Patents Assigned to Samsung Electro-Mechanics Co., Ltd.
  • Coil component
    Patent number: 11923124
    Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jae Hun Kim, Joung Gul Ryu, Byung Soo Kang, Byeong Cheol Moon, Jeong Gu Yeo
  • Optical imaging system
    Patent number: 11921353
    Abstract: An optical imaging system includes an optical system including at least six lenses, sequentially disposed from an object side toward an image side, an image sensor configured to convert light incident through the optical system into an electronic signal, and a variable stop configured to change an incident hole diameter and disposed toward the object side of a lens of the optical system closest to the object side, wherein TTL is a distance to an imaging plane of the image sensor from an object-side surface of the lens closest to the object side and 4.7 mm<TTL<6.00 mm, and wherein Ri is a radius of curvature of an object-side surface of a lens of the optical system second closest to the image sensor, Rj is a radius of curvature of an image-side surface of the lens that is second closest to the image sensor, and ?0.5<(|Ri|?|Rj|)/(|Ri|+|Rj|)<0.5.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 5, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyuk Huh, Jae Hyun Baik, Yong Joo Jo
  • Multilayer ceramic capacitor and method of manufacturing the same
    Patent number: 11923149
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion respectively arranged on end portions of the internal electrodes exposed to first and second surfaces. The first and second side margin portions each include a first region adjacent to an outward facing side surface of the respective side margin portion, and a second region adjacent to the internal electrodes exposed to the first and second surfaces of the ceramic body, and an average size of dielectric grains included in the second region is larger than an average size of dielectric grains included in the first region.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Yong Park, Ki Pyo Hong, Sim Chung Kang
  • Multilayer capacitor having improved reliability by adjusting grain size of dielectric layer
    Patent number: 11923145
    Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 1<A2/M1?1.5 and A2<A1 in which A1 is an average grain size of the dielectric layers in a central region of the active portion, A2 is an average grain size of the dielectric layers at an active boundary part of the active portion adjacent to the side margin portion, and M1 is an average grain size of the dielectric layers in a central region of the side margin portion.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hee Lee, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hyoung Uk Kim, Jae Sung Park
  • Multilayer ceramic electronic component
    Patent number: 11923144
    Abstract: A multilayer ceramic electronic component includes: a body including dielectric layers as well as a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween and including a first metal; and external electrodes disposed on external surfaces of the body including a second metal, wherein at least some of the plurality of internal electrodes include a core-shell region including the first and second metals, and average contents of the second metal in a core portion and a shell portion of the core-shell region are different from each other.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Kim, Dong Jun Jung, Dae Hee Lee, Soo Jeong Jo
  • CAMERA MODULE
    Publication number: 20240073503
    Abstract: A camera module includes a lens barrel, a housing configured to accommodate the lens barrel, an image sensor disposed below the lens barrel and mounted on a substrate, along an optical axis direction of the lens barrel, and a sub-housing, disposed between the lens barrel and the substrate, including an opening in which the image sensor is accommodated and a protrusion having a convexly curved upper surface shape configured to extend toward the lens barrel.
    Type: Application
    Filed: May 31, 2023
    Publication date: February 29, 2024
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jihae LEE
  • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20240074050
    Abstract: A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the protrusion of the connection pad may be substantially the same as or less than a surface height of the insulation layer.
    Type: Application
    Filed: May 30, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Ki Min, Seong Ho Choi
  • METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20240071689
    Abstract: A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.
    Type: Application
    Filed: March 28, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myung Chan SON, Yong PARK, Jong Ho LEE, Eun Jung LEE, Jung Tae PARK, Min Woo KIM, Ji Hyeon LEE, Sun Mi KIM
  • PRINTED CIRCUIT BOARD
    Publication number: 20240074049
    Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.
    Type: Application
    Filed: February 24, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyun Bae, Hwan Su Yoo, Suk Chang Hong
  • LENS AND LENS MODULE INCLUDING LENS
    Publication number: 20240069249
    Abstract: A lens includes a lens unit having a refractive power; and a first coating layer and a second coating layer formed on either one or both of an object-side surface and an image-side surface of the lens unit in an optical axis direction of the lens unit, wherein a first refractive index of the first coating layer is greater than a second refractive index of the second coating layer.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyuk Joo KIM, Kyu Min CHAE
  • CAMERA MODULE
    Publication number: 20240069306
    Abstract: A camera module includes a housing defining an internal space, a lens module including a plurality of lenses, a reflective module disposed in front of the lens module and including a reflective member to change an optical path of light, a first driving unit to rotate the reflective module and including a first coil and a first magnet, a second driving unit to rotate the reflective module and including a second coil and a second magnet, a main substrate attached to the housing and including a first side substrate, and a circuit element disposed on the main substrate to provide a driving signal. The first coil and the second coil are disposed on the first side substrate of the main substrate, and the circuit element is disposed on a surface of the main substrate that is perpendicular to the first side substrate and faces the internal space of the housing.
