Abstract: An all-solid-state battery according to the present disclosure includes: an electrode layer that includes a current collector and an active material layer disposed on at least one side of the current collector; a solid electrolyte layer disposed on the electrode layer in a stack direction; and a margin insulating layer disposed laterally on an edge of the active material layer. The current collector includes a body portion on which the active material layer is disposed, and a tab portion having a smaller width than a width of the body portion and extending laterally to protrude from an edge of the body portion, and the margin insulating layer is disposed laterally on the body portion and surrounds the tab portion.

Abstract: A semiconductor device is provided. The semiconductor device includes a plurality of unit transistors, each of which is disposed on a semiconductor substrate, and includes a collector electrode configured to output an output signal, a base electrode configured to receive an input signal, an emitter electrode, an emitter junction wiring configured to interconnect the emitter electrodes of the plurality of unit transistors, and a metal pillar disposed to form an interface with the emitter junction wiring, and disposed to be in contact with the emitter junction wiring, and the metal pillar includes a plurality of slits, each of which forms a cavity.

Abstract: A camera module includes a lens holder configured to accommodate a lens module; a carrier configured to accommodate the lens holder; a lens driver cover disposed on the carrier to cover the lens holder; and a buffering member including a first portion fixed to the lens driver cover, a second portion extending from the first portion and including a dome-type protruding portion, a third portion extending from the first portion opposite to the second portion, and a groove extending from a bottom surface of the third portion toward the first portion. A maximum depth of the groove measured from the bottom surface of the third portion is greater than a maximum height of the third portion measured from the bottom surface of the third portion and smaller than a maximum height of the first portion measured from the bottom surface of the third portion.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the optical imaging system satisfies 0.5<L12345TRavg/L7TR<0.9, where L12345TRavg is an average value of overall outer diameters of the first to fifth lenses, L7TR is an overall outer diameter of the seventh lens, and L12345TRavg and L7TR are expressed in a same unit of measurement.

Abstract: A multilayer ceramic capacitor includes a ceramic body, a plurality of first and second internal electrodes having a dielectric layer therebetween in the ceramic body, first and second external electrodes including a body portion covering both end surfaces spaced apart from each other along a length direction of the ceramic body, respectively, a first band portion extending from the body portion and covering a part of a first surface of the ceramic body in a thickness direction, and a second band portion covering a part of a second surface facing the first surface and being longer than the first band portion, first and second cover layers that are disposed in the ceramic body along the thickness direction of the ceramic body, and a first cladding layer between the second cover layer, the second band portion of the first external electrode, and the second band portion of the second external electrode.

Abstract: An optical imaging system includes: a first lens having a concave image-side surface; a second lens having refractive power; a third lens having a concave image-side surface; a fourth lens having a concave object-side surface or a convex image-side surface; a fifth lens having refractive power; a sixth lens having a concave image-side surface; and a seventh lens having negative refractive power. The first to seventh lenses are sequentially disposed from an object side and 1.62<(N2+N5+N6)/3, where N2 is a refractive index of the second lens, N5 is a refractive index of the fifth lens, and N6 is a refractive index of the sixth lens.

Abstract: An optical imaging system includes a first lens having a concave image-side surface, a second lens having a concave image-side surface, and a third lens having a positive refractive power. The optical imaging system includes a fourth lens having a positive refractive power and a concave object-side surface, a fifth lens, a sixth lens having a positive refractive power, and a seventh lens having a concave object-side surface. The first lens to the seventh lens are sequentially disposed at intervals from an object side toward an imaging plane.

Abstract: A multilayer capacitor includes: a body including a dielectric layer, and first and second internal electrodes stacked on each other in a thickness direction of the capacitor while being spaced apart from each other with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode spaced apart from the first external electrode in a length direction of the capacitor that is perpendicular to the thickness direction, and connected to the second internal electrode. One of the first internal electrode and the second internal electrode has a horizontal plane perpendicular to the thickness direction and an inclined plane inclined with respect to the horizontal plane in at least a partial region thereof.

