form an air flow path through the interior chamber, and an evaporator unit can be positioned within the interior chamber such that the air flow path contacts the evaporator unit. The housing can also have a flue pipe having a cross-section to encourage aerodynamic flow and/or side baffles to encourage air flow into the evaporator unit. The housing can also have a second air inlet to increase air flow and a curved elbow around the first air inlet to direct the air flow path. The air flow path can flow from a top side of the housing to a side of the housing, and the air flow path can be reversible.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: September 19, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Vishwanath Ardha, Saman Beyhaghi, Hongchu Chen, David Gibbons, Prudhvi Vishnu vardhan Amaravadhi
  • Patent number: 11761672
    Abstract: An exemplary embodiment of the present disclosure provides a localized heating, ventilation, or air conditioning (HVAC) system comprising a moveable air delivery system comprising. The moveable air delivery system further comprising an air inlet configured to receive air and an air outlet configured to output the air into a space. The localized HVAC further comprising a movement system configured to move the air outlet in a generally planar manner. The movement system further comprising an air delivery support system configured to support the air outlet, the air delivery support system configured to move the air outlet in an air delivery plane.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: September 19, 2023
    Assignee: Rheem Manufacturing Company
    Inventor: Ankit Goyal
  • Patent number: 11761698
    Abstract: A defrost cycle control assembly includes a first sensor that is configured to measure a temperature adjacent a top portion of an outdoor heat exchanger of a heat pump, a second sensor that is configured to measure a temperature adjacent a bottom portion of the outdoor heat exchanger, and a third sensor that is configured to measure an ambient temperature. Further, the defrost cycle control assembly includes a controller that is configured to initiate a defrost cycle of the heat pump based on the temperature adjacent the top portion and the ambient temperature when said temperatures indicate formation of frost at the top portion of the outdoor heat exchanger where the first sensor is disposed. The controller is configured to terminate the defrost cycle when the temperature at the bottom portion reaches a termination temperature which indicates that the frost on the outdoor heat exchanger has melted.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 19, 2023
    Assignee: RHEEM MANUFACTURING COMPANY
    Inventors: Aniket R. Kalambe, Walter R. Lowrimore, Neil D. Hurt, Michael Andrews, Randy Foster
  • Patent number: 11761693
    Abstract: Embodiments include heat pump systems with gas bypasses and related methods. In one embodiment, a system may include a gas bypass tank having a bypass inlet, a liquid outlet, and a vapor outlet, and a first splitting valve having a first splitter outlet in fluid communication with the bypass inlet, a first splitter inlet in fluid communication with the liquid outlet, and a first switching path configured to switch between a first conduit path in fluid communication with a first coil system and a second conduit path in fluid communication with a second coil system.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: September 19, 2023
    Assignee: RHEEM MANUFACTURING COMPANY
    Inventor: Yang Zou
  • Patent number: 11754318
    Abstract: A baffle for a thermal transfer device can include a body having a multiple first apertures that traverse therethrough, where each first aperture has a first outer perimeter that includes a first base shape and at least one first protrusion extending from the first base shape. Each of the first apertures is configured to receive a tube. The first base shape of each first aperture has a first shape and a first size that is configured to be substantially the same as the first shape and the first size of an end of a tube.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: September 12, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Bruce Hotton, Amin Monfared, Lee Chambers, Babak Bagheri, Arash Jafari, Tim Shellenberger
  • Patent number: 11747042
    Abstract: A heating system of a managed fluid system can include a heat exchanger and a first temperature sensor device that measures an inlet temperature of a fluid flowing into the heat exchanger. The heating system can also include a second temperature sensor device that measures an outlet temperature of the fluid flowing out of the heat exchanger. The heating system can further include a controller communicably coupled to the first temperature sensor device and the second temperature sensor device. The controller can receive inlet temperature measurements made by the first temperature sensor device and outlet temperature measurements made by the second temperature sensor device. The controller can also evaluate the inlet temperature measurements and the outlet temperature measurements using at least one lookup table and at least one algorithm. The controller can subsequently determine an input rate of fuel used to heat the fluid flowing through the heat exchanger.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 5, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Juan Carlos Montanez, Jorge Miguel Gamboa
  • Patent number: 11747058
    Abstract: Air recirculation systems for heat pumps are disclosed. The air recirculation systems include a heat pump subsystem and a recirculation subsystem. The recirculation subsystem can include one or more arms that direct cool, dehumidified air flowing from the heat pump subsystems back to air inlets. The recirculation subsystems can transition from open to closed configurations either manually or via motors. The air recirculation systems can include a controller that outputs a control signal to the motors to open or close the recirculation subsystems. The control signals can be based on temperature data, current data, and the like.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: September 5, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Piyush Porwal, Alex Williams, Tobey Fowler
  • Patent number: 11747012
    Abstract: The disclosed technology includes a controller configured to control an output of one or more boilers to reduce temperature overshoot of the boiler system. The controller can receive temperature data, a threshold temperature value, and a maximum temperature value, and determine whether the temperature of the water in the boiler system is greater than or equal to a threshold temperature. The controller can also determine a number of operating boilers that were operating when the threshold temperature was reached and determine a temperature increment value based on the threshold temperature, the maximum temperature, and the number of operating boilers. The controller can output a control signal to a boiler to reduce an output of the boiler based on the temperature increment value and the temperature data to reduce overshoot of the boiler system.
    Type: Grant
    Filed: December 31, 2022
    Date of Patent: September 5, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Hiram Osuna Carrasco, Jorge Miguel Gamboa Revilla
  • Patent number: D1005464
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: November 21, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: H. Gene Havard, Jr., Michael Franklin, Hamid Ouabdenbi, Hari Kanagala, John R. Jones, Shawn Allan Reed, Daniel Ryan Schmalz