Patents Assigned to SAMSUNG ELECTRONIC CO.
  • Patent number: 11874668
    Abstract: A robot vacuum cleaner is provided. The robot vacuum cleaner includes a camera, a memory configured to store an artificial intelligence model trained to identify an image from an input image and shape information corresponding to each of a plurality of objects, and a processor configured to control the electronic apparatus by being connected to the camera and the memory, wherein the processor is configured to input an image obtained by the camera to the artificial intelligence model to identify an object included in the image, obtain shape information corresponding to the identified object among the plurality of shape information stored in the memory, and set a traveling path of the robot vacuum cleaner based on the shape information and size information related to the object.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sukhoon Song, Kyongsu Kim, Injoo Kim, Dongmin Shin, Shin Kim
  • Patent number: 11875816
    Abstract: An electronic device and a method for controlling thereof is provided. The electronic device includes a memory storing a neural network model and a processor configured to input, to the neural network model, input data to obtain output data, and, based on comparison between first output data based on input first modality and second output data based on input second modality, in response to the second modality being input, the neural network model is trained to output the first modality corresponding to the first output data, and the second modality may include at least one masking element.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Kangwook Lee
  • Patent number: 11875855
    Abstract: A memory device including: a memory cell array disposed in a first semiconductor layer, the memory cell array including a plurality of wordlines extended in a first direction and stacked in a second direction substantially perpendicular to the first direction; and a plurality of pass transistors disposed in the first semiconductor layer, wherein a first pass transistor of the plurality of pass transistors is disposed between a first signal line of a plurality of signal lines and a first wordline of the plurality of wordlines, and wherein the plurality of signal lines are arranged at the same level as a common source line.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyunghwa Yun, Chanho Kim, Pansuk Kwak
  • Patent number: 11876038
    Abstract: A semiconductor device includes a substrate provided with an integrated circuit and a contact, an interlayer dielectric layer covering the integrated circuit and the contact, a through electrode penetrating the substrate and the interlayer dielectric layer, a first intermetal dielectric layer on the interlayer dielectric layer, and first and second wiring patterns in the first intermetal dielectric layer. The first wiring pattern includes a first conductive pattern on the through electrode, and a first via penetrating the first intermetal dielectric layer and connecting the first conductive pattern to the through electrode. The second wiring pattern includes a second conductive pattern on the contact, and a second via penetrating the first intermetal dielectric layer and connecting the second conductive pattern to the contact. A first width in a first direction of the first via is greater than a second width in the first direction of the second via.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shaofeng Ding, Jeong Hoon Ahn, Yun Ki Choi
  • Patent number: 11876534
    Abstract: A method may include, and/or a device may be configured for: receiving, from a transmitting device, a signal corresponding to input bits; performing demodulation based on the signal to determine values corresponding to the input bits; identifying a number of the input bits based on the signal; identifying a base matrix and a lifting size based on the number of the input bits; identifying a parity check matrix based on the base matrix; determining a number of layers based on the lifting size and a number of the values; determining an order of layers for low density parity check (LDPC) decoding based on the number of layers; and performing the LDPC decoding to determine the input bits based on the values, the parity check matrix, and the order of layers.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seho Myung, Min Jang, Yangsoo Kwon, Jeongho Yeo, Hongsil Jeong
  • Patent number: 11875992
    Abstract: Semiconductor devices are provided. A semiconductor device includes a first portion of a lower electrode structure on a substrate. The semiconductor device includes a first support pattern being in contact with a first portion of a sidewall of the first portion of the lower electrode structure. The semiconductor device includes a second portion of the lower electrode structure on a second portion of the sidewall of the first portion of the lower electrode structure. The semiconductor device includes an upper electrode on the second portion of the lower electrode structure and on the first support pattern. Moreover, the semiconductor device includes a dielectric layer between the upper electrode and the second portion of the lower electrode structure.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Suk Lee, Jungoo Kang, Gihee Cho, Sanghyuck Ahn
  • Patent number: 11875003
    Abstract: An electronic device and method are disclosed. The electronic device includes a communication circuit, a sensor circuit, a digitizer panel, and a processor. The processor implements the method, including: detecting whether an electronic pen is detached from the electronic device via the sensor circuit, activating the digitizer panel based on detecting detachment of the electronic pen from the electronic device, identifying a state of the electronic pen through a communication linkage with the electronic pen via the communication circuit, and deactivate the activated digitizer panel based on the identified state of the electronic pen.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chaehoon Lim, Dusun Choi
  • Patent number: 11877204
    Abstract: An electronic apparatus according to various embodiments comprises: a wireless communication circuit comprising a broadband communication module and a Bluetooth communication module; a processor; and a memory operationally connected to the wireless communication circuit, wherein the memory may store instructions for controlling the processor, when executed, to measure a distance from a mobile device on the basis of a first signal transmitted and received through the broadband communication module, determine a direction in which the mobile device is located according to whether a second signal transmitted and received through the Bluetooth communication module is measurable, and control execution of a function of the electronic apparatus according to the determined direction of the mobile device when the measured distance of the mobile device is located in an area set for the execution of the function.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungho Ahn, Yongjun Son, Saegee Oh, Jun Yoo, Jaeil Joo
  • Patent number: 11877383
    Abstract: An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.
