Abstract: The present disclosure discloses a magnetic head, a head gimbal assembly, a hard disk drive, and a method for processing a magnetic head. The method comprises irradiating at a fixed point proximal to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar; and disassembling the magnetic strip to obtain a lapped magnetic head. Through laser heating induced compensation, the heights of lapped read head and write head of the magnetic head meet their respective target values, ensuring the normal reading and writing of the storage medium of the magnetic disk.

Abstract: The present disclosure discloses a device with a protective layer, including a substrate, a seed layer formed on the substrate, and a diamond-like carbon layer formed on the seed layer, where the seed layer is a silicon nitride layer, and a content of nitrogen in the silicon nitride layer is 9%-17%. The present disclosure further discloses a microwave-assisted magnetic recording (MAMR) head slider, a head gimbal assembly, and a disk drive unit. The device has good thermal stability, oxidation resistance and corrosion resistance, thereby improving reliability and prolonging service life of an MAMR head.

Abstract: A thermally assisted magnetic head includes a slider having a slider substrate and a magnetic head part, and a light source unit having a laser diode and a sub-mount. The magnetic head part includes a medium-opposite surface, a light source-opposite surface, and a slider-front end surface. The sub-mount includes a joined-end surface and a mount-front end surface, the laser diode includes an electrode surface and an LD-front end surface. The light source unit includes a shift joined structure which the laser diode is joined to a shift area of the joined-end surface, and the light source unit is mounted on the slider substrate so that the electrode surface intersects with a laminated surface of the magnetic head part. The shift area is set in a position which is shifted so that the LD-front end surface is away from the slider-front end surface than the mount-front end surface.

Abstract: An angle detection apparatus includes a magnetic sensing element, a magnetic field generator, and a yoke. The magnetic field generator is rotatable around a rotation axis with respect to the magnetic sensing element and generates a magnetic field. The yoke is disposed in a magnetic-field influence region and is rotatable together with the magnetic field generator. The magnetic-field influence region is a region that lies between the magnetic field generator and the magnetic sensing element in a rotation axis direction along the rotation axis, and that is to be influenced by the magnetic field.

Abstract: A light source unit for thermally-assisted magnetic head includes a substrate member having a first bonding surface; a light source assembly attached on the first bonding surface of the substrate member and having a second bonding surface; and a heater circuit assembly formed between the substrate member and the light source assembly, the heater circuit assembly having a heater formed on the substrate member and two leads connected at two ends of the heater, the lead being thicker than the heater, thereby a distance between the heater and the second bonding surface is farther than that between the lead and the second bonding surface. The light source unit can reduce mechanical stress and thermal conduction between a light source assembly and a substrate member, thereby improving the performance of the light source assembly and the heater.

Abstract: The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.

Abstract: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.

Abstract: The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.

Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.

Abstract: A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a recording head, a reading head, a near field transducer and a medium-opposing surface. The medium-opposing surface includes a recording area and a reading area. The magnetic head part includes a record/read separately protective structure which a stabilized protective film is formed on the recording area and a reading head protective film is formed on the reading area. The stabilized protective film includes a three-layers structure which a seed layer and a double protective layer are laminated. The double protective layer includes a YSZ protective layer and a hard protective layer. The reading head protective film includes a thickness which is thinner than the stabilized protective film.

Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.

Abstract: A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a recording head, a reading head, a near field transducer and a medium-opposing surface. The medium-opposing surface includes a recording area and a reading area. The magnetic head part includes a record/read separately protective structure which an enhanced protective film is formed on the recording area and a reading head protective film is formed on the reading area. The enhanced protective film includes a plurality of films for effectively protecting the recording head and the near field transducer. The reading head protective film includes a thickness which is thinner than the enhanced protective film.

Abstract: An HGA includes a slider and a suspension for supporting the slider, wherein the suspension includes a flexure having a plurality of electrical traces formed thereon and a gimbal connection area supported and connected to the slider, a first surface of the gimbal connection area is provided with a first adhesive and a second adhesive respectively formed thereon and between the first surface and an opposite surface of an air bearing surface of the slider, an opposite surface of the first surface of the gimbal connection area is contacted with a dimple, and the dimple is located at a position between first adhesive and the second adhesive. The HGA can eliminate torsion and sway gain in frequency response function testing, and maintain AC stroke sensitivity and linearity of elements, thereby finally improving the performance of the disk drive unit.

Abstract: A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.

Abstract: A thin-film filter includes thin-film part having a film surface and a rear film surface arranged at the rear side of the film surface, a plurality of through holes, being formed to penetrate the thin-film part from the film surface to the rear film surface, the through holes are formed along by a slanting direction being made an acute angle or an obtuse angle with the film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along by the slanting direction. The stripes-formed inner wall surfaces are formed inside the respective through holes.

Abstract: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.

Abstract: The present invention relates to the field of camera shake reduction technology and discloses a suspension assembly of OIS, which comprises a printed circuit board and a spring plate movably disposed on the printed circuit board, wherein the printed circuit board is electrically connected with the spring plate, the printed circuit board comprises a substrate plate and a bend portion extending downwards along any side edge of the substrate plate, a support component is attached to a bottom surface of the substrate plate, a plurality of conductive terminals are arranged on an outside surface of the bend portion, a plurality of reinforce components are arranged on an inside surface of the bend portion and corresponding to the plurality of conductive terminals one to one, and the plurality of reinforce components are placed at intervals and do not contact with each other.

Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.

Abstract: A lapping method of a MAMR head slider includes a first lapping process: controlling the lapping plate to spin at a first speed, and controlling the MAMR head slider to move at a first moving speed, and applying a first force to the MAMR head slider; and a second lapping process: controlling the lapping plate to spin at a second speed that is lower than the first speed, and controlling the MAMR head slider to move at a second moving speed that is lower than the first moving speed, and applying a second force that is lower than the first force to the MAMR head slider; and the second lapping process includes a final lapping process section, and the second force in the final lapping process being zero. In such a way, lapping marks on the ABS are reduced to improve the roughness and the reliability.