Patents Assigned to SAE Magnetics (H.K.) Ltd.
  • Publication number: 20220003573
    Abstract: An angle detection apparatus includes a magnetic sensing element, a magnetic field generator, and a yoke. The magnetic field generator is rotatable around a rotation axis with respect to the magnetic sensing element and generates a magnetic field. The yoke is disposed in a magnetic-field influence region and is rotatable together with the magnetic field generator. The magnetic-field influence region is a region that lies between the magnetic field generator and the magnetic sensing element in a rotation axis direction along the rotation axis, and that is to be influenced by the magnetic field.
    Type: Application
    Filed: April 5, 2021
    Publication date: January 6, 2022
    Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.
    Inventors: Toshio ISHIKAWARA, Takahiro MORIYA, Toshihiko OYAMA, Seiji FUKUOKA
  • Patent number: 11211084
    Abstract: A Perpendicular Magnetic Recording (PMR) head is configured for use in Thermally Assisted Magnetic Recording (TAMR). Two or three contiguous write shields, of various widths and thicknesses, formed on a leading edge side of the write gap (WG), main pole (MP) and near-field transducer (NFT), protect the head during write touchdowns (TD) and signal the approach of such a touchdown. Moreover during a write touchdown the contact with the head is restricted to the large write shields, producing a large touchdown area (TDA) and insuring the lifetime of the head.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: December 28, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Qinghua Zeng, Siu Yin Ngan, Ellis Cha, Kowang Liu
  • Patent number: 11153691
    Abstract: A thin-film filter includes thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along with an intersecting direction intersecting the film surface. The stripes-formed inner wall surfaces are formed inside the respective through holes.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 19, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Patent number: 11127424
    Abstract: A light source-unit includes a laser diode, a sub-mount which the laser diode is joined. The laser diode includes an optical generating layer including an active layer which emits laser-light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 21, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Kang Gao, Seiichi Takayama, Ryo Hosoi, Ryuji Fujii
  • Patent number: 11114121
    Abstract: A slider design for a hard disk drive (HDD) features a shallow cavity adjacent to a leading edge that has patterns of sub-cavities of various shapes etched into its base to reduce its original surface area. The presence of these patterns of sub-cavities significantly reduces the probability that the slider will capture particles on the surface of a rotating disk and thereby reduces the corresponding probability of surface scratches that such captured particles inevitably produce.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: September 7, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Ben Ng Kwun Pan, Ellis Cha
  • Patent number: 10999684
    Abstract: A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 4, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Lik Hang Ken Wan, Masashi Shiraishi, Akio Nakao
  • Patent number: 10978102
    Abstract: A thermally assisted magnetic head including a main magnetic pole layer having a magnetic pole end face arranged in a medium-opposing surface, a near-field transducer which generates a near-field light for heating the magnetic recording medium, a waveguide guiding light to the near-field transducer; and an optical side shield being arranged in the medium-opposing surface side of the waveguide and being formed so as to sandwich a part of the near-field transducer, in the medium-opposing surface side, from both sides of a direction along the medium-opposing surface. The near-field transducer includes a protruding end-part (PEG). Then the protruding end-part is arranged to have a PEG end-surface at a position receded from the medium-opposing surface.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 13, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wai Yuen Anthony Lai, Hon Kit Lau
  • Patent number: 10943613
    Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The slider substrate includes a light source-cavity formed in a light source-placing surface on which the light source-unit is placed. The light source-cavity includes an opening concave part being formed larger than a mount bottom surface of the sub-mount. The mount bottom surface of the sub-mount is inserted into the opening concave part to be joined to the light source-cavity.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: March 9, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Ryo Hosoi, Takashi Honda, Seiichi Takayama, Sik Fun Chan, Tai Boon Lee, Dayu Zhou
  • Patent number: 10934159
    Abstract: A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: March 2, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Akio Nakao
  • Patent number: 10863282
    Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: December 8, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Koichi Shiozawa, Masashi Shiraishi, Jumpei Tsuchiya, Lik Hang Ken Wan, Toyotaka Kobayashi, Hironobu Hayashi
  • Patent number: 10845569
    Abstract: Disclosed is a camera module that comprises a lens assembly that includes a lens base and a lens tube integrated with the lens base for receiving at least one lens; and a voice coil motor assembly for driving the lens assembly, comprising a base, two leaf springs, at least two coils, and at least two magnets. The coils are respectively fixed on two opposite sides of the base, the magnets are fixed on two opposite sides of the lens assembly respectively, and the magnets are located by inner sides of the coils respectively, the lens assembly is clamped by the leaf springs and supported on the base, the coils drive the magnets and the lens assembly to move after being energized. The camera module is simply structured, easy to assembly, less bulky and fit for the demand of thin products.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: November 24, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Yiu Sing Ho, Shou Sheng Gao, Zong Qin Shi
  • Patent number: 10836630
    Abstract: A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a particle filter formed on the package substrate or the MEMS chip. The particle filter has a pierced-structure, which plural through holes are formed on a base surface by a regular arrangement. Further, in the particle filter, a plane-opening rate is set at least 45%, and a thickness-opening rate is set at least 50%.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: November 17, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Toyotaka Kobayashi, Hironobu Hayashi, Ichiro Yagi, Bing Ma
