Patents Assigned to Samsung Electro-Mechanics Co., Ltd.
  • Patent number: 11042203
    Abstract: A regulation circuit is provided. The regulation circuit is embedded in a front-end module, and provides a regulated voltage to a decoder based on a power supply voltage. The regulation circuit includes a first current regulating circuit connected between a power supply voltage terminal and a first connection node and configured to regulate a level of a first current, a first voltage regulating circuit connected between the first connection node and a ground node, and configured to receive the first current to regulate a level of a first voltage, a second voltage regulating circuit connected between the power supply voltage terminal and an output node, and configured to generate an output voltage based on the first voltage, and a second current regulating circuit connected between the output node and the ground node, and configured to stabilize the output voltage.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: June 22, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sang Hoon Ha
  • Patent number: 11042005
    Abstract: An actuator including two or more detection targets disposed on a surface and another surface of a lens barrel, respectively, an oscillating unit including a first oscillation circuit unit including two or more oscillation circuits disposed to face the surface and a second oscillation circuit unit including two or more oscillation circuits disposed to face the other surface to output oscillation signals, and a determining unit to calculate a position of the lens barrel from the oscillation signals output from the oscillating unit. A frequency range of an oscillation signal output from any one of the two or more oscillation circuits of the first oscillation circuit unit is different from that of an oscillation signal output from any one of the two or more oscillation circuits of the second oscillation circuit unit.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 22, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Hyeon Yu, Sung Man Pang, Youn Joong Lee, Ja Hwi Cho, Jin Kim
  • Patent number: 11042076
    Abstract: A camera module includes an upper housing coupled to a lower housing to form an inner space, a lens module provided in the inner space and including a heating element, and a substrate configured to supply power to the heating element, wherein the lens module includes an inner barrel comprising one or more lenses, an outer barrel which is coupled to a portion of the inner barrel in an optical axis direction, and a holder in which the outer barrel is fixed, wherein the substrate is fixed to a portion of the holder, wherein the heating element is disposed between the inner barrel and the outer barrel, and is connected to the substrate by a power connection line, and wherein the power connection line is connected to the substrate through a coupling hole in the holder.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: June 22, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joo Young Ha, Sang Hyo Seo, Dae Seob Kim, Cheong Hee Lee
  • Patent number: 11043440
    Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 22, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Kyu Kim, Seong Chan Park, Sang Hyun Kwon, Han Kim, Seung On Kang
  • Publication number: 20210181460
    Abstract: A camera module includes: an optical path folding member configured to refract or reflect light incident along a first optical axis in a direction of a second optical axis intersecting the first optical axis; a driving assembly configured to provide driving force to rotate the optical path folding member on a plane intersecting the first optical axis; and a first ball bearing and a second ball bearing supporting the optical path folding member such that the optical path folding member is enabled to rotate on the plane. A distance from the first ball bearing to the first optical axis is less than a distance from the second ball bearing to the first optical axis.
    Type: Application
    Filed: October 28, 2020
    Publication date: June 17, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung Hun LEE, Bong Won JEONG, Bo Sung SEO
  • Publication number: 20210181873
    Abstract: A switching operation sensing device to be applied to an electronic device including a touch operation unit having a first touch member integrated with a housing, the switching operation sensing device including a sensing coil component including a first inductor unit disposed on an inner surface of the first touch member, and an oscillator circuit connected to the sensing coil component and configured to generate an oscillation signal having a resonant frequency that changes when a touch operation is input through the touch operation unit, wherein the first inductor unit includes a first sensing area opposing the first touch member, a first sensing wiring disposed in the first sensing area, and a first sensing coil connected between the first sensing wiring and a first resonant circuit of the oscillator circuit.
    Type: Application
    Filed: March 25, 2020
    Publication date: June 17, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Joo Hyoung LEE
  • Publication number: 20210181602
    Abstract: A camera module includes a lens module to accommodate a lens; a substrate; an image sensor disposed on the substrate; a support member coupled to the lens module to define a gap between the image sensor and the lens module; a first adhesive member fixing a location of the support member with respect to the substrate; a second adhesive member fixing a location of the lens module with respect to the support member; a first housing coupled to the lens module; and a second housing to accommodate the substrate and coupled to the first housing.
    Type: Application
    Filed: April 30, 2020
    Publication date: June 17, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Cheong Hee LEE, Tae Young CHOI, Hong Sik YANG, Chang Uk SONG
  • Publication number: 20210181463
    Abstract: An imaging lens system includes a first lens, a second lens, a third lens having negative refractive power, a fourth lens, a fifth lens, and a sixth lens, disposed in order from an object side in a direction of an imaging plane, wherein one or more of the first to sixth lenses has a refractive index of 1.8 or greater, and has a refractive index temperature coefficient (10?6/° C.) of 3 or greater.
