Patents Assigned to SAMSUNG ELECTRONIC CO.
  • Publication number: 20240021129
    Abstract: A driving device of a display panel includes a reference voltage generator, a capacitor circuit, and a gamma voltage generator. The reference voltage generator is configured to generate a maximum gamma voltage and a minimum gamma voltage. The capacitor circuit is configured to, response to receiving the first driving voltage, charge a first charge based on a voltage difference between a first driving voltage and the maximum gamma voltage and charge a second charge based on a voltage difference between the first driving voltage and the minimum gamma voltage. The capacitor circuit is configured to, in response to receiving a second driving voltage, output a first gamma reference voltage and a second gamma reference voltage. The gamma voltage generator is configured to generate a plurality of gamma voltages based on the first gamma reference voltage and the second gamma reference voltage.
    Type: Application
    Filed: December 5, 2022
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Minsung KIM, Seung-Hoon BAEK
  • Publication number: 20240021169
    Abstract: A display apparatus is provided. The display apparatus includes: a communication interface including a circuit; a display panel configured to be selectively driven at any one of a plurality of frame rates; and a processor configured to: identify an input frame rate of a video, based on the video being received through the communication interface, adjust a setting value of the display panel so that the display panel operates at a frame rate among the plurality of frame rates that corresponds to the input frame rate, and control the display panel to output the received video, by driving the display panel at the frame rate corresponding to the input frame rate.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngseok HAN, Sunghwan JANG, Hyehyun HEO, Beomjoon KIM, Ubin KIM
  • Publication number: 20240021577
    Abstract: In some embodiments, a semiconductor package includes a package substrate, a plurality of semiconductor chips on the package substrate, a plurality of interposers between the package substrate and the plurality of semiconductor chips, and a molding layer in contact with the plurality of semiconductor chips and the plurality of interposers. The plurality of semiconductor chips includes a first semiconductor chip, and a second and a third semiconductor chip spaced apart from the first semiconductor chip in horizontal directions. The plurality of interposers includes a first vertical connection interposer vertically overlapping the first semiconductor chip, a second vertical connection interposer vertically overlapping the second semiconductor chip, a first horizontal connection interposer vertically overlapping the first and the second semiconductor chips, and a second horizontal connection interposer vertically overlapping the second and the third semiconductor chips.
    Type: Application
    Filed: March 14, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yanggyoo Jung, Seokgeun Ahn, Younglyong Kim
  • Publication number: 20240022285
    Abstract: An electronic device includes a power line communication circuit configured to perform power line communication with an external device, the power line communication circuit including: a power line switch provided between a regulator output node and a POGO output node; and a pull-up resistance provided between the POGO output node and a power supply voltage; and a processor configured to control the power line communication circuit, wherein the processor is further configured to: based on receiving a start signal instructing an initiation of high-speed communication, turn off the power line switch to block an electrical coupling between the regulator output node and the POGO output node, and perform the high-speed communication with the external device by connecting coupling the POGO output node to the power supply voltage through the pull-up resistance or connecting coupling the POGO output node to a ground voltage, based on according to output data.
    Type: Application
    Filed: April 12, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minkyu KWON, Guntak KWAK, Dongjoon KIM, Hyoungseok OH
  • Publication number: 20240017269
    Abstract: A food disposer and an operating method of a food disposer. The method includes measuring a distance from a distance sensing module to a by-product stored in a storage container, through the distance sensing module, which is arrangeable relative to a cover that seals an upper portion of the storage container and spaced apart from a transfer pipe by a certain distance, and outputting a notification related to emptying of the by-product from the storage container based on the measured distance being less than or equal to a critical distance.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Mijo KANG, Jungwon CHOI, Kyungah CHANG
  • Publication number: 20240021022
    Abstract: Provided is an electronic device. The electronic device may include a display, a fingerprint sensor provided in an area of the display, and at least one processor. The at least one processor may receive a user input for fingerprint registration, based on the user input, control the display to display a first user interface displaying information to guide a position for a touch input based on a position of the fingerprint sensor at a first position on the display, and based on receiving a first touch on the first user interface, control the display to display a second user interface indicating a degree of a fingerprint recognition related to the first touch.
    Type: Application
    Filed: May 1, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mijung PARK, Hyeonho KIM, Soyoung PARK, Jinwook KANG, Yangsoo LEE, Hyemi LEE, Kangwook HER
  • Publication number: 20240023177
    Abstract: An electronic device includes a processor configured to: obtain a Connected Isochronous Group (CIG) event including a first Connected Isochronous Stream (CIS) event and a second CIS event at least partially overlapped with at least a part of the first CIS event; identify first data indicating a quality of a first link (with a first external device) for the first CIS event and second data indicating a quality of a second link (with a second external device) for the second CIS event; transmit, based on the first data and the second data either a first packet to the first external device or a second packet to the second electronic device.