Abstract: A camera module including a lens module configured to move in one or more of an optical axis direction, a first axis direction perpendicular to the optical axis direction, and a second axis direction perpendicular to the optical axis direction and the first axis direction, a housing configured to accommodate the lens module, a printed circuit board coupled to the housing, an aperture module configured to form an incident opening of various sizes, and coupled to the lens module and moved together with the lens module, and a connection substrate connected to the printed circuit board and the aperture module. The aperture module includes an aperture driver including a magnet portion and a coil portion, and an aperture substrate in which the coil portion is disposed, and one side of the connection substrate is coupled to the aperture substrate, and another side thereof is coupled to the printed circuit board.

Abstract: A coil component includes a body; a support substrate disposed in the body and having one surface and the other surface; a first coil disposed on the one surface of the support substrate and having a first core; a second coil disposed on the other surface of the support substrate and having a second core; a first lead-out portion disposed on the other surface of the support substrate and connected to the first coil; and a second lead-out portion disposed on the one surface of the support substrate and connected to the second coil, wherein the first core includes a first shared core overlapping the second core and a first nonshared core not overlapping the second core, and wherein the second core includes a second shared core overlapping the first core and a second nonshared core not overlapping the first core.

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

Abstract: A semiconductor device including a plurality of unit transistors, each of which is disposed on a semiconductor substrate and includes a collector electrode configured to output an output signal, a base electrode configured to receive an input signal, and an emitter electrode; and an emitter junction wiring interconnecting emitter electrodes of the plurality of unit transistors. In a thickness direction of the semiconductor substrate, a portion of the emitter junction wiring positioned between at least two unit transistors adjacent to each other among the plurality of unit transistors and another portion of the emitter junction wiring positioned outside of the two unit transistors have different thicknesses.

Abstract: An electronic component includes a capacitor body, a connection electrode, and an external electrode. The capacitor body includes a dielectric layer, and a plurality of internal electrodes disposed in a stacking direction and spaced apart from one another with the dielectric layer interposed therebetween, the capacitor body including first and second surfaces facing each other in the stacking direction. The connection electrode is connected to the plurality of internal electrodes in the capacitor body and each include an end exposed from the first surface. The external electrode is positioned on the first surface and connected to the connection electrode. The connection electrode includes a main junction portion extending in the stacking direction and configured to penetrate the plurality of internal electrodes, and a bypass portion connected to the main junction portion and extending in a planar direction in the dielectric layer.

Abstract: An electronic component includes a multilayered capacitor including a capacitor body and an external electrode disposed on one surface of the capacitor body, a frame terminal mounting the multilayered capacitor on a board, and a conductive bonding portion disposed between the board and the frame terminal. The frame terminal includes a base portion including a first material and a surface portion including a second material, and a coefficient of thermal expansion of the frame terminal is greater than that of the capacitor body and is smaller than that of the conductive bonding portion.

Abstract: A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a side margin portion disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, wherein the side margin portion includes Sn and a transition metal, and wherein, in the side margin portion, a mole ratio of transition metal to Sn is 10 or more.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including a base electrode layer disposed on the body and including a first metal element, and an alloy layer and a plating layer, sequentially disposed on the base electrode layer. The alloy layer includes a first alloy layer disposed to contact the base electrode layer and including an alloy of the first metal element and Sn, and a second alloy layer disposed to contact the first alloy layer and including an alloy of Ni and Sn, and the plating layer includes an Ni plating layer disposed to contact the second alloy layer.

Abstract: Disclosed is multilayered capacitor that includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode outside the capacitor body, wherein the external electrode includes a metal layer having surface roughness disposed outside the capacitor body and including a first conductive metal, and a conductive resin layer including a resin and a second conductive metal.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially disposed from an object side to an imaging plane. The second lens has a concave image-side surface, the third lens comprises a positive refractive power, a radius of curvature of an object-side surface of the fifth lens is greater than a radius of curvature of an image-side surface of the fifth lens and a radius of curvature of an object-side surface of the sixth lens, and TTL/2lmgHT<0.695 in which TTL represents a distance from an object-side surface of a lens closest to the object side among the plurality of lenses to an imaging plane and 2lmgHT represents a diagonal length of an imaging plane.

Abstract: An optical imaging system includes a first lens group, a second lens group, and a third lens group, sequentially arranged from an object side, wherein the first lens group includes two lenses having negative and positive refractive power, the second lens group includes a plurality of lenses, and the third lens group includes two lenses having negative and positive refractive power.