  • Patent number: 10839843
    Abstract: A method of operating an HDD having a slider-mounted read/write head that is configured for dynamic fly-height operation (DFH) and includes at least one head-disk interference sensor (HDIs). By operating the DFH to lower the head and subjecting the HDIs signal to a power-law enhancement, a consistent and accurate determination of the touchdown power (TDP) can be obtained. Combining absolute TDP determination with a method for measuring relative changes of FH, an absolute determination of FH can be determined.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: November 17, 2020
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Qinghua Zeng, Soramany Ka, Ellis Cha
  • Patent number: 10811042
    Abstract: A thermally assisted magnetic recording head and a thermally assisted magnetic recording disk drive are disclosed. The thermally assisted magnetic recording head includes a slider body, a laser substrate, a laser and a magnetic head, wherein the laser substrate is provided on the slider body, the laser is provided on the laser substrate, and the magnetic head is provided at a front end of the slider body. The magnetic head includes an optical waveguide facing the laser. The angle between a light incident surface of the optical waveguide and an incident direction of a laser light incident on the optical waveguide is less than 90 degrees. The thermally assisted magnetic recording disk drive includes a plurality of magnetic disks and a magnetic head suspending frame. A front end of the magnetic head suspending frame is provided with the thermally assisted magnetic recording heads mentioned above.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: October 20, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ryuji Fujii, Jian Hui Huang, Natsuo Nishijima, Lin Huang, Shi Xiong Chen, Bin Qi, Wen Rong Guo
  • Patent number: 10811046
    Abstract: A slider design for a hard disk drive (HDD) features a shallow cavity adjacent to a leading edge that has patterns of sub-cavities of various shapes etched into its base to reduce its original surface area. The presence of these patterns of sub-cavities significantly reduces the probability that the slider will capture particles on the surface of a rotating disk and thereby reduces the corresponding probability of surface scratches that such captured particles inevitably produce.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: October 20, 2020
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Ben Ng Kwun Pan, Ellis Cha
  • Patent number: 10785576
    Abstract: A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the package substrate has a sound hole. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the movable element, and a gel member. The MEMS chip is mounted on the package substrate so that the movable element opposes to the sound hole. The gel member is formed by hardening of gel which is applied on the annular dam-member from outside so as to surround the annular dam-member.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 22, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Akio Nakao, Masashi Shiraishi
  • Patent number: 10679653
    Abstract: A method of operating a HDD having a read/write head configured for Perpendicular Magnetic Recording (PMR) and configured for use in Thermally Assisted Magnetic Recording (TAMR). By using selected settings of a power ratio (PR) value to ensure that accurate fly height (FH) measurements of head-disk interference (HDI) can be taken during write touchdowns (TDs), head damage can be eliminated during HDI events. Under normal operating conditions the PMR head develops a sharp protrusion due to heating from the TAMR apparatus as well as the write current and read and write heaters. The sharp protrusion is prone to striking the disk surface, instead of the shields doing so. The shields would be more capable of absorbing the HDI, which would allow the HDI sensors (HDIs) to provide a more sensitive reading of the HDI which would prevent head wear caused by the sharp protrusion.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: June 9, 2020
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Qinghua Zeng, Siu Yin Ngan, Soramany Ka, Ellis Cha
  • Patent number: 10650856
    Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The thermally assisted magnetic head includes an optimal-structure which the following optimizing conditional expression, concerning an inlet-optical path length L1 of an inlet-interval of the waveguide, and an outlet-optical path length L2 of an outlet-interval, is satisfied, m1√óL1=L2 (m1 is a natural number).
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: May 12, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Seiichi Takayama
  • Patent number: 10629233
    Abstract: A PMR read/write head configured for thermally assisted recording (TAMR) includes thermally active bumper pads formed to each side of a write element to provide enhanced touchdown (TD) protection to the write head element where it emerges adjacent to the plasmon near-field spot produced by the TAMR apparatus. The bumper pads are disposed about the write head and absorb heat energy generated by active heating elements, the write current and the energy generated by the TAMR apparatus. Absorption of this energy causes the bumper pads to expand and protrude outward from the slider ABS to protect the read/write head from both intentional and unanticipated touchdown events. The PMR read/write head is then mounted on a slider and the assembly is incorporated into a hard disk drive (HDD).
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: April 21, 2020
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Siu Yin Ngan, Qinghua Zeng, Ellis Cha, Kowang Liu, Xuhui Jin
  • Patent number: 10622783
    Abstract: A light source-unit which is used for a thermally assisted magnetic head, comprises a laser diode and a sub-mount which the laser diode is joined. The sub-mount comprises a joint-surface which the laser diode is joined and a convex part protruding from the joint-surface. The light source-unit comprises an alloy layer, made of alloy, which is formed between the surface of the convex part and an opposing-surface, of the laser diode, opposing to the joint-surface.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: April 14, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Takashi Honda, Makoto Kawato