Abstract: An apparatus configured to attach a protective film to a surface of an electronic device includes a fixing tray including a seating portion at which the electronic device is seated, a base to which the fixing tray is coupled, the base including a rail extending in a first direction, and a roller module configured to move along the rail in the first direction, the roller module including a roller configured to press the surface of the electronic device seated in the fixing tray, where the fixing tray includes a first fixing guide protruding from the fixing tray in the first direction from the seating portion and configured to support a first end of the protective film, and a second fixing guide protruding from the fixing tray in a second direction that is opposite to the first direction and configured to support a second end of the protective film.

Abstract: A semiconductor device including a peripheral circuit structure, a cell structure including gate electrodes and stacked on the peripheral circuit structure, the cell structure including a cell region, a connection region, and a peripheral circuit connection region, the cell structure, a plurality of channel structures extending in a vertical direction through the gate electrodes in the cell region, each of the plurality of channel structures including a first end portion close to the peripheral circuit structure and a second end portion opposite to the first end portion, and a common source layer connected to the second end portion of each of the channel structures in the cell region may be provided.

Abstract: A method of operating a modem chip in a wireless communication device configured to perform multiple-input and multiple-output (MIMO)-based communication with an external device, includes: receiving channel state information for a channel between the wireless communication device and the external device; generating a channel matrix corresponding to the channel based on the channel state information; generating an input matrix of a preset first size based on a size of a fixed input of a universal neural network model, and the channel matrix; generating an output matrix of a preset second size based on the input matrix and the universal neural network model; and determining a precoding matrix based on the output matrix. The size of the fixed input of the universal neural network model is based on a maximum value of at least one of parameters adjustable in the MIMO-based communication.

Abstract: A motor may include a shaft, a stator and a rotor. The rotor may include a plurality of magnets, a casing and a rotor core. The rotor core may include a plurality of first core layers and a plurality of second core layers. The first core layer may include a base part through which the shaft passes, a plurality of core parts spaced apart from each other along a circumferential direction of the base part, and a plurality of bridge parts configured so that each of the plurality of bridge parts extends from a corresponding core part of the plurality of core parts toward the base part, and is bent toward the corresponding core part.

Abstract: An object detection method and an object detection apparatus for detecting an object based on multi-features are provided. The object detection method includes: obtaining first-sensor data from a first sensor and obtaining second-sensor data from a second sensor, wherein the first sensor is a different type of sensor than the second sensor; extracting a first feature from the first-sensor data and extracting a second feature from the second-sensor data; determining a target feature-type by inputting the first and second features to a feature-type selection model which, based thereon, predicts the target feature-type; determining a target feature to be used for object detection according to the determined target feature-type; and determining an object detection result based on the determined target feature.

Abstract: A display device includes: a first electrode layer; a semiconductor layer including a source region, a drain region, and a channel region, wherein at least a portion of the source region or the drain region overlaps the first electrode layer; a second electrode layer arranged adjacent to the channel region; a third electrode layer overlapping the second electrode layer and at least a portion of the source region or the drain region; and a power line electrically connected to the first electrode layer and the third electrode layer.

Abstract: An electronic device includes memory storing instructions; and one or more processors configured to execute the instructions to obtain first loss values by inputting a first training image into neural network models; identify a smallest first loss value from among the first loss values; identify the first training image as being in a first training image group for a first neural network model corresponding to the smallest first loss value; obtain second loss values by inputting a second training image into the neural network models; identify a smallest second loss value from among the second loss values; identify the second training image as being in a second training image group for a second neural network model corresponding to the smallest second loss value; train the first neural network model based on the first training image group; and train the second neural network model based on the second training image group.

Abstract: A mask assembly includes a mask frame including an opening area, and a mask sheet located on the mask frame and including a body portion, a rib portion, and a sheet portion. The body portion is formed along a circumference of a through-area at a center and define the through-area, the rib portion protrudes to the through-area and includes a plurality of first ribs extending in a first direction and a plurality of second ribs extending in a second direction intersecting the first direction to define a plurality of openings, and the sheet portion covers the through-area and includes a plurality of pattern holes overlapping the plurality of openings in a plan view.

Abstract: Embodiments provide an organometallic compound represented by Formula 1, a light-emitting device including the organometallic compound, an electronic apparatus including the light-emitting device, and an electronic equipment including the light-emitting device. The light-emitting device includes a first electrode, a second electrode facing the first electrode, an interlayer between the first electrode and the second electrode and including an emission layer, and the organometallic compound. The organometallic compound is represented by Formula 1, which is explained in the specification.

Abstract: A semiconductor package includes: a buffer die; a plurality of semiconductor dies on the buffer die; a dummy die on the plurality of semiconductor dies; and a mold layer. The dummy die includes: a dummy substrate comprising a trench formed in a top surface of the dummy substrate, extended in a first direction and a second direction, and having a shape of checkerboard; and an oxide layer on a bottom surface of the dummy substrate. At least one of the plurality of semiconductor dies includes: a substrate, an upper passivation layer and a lower passivation layer. The oxide layer is in direct contact with the upper passivation layer of an uppermost one of the plurality of semiconductor dies. A level of a bottom surface of the trench is higher than a level of the bottom surface of the dummy substrate.

