Patents Assigned to S, Inc.
  • Patent number: 10991689
    Abstract: A method includes forming a first region including a pair of first FinFETs and a second region including a pair of second FinFETs on a substrate. Each FinFET includes a metal gate having a first spacer adjacent thereto, and each first FinFET has a gate dielectric that is thicker than a gate dielectric of each second FinFET, such that the first FinFETs can be higher voltage input/output devices. The method forms a first contact between the metal gates of the pair of first FinFETs with a second spacer thereabout, the second spacer contacting a portion of each first spacer. The second spacer thus has a portion extending parallel to the metal gates, and a portion extending perpendicular to the metal gates. A second contact is formed between the metal gates of the pair of second FinFETs, and the second contact devoid of the second spacer.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: April 27, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Abu Naser M. Zainuddin, Christopher D. Sheraw, Sangameshwar Rao Saudari, Wei Ma, Kai Zhao, Bala S Haran
  • Patent number: 10989876
    Abstract: Optical coupler structures include a waveguide having waveguide metamaterial segments aligned along a first line. A second insulator is on the first insulator and the waveguide metamaterial segments. A coupler structure is in the second insulator and has coupler metamaterial segments aligned along a second line. The first line and the second line are parallel and within a plane. A portion of the waveguide overlaps a portion of the coupler structure. The waveguide metamaterial segments intersect the plane and have first widths perpendicular to the plane, and the first widths have a first taper along the first line. The coupler metamaterial segments intersect the plane and have second widths in the direction perpendicular to the plane. The second widths have a second taper along the second line that is different from the first taper of the first widths where the waveguide overlaps the second coupler structure.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 27, 2021
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Bo Peng, Ajey Poovannummoottil Jacob, Yusheng Bian
  • Publication number: 20210115341
    Abstract: The present invention pertains to improved processes and catalysts for aromatization. The processes generally contacting a feed stream comprising a naphtha fraction having a C6 to C8 content with a catalyst pellet composition to form aromatic hydrocarbons. The catalyst pellet composition generally comprises a plurality of cylindrical pellets each pellet comprising a Group VIII metal on a zeolite. The pellets may have (a) a plurality of holes passing through the length of the cylindrical pellets, (b) a dome-shaped top and bottom, and (c) a plurality of semi-circular grooves along the length of the exterior of the cylinder.
    Type: Application
    Filed: October 21, 2020
    Publication date: April 22, 2021
    Applicant: CHEVRON U.S.A. INC.
    Inventor: Vijay R. Sampath
  • Publication number: 20210118796
    Abstract: Disclosed are embodiments of a back end of the line (BEOL) metal structure that includes, within a metal level, a metal via, which has at least eight sides and all interior angles at 135° or more, and a metal wire thereon. The metal wire and via include respective portions of a continuous conformal metal layer. A passivation layer coats the top surface of the metal layer. The metal via and the metal wire thereon can be in an upper metal level and can be made of one metal (e.g., aluminum or an aluminum alloy). The upper metal level can be above a lower metal level that similarly includes a metal via and metal wire thereon, but the metal used can be different (e.g., copper) and/or the shape of the via can be different (e.g., four-sided). Also disclosed herein are method embodiments for forming the above-described BEOL metal structure.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 22, 2021
    Applicant: GLOBALFOUNDRIES U.S. INC.
    Inventors: Dirk Breuer, Oliver M. Witnik, Carla Byloos, Holger S. Schuehrer
  • Patent number: 10986723
    Abstract: The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: April 20, 2021
    Assignee: INGERSOLL-RAND INDUSTRIAL U.S., INC.
    Inventors: Joshua O. Johnson, Vairavasundaram Swaminathan, Justin T. Chellew
  • Patent number: 10983412
    Abstract: Structures including a photodetector and methods of fabricating such structures. A substrate, which is composed of a semiconductor material, includes a first trench, a second trench, and a pillar of the semiconductor material that is laterally positioned between the first trench and the second trench. A first portion of a dielectric layer is located in the first trench and a second portion of the dielectric layer is located in the second trench. A waveguide core is coupled to the pillar at a top surface of the substrate.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: April 20, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Vibhor Jain, Siva P. Adusumilli, John J. Ellis-Monaghan
  • Patent number: 10984590
    Abstract: Data in physical space may be converted to layer space before performing modeling to generate one or more subsurface representations. Computational stratigraphy model representations that define subsurface configurations as a function of depth in the physical space may be converted to the layer space so that the subsurface configurations are defined as a function of layers. Conditioning information that defines conditioning characteristics as the function of depth in the physical space may be converted to the layer space so that the conditioning characteristics are defined as the function of layers. Modeling may be performed in the layer space to generate subsurface representations within layer space, and the subsurface representations may be converted into the physical space.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 20, 2021
    Assignee: Chevron U.S.A. Inc.
