Patents Assigned to Samsung Electro-Mechanics Co., Ltd.
  • Publication number: 20200219784
    Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
    Type: Application
    Filed: March 19, 2020
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun KIM, Jung Hyun LIM, Seung Goo JANG, Eun Kyoung KIM, Se Min JIN
  • Publication number: 20200218082
    Abstract: A camera module includes a lens module having lenses; a reflection module disposed on an object side of the lens module, and changing a path of light so that the light incident inside is directed toward the lens module; and an image sensor disposed on an image side of the lens module. The reflection module can be rotated about a first axis and a second axis perpendicular to the first axis, and an imaging plane of the image sensor includes a curved surface.
    Type: Application
    Filed: December 20, 2019
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chul CHOI, Dong Hun HAN, Sang Lae KIM
  • Publication number: 20200218041
    Abstract: A converter optical system includes a first lens having positive refractive power; a second lens having negative refractive power; a third lens having positive refractive power; a fourth lens having negative refractive power; and a fifth lens having positive refractive power; wherein the first to fifth lenses are sequentially disposed in numerical order from the first lens to the fifth lens from an object side of the converter optical system to an image side of the converter optical system; and the fourth lens is bonded to either one or both of the third lens and the fifth lens.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jung Hui KO
  • Publication number: 20200219651
    Abstract: A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.
    Type: Application
    Filed: September 17, 2019
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Soo Kang, Byeong Cheol Moon, Tae Jun Choi, Ju Hwan Yang
  • Publication number: 20200219645
    Abstract: A coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (T1) of the insulating substrate and a thickness (T2) of the first conductive layer satisfy 10?T1/T2?20.
    Type: Application
    Filed: September 17, 2019
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Soon Seong Jeong, Jong Min Lee
  • Patent number: 10707023
    Abstract: An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Jae Yeol Choi, Soo Hwan Son
  • Patent number: 10707820
    Abstract: A power amplifying apparatus includes a first bias circuit that generates a first bias current having a first magnitude, a first amplification circuit connected between a first node and a second node, and that receives the first bias current, amplifies a signal input through the first node, and outputs a first amplified signal to the second node, a second bias circuit that generates a second bias current having a second magnitude that is different from the first magnitude of the first bias current, and a second amplification circuit connected in parallel with the first amplification circuit between the first node and the second node, and that receives the second bias current, amplifies the signal input through the first node, and outputs a second amplified signal to the second node, wherein the second amplification circuit may have a size that is different from a size of the first amplification circuit.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyu Jin Choi, Jae Hyouck Choi
  • Patent number: 10706994
    Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ic Seob Kim, Jung Il Kim, Yong Sung Kim, Eun Ju Oh, Su Rim Bae, Hae In Kim
  • Patent number: 10707828
    Abstract: A filter includes series units and shunt units. Each series unit includes at least one bulk acoustic wave resonator. Each shunt unit includes at least one bulk acoustic wave resonator and is disposed between one of the series units and a ground. One of the series units or one of the shunt units includes a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, and a third bulk acoustic wave resonator connected in series. The second bulk acoustic wave resonator has a polarity different from a polarity of the first bulk acoustic wave resonator and a polarity of the third bulk acoustic wave resonator.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Chang Hyun Kim
  • Patent number: 10707009
    Abstract: A thin film-type inductor includes a body including a support member having a through-hole filled with a magnetic material and a via hole, a coil disposed on at least one side of the support member and including a plurality of coil patterns, and a magnetic material sealing the support member and the coil. Each of the coil patterns includes a first conductor layer, a second conductor layer, and a third conductor layer. The second conductor layer is disposed on a side surface of the via hole, and is disposed to seal a lower surface of the via hole.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Gul Ryu, Byeong Cheol Moon, Jin Hyuk Jang
  • Patent number: 10707969
    Abstract: A controller includes an amplification ratio control unit, an amplification unit, a digital conversion unit, and a driving current control unit. The amplification ratio control unit is configured to generate an amplification ratio signal based on an ambient temperature of a laser diode. The amplification unit configured to amplify, based on the amplification ratio signal, a detection current from a photodiode configured to detect light output from the laser diode, and output the detection current as a voltage signal. The amplification ratio signal controls an amplification ratio of the amplification unit. The digital conversion unit is configured to convert the voltage signal into a digital signal. The driving current control unit is configured to control a driving current of a driver configured to drive the laser diode based on the digital signal.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji Buem Chun, Sung Man Pang, Je Hyeon Yu
  • Patent number: 10707021
    Abstract: A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Soo Park, Young Ghyu Ahn, Hwi Dae Kim
  • Patent number: 10707556
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10707012
    Abstract: A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Suk Jeong, Kang Heon Hur, Seong Jae Lee, Jung Wook Seo, Hiroyuki Matsumoto, Chul Min Sim, Jong Sik Yoon
  • Patent number: 10707013
    Abstract: A sheet to shield electromagnetic waves for wireless charging includes: a base part formed of a resin; and a magnetic material embedded in the base part, wherein a density of the magnetic material in a region of the magnetic material corresponding to a shape of a coil of a reception coil member or a transmission coil member and a region of the magnetic material corresponding to an inner side of the coil is higher than a density of the magnetic material in other regions of the magnetic material.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Seung Min Lee
  • Publication number: 20200214135
    Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Hyun PARK, Yong Ho BAEK, Jae Hoon CHOI
  • Publication number: 20200209543
    Abstract: An image capturing lens system includes a first lens having negative refractive power, a second lens having positive refractive power, a third lens having negative refractive power, a fourth lens having positive refractive power, a fifth lens having refractive power, a sixth lens having refractive power, a seventh lens having positive refractive power, and an eighth lens having refractive power. The first to eighth lenses are sequentially disposed from an object side. The first lens and the fourth lens are formed of a glass material. The second lens, the third lens, the fifth lens, the sixth lens, the seventh lens, and the eighth lens are formed of a plastic material.
    Type: Application
    Filed: September 5, 2019
    Publication date: July 2, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyuk Joo KIM, Hwan Soo PARK, Yong Joo JO
  • Publication number: 20200209529
    Abstract: An image capturing lens system includes a first lens having negative refractive power, a second lens having positive refractive power while having a convex object-side surface, a third lens having positive refractive power, a fourth lens having positive refractive power, a fifth lens having negative refractive power with a concave object-side surface and a concave image-side surface, and a sixth lens having positive refractive power.
    Type: Application
    Filed: June 6, 2019
    Publication date: July 2, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyu Min CHAE, Sot Eum SEO
  • Publication number: 20200209554
    Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens, sequentially arranged from an object side optical imaging system, and a refractive index of at least one of the lenses is 1.67 or greater.
    Type: Application
    Filed: August 15, 2019
    Publication date: July 2, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Hui KO, Ju Hwa SON, Yong Joo JO
  • Patent number: 10698184
    Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens having a negative refractive power, a fifth lens having a negative refractive power, a sixth lens, and a seventh lens having a positive refractive power. The first lens to seventh lens are sequentially disposed in a direction from an object side toward an imaging plane.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Hwa Jung, Yong Joo Jo