    Type: Application
    Filed: January 26, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ah Hyeon IM, Jun Sup SHIN, Dong Yeon SHIN
  • MOBILE ELECTRONIC DEVICE WITH LENS, AND LENS ASSEMBLY
    Publication number: 20240069310
    Abstract: A lens includes a lens unit; an intermediate layer configured to cover a surface portion of the lens unit; and a water-repellent layer, configured to cover a surface portion of the intermediate layer, including a base layer and an ultraviolet (UV) absorber disposed in the base layer.
    Type: Application
    Filed: March 16, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Byung Ju KIM, Jung Ho LEE, Na Yi KANG, Joung Hun KIM, Jae Goon AUM
  • CAMERA MODULE
    Publication number: 20240069356
    Abstract: A camera module includes a housing having an interior space; an Auto Focusing (AF) carrier disposed in the interior space of the housing and housing a lens barrel; a lens holder to which the lens barrel is fixed and accommodated in the AF carrier; an Optical Image Stabilization (OIS) driver configured to drive the lens holder to move in a first direction or a second direction perpendicular to an optical-axis, wherein the first direction and the second direction are perpendicular to each other within the AF carrier; and an OIS stopper including an inward protrusion protruding from one inner surface of the housing in the first direction towards the lens holder, and an outward protrusion protruding from one outer surface of the lens holder towards the one inner surface of the housing and opposite the inward protrusion in the second direction.
    Type: Application
    Filed: February 14, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sanghun HAN, Soo Cheol LIM, Kum-Kyung LEE
  • PRINTED CIRCUIT BOARD
    Publication number: 20240074057
    Abstract: A printed circuit board includes a first insulating layer; a through-hole penetrating a region between an upper surface and a lower surface of the first insulating layer; a first via disposed in at least a portion of the through-hole; a first pad connected to an upper side of the first via; and a second pad connected to a lower side of the first via. A width of the through-hole on an uppermost side is greater than a width of the first pad. At least a portion of an upper surface of the first via exposed from the first pad is recessed below the upper surface of the first insulating layer.
    Type: Application
    Filed: January 31, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Man Gon KIM
  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20240071690
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100?Cc2/Cc1?10,000.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop KIM, Jin Il KANG, Ji Hun LEE, Chang Hak CHOI
  • REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
    Publication number: 20240074065
    Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
    Type: Application
    Filed: February 17, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae YOO, Yong Gil NAMGUNG, Jong Hoon SHIN, Sang Soon CHOI, Young Chul AN
  • Optical imaging system
    Patent number: 11914118
    Abstract: An optical imaging system includes a first lens group, a second lens group, and a third lens group, sequentially arranged from an object side, wherein the first lens group includes two lenses having negative and positive refractive power, the second lens group includes a plurality of lenses, and the third lens group includes two lenses having negative and positive refractive power.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: February 27, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hag Chul Kim, Phil Ho Jung, Yong Joo Jo
  • Optical system
    Patent number: 11914104
    Abstract: An optical system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens. The first lens includes an object-side surface that is convex with a meniscus shape. The second lens includes an image-side surface that is convex. The third lens includes an image-side surface that is concave. The fifth lens includes an image-side surface that is concave. The first to sixth lenses are sequentially disposed from an object side to an image side.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: February 27, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Ho Sik You
  • Multilayer electronic component
    Patent number: 11915875
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Dong Lee, Og Soon Kim, Hye Won Kim, Jung Won Park
  • Optical imaging system
    Patent number: 11914224
    Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of an image sensor, wherein TTL/(2*IMG HT)?0.67 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane of the image sensor, and IMG HT is one half of a diagonal length of the imaging plane of the image sensor, and 15<v1-v3<45 is satisfied, where v1 is an Abbe number of the first lens, and v3 is an Abbe number of the third lens.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: February 27, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kil Soo Shin, Yong Joo Jo