    Inventors: Lewis Li, Tao Sun, Sebastien B. Strebelle
  • Patent number: 10985244
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to n-well resistors and methods of manufacture. The structure includes: a substrate composed of a N-well implant region and a deep N-well implant region; and a plurality of shallow trench isolation regions extending into both the N-well implant region and a deep N-well implant region.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: April 20, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Shesh Mani Pandey, Chung Foong Tan, Baofu Zhu
  • Patent number: 10983036
    Abstract: An apparatus (10) and method for performing nonlinear elasticity measurements using the dynamic acousto-elasticity technique (DAET) at simulated subsurface conditions in the laboratory, are described. The current state-of-the-art for measuring nonlinear elasticity parameters using DAET is limited to ambient pressure conditions on the bench-top. The present invention permits nonlinear parameter measurements at controlled sample internal fluid pore pressures (52) and external confining stress (44), (50) conditions.
    Type: Grant
    Filed: March 26, 2017
    Date of Patent: April 20, 2021
    Assignees: TRIAD NATIONAL SECURITY, LLC, CHEVRON U.S.A. INC.
    Inventors: Peter M. Roberts, Harvey E. Goodman, Marcel C. Remillieux
  • Patent number: 10985084
    Abstract: Integrated circuits, wafer level integrated III-V device and CMOS driver device packages, and methods for fabricating products with integrated III-V devices and silicon-based driver devices are provided. In an embodiment, an integrated circuit includes a semiconductor substrate, a plurality of transistors overlying the semiconductor substrate, and an interlayer dielectric layer overlying the plurality of transistors with a metallization layer disposed within the interlayer dielectric layer. The plurality of transistors and the metallization layer form a gate driver circuit. The integrated circuit further includes a plurality of vias disposed through the interlayer dielectric layer, a gate driver electrode coupled to the gate driver circuit, a III-V device electrode overlying and coupled to the gate driver electrode, and a III-V device overlying and coupled to the III-V device electrode.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 20, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventor: Donald Ray Disney
  • Patent number: 10978566
    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line structures and methods of manufacture. The structure includes: a plurality of gate structures comprising source and/or drain metallization features; spacers on sidewalls of the gate structures and composed of a first material and a second material; and contacts in electrical contact with the source and/or drain metallization features, and separated from the gate structures by the spacers.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: April 13, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Hui Zang, Guowei Xu, Keith Tabakman, Viraj Sardesai
  • Patent number: 10975291
    Abstract: In-situ upgrading of heavy hydrocarbons includes injecting into a reservoir solvent, an asphaltene precipitant additive and optionally steam, at a ratio of solvent to heavy hydrocarbon between 0.1:1 and 20:1 under reservoir conditions. The additive has C—H, C—C and/or C—O bonds that thermally crack to generate free radicals in the vapor phase after injection. Formed downhole are a blend containing an upgraded hydrocarbon, and precipitated asphaltenes. The upgraded hydrocarbon is produced such that the precipitated asphaltenes remain in the reservoir. The upgraded hydrocarbon has a greater API gravity, lower asphaltene content, and lower viscosity than the heavy hydrocarbon. The precipitated asphaltenes are present in a higher amount than a similar blend not containing the additive.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: April 13, 2021
    Assignee: CHEVRON U.S.A. INC.
    Inventors: Cesar Ovalles, Estrella Rogel, Ian Phillip Benson, Ronald A. Behrens
  • Patent number: 10976666
    Abstract: Embodiments of the present disclosure provide an apparatus including mask pattern formed on a mask substrate. A plurality of spatial radiation modulators may be vertically displaced from the mask pattern, and distributed across a two-dimensional area. Each of the plurality of spatial radiation modulators may be adjustable between a first transparent state and a second transparent state to control whether radiation transmitted through the mask pattern passes through each of the plurality of spatial radiation modulators.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: April 13, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Ezra D. B. Hall, Jed H. Rankin, Alok Vaid
  • Patent number: 10977796
    Abstract: A platform for evaluating medical information and method for using the same are described.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: April 13, 2021
    Assignee: Fujifilm Medical Systems U.S.A., Inc.
