Patents Assigned to SAE Magnetics (H.K.) Ltd.
  • Patent number: 11562766
    Abstract: A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a recording head, a reading head, a near field transducer and a medium-opposing surface. The medium-opposing surface includes a recording area and a reading area. The magnetic head part includes a record/read separately protective structure which an enhanced protective film is formed on the recording area and a reading head protective film is formed on the reading area. The enhanced protective film includes a plurality of films for effectively protecting the recording head and the near field transducer. The reading head protective film includes a thickness which is thinner than the enhanced protective film.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: January 24, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Natsuo Nishijima, Xiao Ke Ding
  • Patent number: 11557318
    Abstract: An HGA includes a slider and a suspension for supporting the slider, wherein the suspension includes a flexure having a plurality of electrical traces formed thereon and a gimbal connection area supported and connected to the slider, a first surface of the gimbal connection area is provided with a first adhesive and a second adhesive respectively formed thereon and between the first surface and an opposite surface of an air bearing surface of the slider, an opposite surface of the first surface of the gimbal connection area is contacted with a dimple, and the dimple is located at a position between first adhesive and the second adhesive. The HGA can eliminate torsion and sway gain in frequency response function testing, and maintain AC stroke sensitivity and linearity of elements, thereby finally improving the performance of the disk drive unit.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: January 17, 2023
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventor: Chi Wai Lo
  • Patent number: 11447388
    Abstract: A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: September 20, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Patent number: 11425508
    Abstract: A thin-film filter includes thin-film part having a film surface and a rear film surface arranged at the rear side of the film surface, a plurality of through holes, being formed to penetrate the thin-film part from the film surface to the rear film surface, the through holes are formed along by a slanting direction being made an acute angle or an obtuse angle with the film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along by the slanting direction. The stripes-formed inner wall surfaces are formed inside the respective through holes.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: August 23, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Masashi Shiraishi, Toyotaka Kobayashi, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Patent number: 11411162
    Abstract: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.
    Type: Grant
    Filed: July 4, 2019
    Date of Patent: August 9, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wei Xiong, Atsushi Iijima
  • Patent number: 11350220
    Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 31, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Hironobu Hayashi, Toyotaka Kobayashi
  • Patent number: 11347075
    Abstract: The present invention relates to the field of camera shake reduction technology and discloses a suspension assembly of OIS, which comprises a printed circuit board and a spring plate movably disposed on the printed circuit board, wherein the printed circuit board is electrically connected with the spring plate, the printed circuit board comprises a substrate plate and a bend portion extending downwards along any side edge of the substrate plate, a support component is attached to a bottom surface of the substrate plate, a plurality of conductive terminals are arranged on an outside surface of the bend portion, a plurality of reinforce components are arranged on an inside surface of the bend portion and corresponding to the plurality of conductive terminals one to one, and the plurality of reinforce components are placed at intervals and do not contact with each other.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: May 31, 2022
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Xianwen Feng, Ying Xiao
  • Patent number: 11308981
    Abstract: A lapping method of a MAMR head slider includes a first lapping process: controlling the lapping plate to spin at a first speed, and controlling the MAMR head slider to move at a first moving speed, and applying a first force to the MAMR head slider; and a second lapping process: controlling the lapping plate to spin at a second speed that is lower than the first speed, and controlling the MAMR head slider to move at a second moving speed that is lower than the first moving speed, and applying a second force that is lower than the first force to the MAMR head slider; and the second lapping process includes a final lapping process section, and the second force in the final lapping process being zero. In such a way, lapping marks on the ABS are reduced to improve the roughness and the reliability.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: April 19, 2022
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Shi Xiong Chen, Bin Qi, Wen Rong Guo, Peng Liu
  • Patent number: 11292255
    Abstract: A piezoelectric device comprises a pressure chamber forming layer, a vibration plate disposed on and connected with the pressure chamber forming layer to form a pressure chamber, and a piezoelectric element disposed on the vibration plate and used for driving the vibration plate to move and thus changing a volume of the pressure chamber, wherein the piezoelectric element is disposed on the vibration plate in such a manner as to cover a portion of the pressure chamber, the piezoelectric element has two opposite ends respectively extending beyond an edge of the pressure chamber and covering the pressure chamber forming layer. The piezoelectric device of the present invention can efficiently actuate the vibration plate, eliminate undesired displacements of the vibration plate in the opposite direction at the edge of the chamber, and provide higher displacement sensitivity to driving voltage.