Abstract: A semiconductor device includes a substrate; an active pattern extending on the substrate in a first direction; a plurality of channel layers on the active pattern; a gate structure surrounding the plurality of channel layers, and extending in a second direction that intersects the first direction; blocking insulating layers on both side surfaces of the gate structure, respectively, each of the blocking insulating layers having an upper region having a first thickness and a lower region having a second thickness smaller than the first thickness; source/drain patterns on portions of the active pattern on both sides of the gate structure, the source/drain patterns defining trenches therein; contact structures on the source/drain patterns and filling the trenches; and a metal-semiconductor compound layer between the source/drain patterns and the contact structures.

Abstract: The disclosure of a clothing dryer may comprise: a first water container in which condensate generated as a drying cycle is performed is stored, a drain pump driven by a brushless direct current motor, and a controller configured to: alternately drive the drain pump at a first rotational speed and stop the drain pump a predetermined number of times in response to a start of a bubble removal cycle to remove bubbles from the condensate stored in the first water container, and start a drainage cycle in which the drain pump is operated at a second rotational speed which is greater than the first rotational speed for a predetermined driving period in response to termination of the bubble removal cycle.

Abstract: Disclosed is a multi-level defect detection method and system for detecting one or more defects in semiconductor wafers, including forming, among input images of the semiconductor wafers, a first image set of input images in which defects were not detected and a second image set of input images in which defects were detected; extracting image parameters from the first image set and determining whether the first image set can be enhanced; generating an image enhancement profile for the first image set and modifying the first image set based on the image enhancement profile and detecting one or more defects in the modified image set by performing a defect detection process thereon.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens. The first lens includes a convex object-side surface and a concave image-side surface. The second lens includes a concave object-side surface and a concave image-side surface. The third lens includes a concave object-side surface. The fourth lens includes a concave object-side surface. The fifth lens includes a concave object-side surface and a concave image-side surface. The first to fifth lenses are sequentially disposed from an object side toward an imaging plane.

Abstract: A method for generating an audio signal includes capturing, during a traversal event, at least one audio stream associated with one or more of a content, an ambient audio stream, and at least one user interface (UI) frame; obtaining a set of audio features, and obtaining one or more of UI elements; determining an audio gain based on a prioritization and a weighted average of the extracted set of audio features; determining a UI context based on a UI contextual score of the extracted one or more UI elements; obtaining an audio map comprising at least one biased audio file and at least one unbiased audio file; and obtaining the audio signal based on a priority order assigned to the at least one biased audio file and the at least one unbiased audio file associated with the audio map.

Abstract: A memory device includes a memory cell array including a plurality of memory cells, respectively connected to a plurality of bitlines, a first multiplexer including a plurality of transistors connected to the plurality of bitlines, a reference circuit that generates reference current, a decoding circuit that transmits the reference current to the first multiplexer, and a control logic circuit connected to the reference circuit and the decoding circuit. The control logic circuit controls control the decoding circuit to apply the reference current to transistors, connected to each of at least two bitlines, such that predetermined first current flows through the at least two bitlines.

Abstract: A plasma processing apparatus may include a support configured to receive a substrate, a gas distribution plate (GDP) including a plurality of nozzles facing the support, a main splitter configured to supply a process gas, and an additional splitter configured to supply an acceleration gas or a deceleration gas. The plurality of nozzles may include a plurality of central nozzles, a plurality of outer nozzles, a plurality of middle nozzles configured to spray the process gas and the acceleration gas, a plurality of first nozzles, and a plurality of second nozzles.

Abstract: An electronic device including: a transparent member visually exposed to an outside of the electronic device; a support member configured to support the transparent member and including an opening corresponding to the transparent member; an image sensor configured to detect light entering through the transparent member; a body tube configured to accommodate at least one lens; and an intermediate member in contact with a side surface of the body tube that faces the support member, at least part of the intermediate member being provided between the support member and the body tube.

Abstract: An electronic device according to an embodiment of the disclosure may include a first housing, a second housing, and a hinge apparatus configured to foldably connect the first housing and the second housing to each other. The hinge apparatus may include a bracket including a first coupling portion and a second coupling portion spaced apart from the first coupling portion, a first rotator including a first rotating portion fastened to the first coupling portion of the bracket to rotate relative to the bracket, a second rotator including a second rotating portion fastened to the second coupling portion of the bracket to rotate relative to the bracket, and a damper disposed on at least one of the first coupling portion and the second coupling portion to come into contact with at least one of the first rotating portion and the second rotating portion depending on a degree of rotation of the first rotator and the second rotator relative to the bracket.

Abstract: Provided is a semiconductor device which includes: a channel structure; a gate structure on the channel structure; a 1st source/drain region on the channel structure; a substrate layer below the gate structure; a 1st etch-stop layer below the substrate layer; a backside spacer on side surfaces of the substrate layer and the 1st etch-stop layer; and a backside contact structure on a bottom surface of the 1st source/drain region and a side surface of the backside spacer.