    Type: Grant
    Filed: March 21, 2023
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gihoon Lee, Seunggoo Kang, Yonghwa Kim, Hongjun Kim, Wangik Son, Jaehwan Lee, Seungbum Choi, Jaedeok Lim
  • Patent number: 11875716
    Abstract: A dual source driver includes first and second gamma voltage generators configured to generate first and second gamma voltages, respectively, first and second latches configured to latch first and second data, respectively, a first driving cell configured to receive the first gamma voltage and the first data, and to transmit a first voltage corresponding to the first data and the first gamma voltage to a panel load based on a first switching operation, and a second driving cell configured to receive the second gamma voltage and the second data, and to transmit a second voltage corresponding to the second data and the second gamma voltage to the panel load based on a second switching operation. The first switching operation and the second switching operation may operate complementarily to each other.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungho Lee, Hohak Rho, Junjae Lee
  • Patent number: 11876083
    Abstract: Provided is a semiconductor package comprising a lower package that includes a lower substrate and a lower semiconductor chip, an interposer substrate on the lower package and having a plurality of holes that penetrate the interposer substrate, a thermal radiation structure that includes a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate, and a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dongho Kim, Ji Hwang Kim, Hwan Pil Park, Jongbo Shim
  • Patent number: 11875761
    Abstract: A display driving circuit includes a frame rate extractor configured to receive a vertical synchronization signal indicating a start of a k-th frame, k-th frame data including information about the k-th frame, and a data enable signal indicating an active period of the k-th frame and a variable blank period that occurs after the active period, and extract a frame rate of the k-th frame, based on the vertical synchronization signal; and an image corrector configured to correct frame data received after reception of the k-th frame data, based on the frame rate of the k-th frame, and output the corrected frame data as output image data, wherein the vertical synchronization signal is received before a start time point of the active period.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyuchan Lee, Pureum Ryoo, Hyoungpyo Lee, Junghyun Lim
  • Patent number: 11875255
    Abstract: A method of processing data in a neural network, includes identifying a sparsity of input data, based on valid information included in the input data in which the input data includes valid values and invalid values, generate rearranged input data, based on a form of the sparsity by rearranging, in the input data, location of at least one of the valid values and the invalid values, and generating, by performing a convolution on the rearranged input data in the neural network, an output.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyunsun Park, Yoojin Kim, Hyeongseok Yu, Sehwan Lee, Junwoo Jang
  • Patent number: 11873424
    Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a first plate, a second plate facing in the opposite direction as the first plate, and side members surrounding the space between the second plate and the second plate; a printed circuit board which is disposed within the space and on which at least one electrical component is mounted; a shield can mounted on the printed circuit board and disposed to surround the at least one electrical component; and an insulating tape member attached to the inner surface of the shield can between the shield can and the electrical component. The insulating tape member may include: a first layer including a first material and formed to a first thickness; a second layer laminated on the first layer by means of an adhesive, including a second material, and formed to a second thickness that is the same as or thicker than the first thickness; and an adhesive layer formed on the second layer and for being attached to the shield can.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Daum Hwang, Sangin Baek
  • Patent number: 11877336
    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The disclosure is to configure configuration parameter information of a sidelink radio bearer in a wireless communication system.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyunjeong Kang, Sangkyu Baek, Sangyeob Jung
  • Patent number: D1011329
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Namkyu Kim, Bumsoo Park
  • Patent number: D1011341
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ju-Suek Lee, Hyun-Taik Lim, Damian Tome Calvo
  • Patent number: D1011389
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seonju Lee, Cheolwoong Seo, Seungwook Suh, Selim Yoon
  • Patent number: D1011660
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jinsook Park, Junkyo Lee, Jichang Kang
  • Patent number: RE49807
    Abstract: A method and apparatus provide a user equipment (UE) configured to communicate with a plurality of carrier aggregation (CA) groups with at least a first CA group (CG1) and a second CA group (CG2). The UE includes processing circuitry. The processing circuitry is configured to determine whether the UE is power-limited. The UE is scheduled to transmit acknowledged information in a physical uplink shared channel (PUSCH) to a cell of the CG1 and uplink control information (UCI), other than the acknowledgement information, in a physical uplink control channel (PUCCH) to a cell of the CG2. The processing circuitry is also configured to, responsive to the UE being power-limited, prioritize the PUSCH for power allocation. The processing circuitry is also configured to transmit the PUSCH to the cell of the CG1.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Han Nam, Aris Papasakellariou, Boon Loong Ng, Jianzhong Zhang