    Type: Application
    Filed: September 10, 2020
    Publication date: June 17, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyuk Joo KIM, Kyu Min CHAE, Seong Ho HWANG, Yong Joo JO
  • Patent number: 11039047
    Abstract: A camera module includes a housing having an internal space; a first moving body disposed in the internal space of the housing; a second moving body disposed in an internal space of the first moving body; a first driving member disposed in a space between the housing and the first moving body, and including a first driving wire formed of a shape memory alloy and a first curved elastic wire connected to both ends of the first driving wire; and a second driving member disposed in a space between the first moving body and the second moving body, and including a second driving wire formed of a shape memory alloy and a second curved elastic wire connected to both ends of the driving wire for AF. The first curved elastic wire is in contact with the first moving body and the second curved elastic wire is in contact with the second moving body.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 15, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Kyoung Joong Min
  • Patent number: 11037884
    Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Seok Seo, Dae Hyun Park, Sang Jong Lee, Chul Kyu Kim, Jae Hyun Lim
  • Patent number: 11036026
    Abstract: An apparatus controlling a position of a camera module includes an operating coil disposed on a housing of the camera module to face a magnetic member disposed on a lens barrel of the camera module, a driving circuit providing a driving current to the operating coil, a capacitor circuit having a capacitor value to form a resonance circuit together with the operating coil to resonate at a resonance frequency varied depending on an inductance value of the operating coil; a resonance maintaining circuit maintaining a level of a resonance signal generated by the operating coil and the capacitor circuit, a resonance frequency detecting circuit detecting a resonance frequency signal from the resonance signal generated by the operating coil and the capacitor circuit, and a control circuit configured to control the driving circuit in response to the resonance frequency signal from the resonance frequency detecting circuit.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: June 15, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Man Pang, Youn Joong Lee, Ja Hwi Cho, Je Hyeon Yu, Jin Kim
  • Patent number: 11037732
    Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Geum Kim, Byeong Cheol Moon, Kun Hoi Koo, Jung Min Kim
  • Patent number: 11038274
    Abstract: An antenna apparatus includes a ground layer, a wiring layer spaced apart from either a first surface or a second surface of the ground layer and including wiring lines, feed lines electrically connected to the wiring lines, a dipole antenna pattern to transmit and/or receive an RF signal, a plurality of feed vias to electrically connect poles of the dipole antenna pattern to the feed lines, and a ground pattern to electrically connect the poles of the dipole antenna pattern to the ground layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 15, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Kim, Jeong Ki Ryoo
  • Patent number: 11037733
    Abstract: A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers stacked therein in a stacking direction; first and second external electrodes disposed externally on the ceramic body; first and second internal electrodes alternately stacked with the plurality of dielectric layers, forming an internal active layer of the ceramic body, and respectively connected to the first and second external electrodes; a dummy layer, including a conductive material and having a mesh shape, disposed in at least one of an upper cover layer or a lower cover layer respectively disposed above or below the internal active layer of the ceramic body in the stacking direction.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho In Jun, Sun Cheol Lee, Kyeong Jun Kim
  • Patent number: 11037718
    Abstract: A coil component includes a body and external electrodes disposed on an external surface of the body. The body includes a support member including a through hole and a via hole, a coil including embedded coil patterns embedded in the support member and conductor layer disposed on the embedded coil patterns, and a magnetic material encapsulating the support member and the coil.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Joung Gul Ryu
  • Patent number: 11037730
    Abstract: An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Woo Chul Shin, Sang Soo Park
  • Patent number: 11037727
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Woo Chul Shin, Seung Heui Lee, Beom Seock Oh
  • Patent number: 11037722
    Abstract: A coil component includes: a body portion; a coil portion; and an electrode portion, wherein the coil portion includes: a support member; a first coil layer disposed on a first surface of the support member, having first conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a second coil layer disposed on a second surface of the support member, having second conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a via hole penetrating through the support member and partially overlapping innermost end portions of the first and second conductive patterns; and a via conductor filling a portion of the via hole and connected to the innermost end portions of the first and second conductive patterns.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hyung Jung, Boum Seock Kim, Byeong Cheol Moon
  • Patent number: 11039071
    Abstract: A camera module includes a gyro sensor configured to generate a gyro signal, an optical image stabilization (OIS) controller configured to generate, in response to the gyro signal, a driving signal indicating target positions in first and second directions perpendicular to an optical axis of a lens barrel, a first OIS driver configured to detect a present position of the lens barrel in the first direction, and based on the detected present position in the first direction and the indicated target position in the first direction, provide a driving force to the lens barrel in the first direction, and a second OIS driver configured to detect a present position of the lens barrel in the second direction, and based on the detected present position in the second direction and the indicated target position in the second direction, provide a driving force to the lens barrel in the second direction.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: June 15, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Kyoung Joong Min
  • Patent number: 11037716
    Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a support member; a first coil pattern formed on one surface of the support member; and a second coil pattern formed on the other surface of the support member, wherein a thickness of the support member between the first coil pattern and the second coil pattern is 1/10 or more of a thickness of the first coil pattern and is less than ? of the thickness of the first coil pattern.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Jae Lee