    Inventors: Brigil Vincent, Keiji Sugihara, William B. Carruthers, III, Yoshiyuki Kurami
  • Patent number: 10971583
    Abstract: A gate cut isolation including an air gap and an IC including the same are disclosed. A method of forming the gate cut isolation may include forming an opening in a dummy gate that extends over a plurality of spaced active regions, the opening positioned between and spaced from a pair of active regions. The opening is filled with a fill material, and the dummy gate is removed. A metal gate is formed in a space vacated by the dummy gate on each side of the fill material, and the fill material is removed to form a preliminary gate cut opening. A liner is deposited in the preliminary gate cut opening, creating a gate cut isolation opening, which is then sealed by depositing a sealing layer. The sealing layer closes an upper end of the gate cut isolation opening and forms the gate cut isolation including an air gap.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: April 6, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Hong Yu, Hui Zang, Jiehui Shu
  • Patent number: 10971625
    Abstract: A semiconductor device is provided, which includes an array of active regions, gate stacks and substantially uniform epitaxial structures. The gate stacks of the array include a first gate stack and a second gate stack over an active region. An active pillar between the first gate stack and the second gate stack, and the active pillar separating two substantially uniform epitaxial structures. A contact structure over the active pillar, positioned equidistant from the first gate stack and the second gate stack.
    Type: Grant
    Filed: June 30, 2019
    Date of Patent: April 6, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Michael V Aquilino, Daniel Jaeger, Man Gu, Bradley Morgenfeld, Haiting Wang, Kavya Sree Duggimpudi, Wang Zheng
  • Patent number: 10968405
    Abstract: A catalyst system has been designed that disrupts the sedimentation process. The catalyst system achieves this by saturating key feed components before the feed components are stripped into their incompatible aromatic cores. The efficacy of this disruptive catalyst system is particularly evident in a hydrocracker configuration that runs in two-stage-recycle operation. The catalyst is a self-supported multi-metallic catalyst prepared from a precursor in the hydroxide form, and the catalyst must be toward the top level of the second stage of the two-stage system.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 6, 2021
    Assignee: Chevron U.S.A. Inc.
    Inventors: Theodoras Ludovicus Michael Maesen, Derek Blackwell, Viorel Duma, Varut Komalarajun, Alexander E. Kuperman, Hyunuk Ryu, Horacio Trevino, Alex Yoon, Ujjal Mukherjee
  • Patent number: 10966597
    Abstract: Exemplary apparatus and optical systems for forward and side view apparatus are described. These apparatus include a light focusing element, a grating element inclined with respect to the optical axis of the apparatus, and a transparent element. The transparent element has a proximal surface in contact with the grating element and an inclined distal surface. Such apparatus can be used as spectrally encoded endoscopy (SEE) probes.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: April 6, 2021
    Assignee: Canon U.S.A., Inc.
    Inventors: Kenji Yamazoe, Anderson Mach, Zhuo Wang
  • Patent number: 10968860
    Abstract: Provided is a cylinder liner having a first portion with a first thermal conductivity and a second portion with a second thermal conductivity. The first portion having the first thermal conductivity can include as-cast projections or a coating of a material, as desired. The first thermal conductivity can be greater than the second thermal conductivity. In this manner, the cylinder liner can exhibit a thermal conductivity gradient.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: April 6, 2021
    Assignee: ZYNP GROUP (U.S.A.) INC.
    Inventor: Rodrigo Favaron
  • Patent number: 10969544
    Abstract: Structures for a filter and methods of fabricating a structure for a filter. The filter is coupled to a waveguide core. The filter includes a first plurality of grating structures positioned adjacent to a first section of the waveguide core and a second plurality of grating structures positioned adjacent to a second section of the waveguide core. The first plurality of grating structures are configured to cause laser light in a first portion of a wavelength band to be transferred between the first section of the waveguide core and the first plurality of grating structures. The second plurality of grating structures are configured to cause laser light in a second portion of a wavelength band to be transferred between the second section of the waveguide core and the second plurality of grating structures.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: April 6, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Shuren Hu, Bo Peng, David Riggs, Karen Nummy, Kevin K. Dezfulian, Francis Afzal