    Type: Grant
    Filed: July 15, 2017
    Date of Patent: April 5, 2022
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Wei Xiong, Fei He, Atsushi Iijima
  • Patent number: 11295770
    Abstract: A thin-film piezoelectric material substrate includes an insulator on Si substrate and a thin-film laminated part. The insulator on Si substrate has a substrate for deposition made of silicon and an insulating layer formed on a surface of the substrate for deposition. The thin-film laminated part is formed on a top surface of the insulating layer. The thin-film laminated part has a YZ seed layer including yttrium and zirconium, and formed on the top surface; a lower electrode film laminated on the YZ seed layer; a piezoelectric material film made of lead zirconate titanate, shown by general formula Pb(ZrxTi(1-x))O3, and formed on the lower electrode film; and an upper electrode film laminated on the piezoelectric material film.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: April 5, 2022
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Wei Xiong, Atsushi Iijima
  • Patent number: 11289641
    Abstract: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: March 29, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wei Xiong, Atsushi Iijima
  • Patent number: 11232812
    Abstract: A slider-mounted read/write transducer for a hard disk drive (HDD) has a topology that mitigates attraction and accumulation of lubricant and hydrocarbons during the HDD operation. The slider topology may include a pattern of cavities and channels symmetrically disposed about a central longitudinal axis. The slider may also have a transverse channel extending perpendicularly inward from an opening in each side edge of the slider to intersect a channel that extends longitudinally along a middle axis towards a leading-edge pad in which a read/write transducer is embedded. The ends of the transverse channel open into an air-carrying groove extending vertically upward in the side of the slider in which a side flow blocker (SFB) restricts the air flow into the channel portion.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: January 25, 2022
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Guoqiang Zheng, Ellis Cha
  • Publication number: 20220003573
    Abstract: An angle detection apparatus includes a magnetic sensing element, a magnetic field generator, and a yoke. The magnetic field generator is rotatable around a rotation axis with respect to the magnetic sensing element and generates a magnetic field. The yoke is disposed in a magnetic-field influence region and is rotatable together with the magnetic field generator. The magnetic-field influence region is a region that lies between the magnetic field generator and the magnetic sensing element in a rotation axis direction along the rotation axis, and that is to be influenced by the magnetic field.
    Type: Application
    Filed: April 5, 2021
    Publication date: January 6, 2022
    Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.
    Inventors: Toshio ISHIKAWARA, Takahiro MORIYA, Toshihiko OYAMA, Seiji FUKUOKA
  • Patent number: 11211084
    Abstract: A Perpendicular Magnetic Recording (PMR) head is configured for use in Thermally Assisted Magnetic Recording (TAMR). Two or three contiguous write shields, of various widths and thicknesses, formed on a leading edge side of the write gap (WG), main pole (MP) and near-field transducer (NFT), protect the head during write touchdowns (TD) and signal the approach of such a touchdown. Moreover during a write touchdown the contact with the head is restricted to the large write shields, producing a large touchdown area (TDA) and insuring the lifetime of the head.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: December 28, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Qinghua Zeng, Siu Yin Ngan, Ellis Cha, Kowang Liu
  • Patent number: 11153691
    Abstract: A thin-film filter includes thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along with an intersecting direction intersecting the film surface. The stripes-formed inner wall surfaces are formed inside the respective through holes.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 19, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Patent number: 11127424
    Abstract: A light source-unit includes a laser diode, a sub-mount which the laser diode is joined. The laser diode includes an optical generating layer including an active layer which emits laser-light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 21, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Kang Gao, Seiichi Takayama, Ryo Hosoi, Ryuji Fujii
  • Patent number: 11114121
    Abstract: A slider design for a hard disk drive (HDD) features a shallow cavity adjacent to a leading edge that has patterns of sub-cavities of various shapes etched into its base to reduce its original surface area. The presence of these patterns of sub-cavities significantly reduces the probability that the slider will capture particles on the surface of a rotating disk and thereby reduces the corresponding probability of surface scratches that such captured particles inevitably produce.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: September 7, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Ben Ng Kwun Pan, Ellis Cha
  • Patent number: 10999684
    Abstract: A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 4, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Lik Hang Ken Wan, Masashi Shiraishi, Akio Nakao
  • Patent number: 10978102
    Abstract: A thermally assisted magnetic head including a main magnetic pole layer having a magnetic pole end face arranged in a medium-opposing surface, a near-field transducer which generates a near-field light for heating the magnetic recording medium, a waveguide guiding light to the near-field transducer; and an optical side shield being arranged in the medium-opposing surface side of the waveguide and being formed so as to sandwich a part of the near-field transducer, in the medium-opposing surface side, from both sides of a direction along the medium-opposing surface. The near-field transducer includes a protruding end-part (PEG). Then the protruding end-part is arranged to have a PEG end-surface at a position receded from the medium-opposing surface.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 13, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wai Yuen Anthony Lai, Hon Kit Lau
  • Patent number: 10943613
    Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The slider substrate includes a light source-cavity formed in a light source-placing surface on which the light source-unit is placed. The light source-cavity includes an opening concave part being formed larger than a mount bottom surface of the sub-mount. The mount bottom surface of the sub-mount is inserted into the opening concave part to be joined to the light source-cavity.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: March 9, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Ryo Hosoi, Takashi Honda, Seiichi Takayama, Sik Fun Chan, Tai Boon Lee, Dayu Zhou