    Type: Application
    Filed: February 24, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gupil CHEONG, Doosuk KANG, Gibeom KIM, Hocheol SEO, Hyungseoung YOO, Siejoon CHO, Juyeon JIN, Junsu CHOI
  • Publication number: 20240021255
    Abstract: A method of detecting, by a nonvolatile memory system, a defective memory cell block from among memory cell blocks, includes performing, after performing an erase operation, a read operation on at least some memory cells included in a target memory cell block based on an off-cell detection voltage that is different from a read reference voltage that distinguishes an off-cell on which no data is written from an on-cell on which data is written; counting a number of hard off-cells having a higher threshold voltage than the off-cell detection voltage from among the memory cells based on a result of performing the read operation; and identifying whether the target memory cell block is a defective memory cell block based on the number of counted hard off-cells.
    Type: Application
    Filed: July 21, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myungnam Lee, Daehan Kim, Wontaeck Jung
  • Publication number: 20240022214
    Abstract: A wide-band low-noise amplifier structure for removing an out-of-band blocker includes a transconductance pre-amplifier stage configured to convert a voltage signal into a current signal, a filter stage including a main path and an auxiliary path connected in parallel, the main path passing a first signal including all of the current signal, and the auxiliary path passing a second signal including only an out-of-band portion of the current signal, and a combination stage configured to output a third signal corresponding to a difference between the first signal and the second signal, the third signal including only an in-band portion of the current signal.
    Type: Application
    Filed: June 20, 2023
    Publication date: January 18, 2024
    Applicants: Samsung Electronics Co., Ltd., The Industry & Academic Cooperation In Chungnam National University (IAC)
    Inventors: Junghwan HAN, Pillseong KANG, Juhui JEONG
  • Publication number: 20240021676
    Abstract: A semiconductor device includes a channel including a two-dimensional (2D) semiconductor material, a source electrode and a drain electrode electrically connected to opposite sides of the channel, respectively, a transition metal oxide layer on the channel and including a transition metal oxide, a dielectric layer on the transition metal oxide layer and including a high-k material, and a gate electrode on the dielectric layer.
    Type: Application
    Filed: June 8, 2023
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Changhyun KIM, Minsu SEOL, Junyoung KWON, Keunwook SHIN, Minseok YOO
  • Publication number: 20240021679
    Abstract: A semiconductor device may include a two-dimensional material layer including a two-dimensional semiconductor material having a polycrystalline structure; metallic nanoparticles partially on the two-dimensional material layer; a source electrode and a drain electrode respectively on both sides of the two-dimensional material layer; and a gate insulating layer and a gate electrode on the two-dimensional material layer between the source electrode and the drain electrode.
    Type: Application
    Filed: July 11, 2023
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Minsu SEOL, Junyoung KWON, Keunwook SHIN, Minseok YOO
  • Publication number: 20240020450
    Abstract: Disclosed is a method for fabricating of a semiconductor device. The method includes receiving a first layout including patterns for the fabrication of the semiconductor device, performing machine learning-based process proximity correction (PPC) based on features of the patterns of the first layout to generate a second layout, and performing optical proximity correction (OPC) on the second layout to generate a third layout.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sooyong LEE, Jeeyong LEE, Jaeho JEONG
  • Publication number: 20240021056
    Abstract: According to an embodiment, a processor of an electronic device is configured to identify the direction of the electronic device using a sensor of the electronic device. The processor outputs an acoustic signal representing a vibration notification for a preset event through a speaker of the electronic device, based on identifying a direction corresponding to a reference direction for representing the vibration notification for the preset event using the speaker. The processor is configured to refrain from outputting the acoustic signal through the speaker based on identifying the direction different from the reference direction, and vibrate the housing using the haptic actuator of the electronic device to output the vibration notification regarding the preset event.
    Type: Application
    Filed: April 28, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taekyun KIM, Jeongwook KWON, Taeuk PARK, Sangheon KIM, Yeunwook LIM
  • Publication number: 20240019912
    Abstract: Disclosed is an SSD case which includes a contact gasket formed of a conductive material having elasticity and provided in a space so as to be brought into contact with an upper case and a lower case. The contact gasket includes a lower case contact part that makes contact with the lower case and an upper case contact part that extends from the lower case contact part and makes contact with the upper case. One of the lower case contact part and the upper case contact part is fixedly fastened to the lower case or the upper case in contact therewith, and a contact protrusion that protrudes toward the lower case or the upper case such that an end is brought into contact with the lower case or the upper case is formed on the other one of the lower case contact part and the upper case contact part.
    Type: Application
    Filed: January 26, 2023
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jihye CHA, Jiyong KIM
  • Publication number: 20240023336
    Abstract: The present disclosure provides for apparatuses and systems including integrated circuit devices. In some embodiments, an integrated circuit device includes a semiconductor substrate including a memory cell area and a connection area, a gate stack including a plurality of word line gate layers and a plurality of insulating layers and having a step structure in the connection area, a word line cut region passing through the plurality of word line gate layers in the memory cell area and the connection area and extending in a third direction, a plurality of first channel structures disposed on the memory cell area, a string select line gate layer disposed on the gate stack in the memory cell area, a plurality of second channel structures passing through the string select line gate layer, and a string select line cut region passing through the string select line gate layer.
    Type: Application
    Filed: June 21, 2023
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kangmin Kim, Seungje Oh, Joohang Lee
  • Publication number: 20240019943
    Abstract: A user interface device and method for controlling a screen by a wheel input signal in a display device. The display device, based on wheel events that continuously occur according to manipulation of a wheel input device by a user reaching a reference number, obtains an average interval of intervals between occurrence times at which the wheel events occur, respectively. The display device displays a result of performing a continuous operation through a display based on the obtained average interval being shorter than a reference interval.
    Type: Application
    Filed: April 21, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junho JUNG, Sungjin SON, Minwoo LEE, Jooheon LEE, Hyunseok CHA
  • Publication number: 20240021608
    Abstract: Disclosed is a semiconductor package including: a redistribution substrate; at least one passive device in the redistribution substrate, the passive device including a first terminal and a second terminal; and a semiconductor chip on a top surface of the redistribution substrate, the semiconductor chip vertically overlapping at least a portion of the passive device, wherein the redistribution substrate includes: a dielectric layer in contact with a first lateral surface, a second lateral surface opposite to the first lateral surface, and a bottom surface of the passive device; a lower conductive pattern on the first terminal; a lower seed pattern provided between the first terminal and the conductive pattern, and directly connected to the first terminal; a first upper conductive pattern on the second terminal and a first upper seed pattern provided between the second terminal and the first upper conductive pattern, and directly connected to the second terminal
    Type: Application
    Filed: September 29, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung Lim SUK, Seokhyun LEE, Jaegwon JANG
  • Publication number: 20240021675
    Abstract: A semiconductor device includes: first and second channel structures spaced apart from each other in a first direction; and a source/drain pattern, between the first and second channel structures, including a first interface contacting the first channel structure and a second interface contacting the second channel structure, wherein, in a plan view, the source/drain pattern includes first and second side walls opposite to each other in a second direction, the first side wall includes a first sloped side wall, a second sloped side wall, and a first horizontal intersection at which the first and second sloped side walls meet, a width of the first interface is different from a width of the second interface, in the second direction, and a distance from the first interface to the first horizontal intersection is greater than a distance from the second interface to the first horizontal intersection, in the first direction.
    Type: Application
    Filed: March 23, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nam Kyu CHO, Seok Hoon KIM, Jung Taek KIM, Pan Kwi PARK, Seo Jin JEONG
  • Publication number: 20240022655
    Abstract: An electronic device includes: a side bezel structure including a first body surrounding an inner space of the device, and a second body extending from the first body into the inner space and including a through hole; a plate including a support portion within the inner space; a protrusion portion extending from the support portion into the through hole, the protrusion portion being coupling to the second body and corresponding to the through hole; and a conductive adhesive member coupling the through hole and the protrusion portion, which is disposed between the through hole and the protrusion portion. An area of the protrusion portion contacting one surface of the second body toward the support portion is narrower than an area of the protrusion portion contacting another surface of the second body.
    Type: Application
    Filed: June 1, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungduck PARK, Kwondeuk Yoon, Kitae Park, Yunho Son, Jaehoon Yoon, Cheolwoong Yoon, Youngsoo Kim, Kidoc Son, Hyunsuk Choi, Yongduk Kwon, Jongbo Kim
  • Publication number: 20240020798
    Abstract: A method and device for generating an all-in-focus image are disclosed. A method of generating an all-in-focus image includes obtaining a scene image and a phase detection image by capturing a scene using a phase detection image sensor; determining a blur kernel based on the phase detection image and a particular mapping relationship indicating a depth and a blur kernel distribution; and generating the all-in-focus image by deblurring the scene image using the blur kernel.
    Type: Application
    Filed: September 28, 2022
    Publication date: January 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Jingyu FANG