Patents Assigned to Samsung Electronics and Co., Ltd.
  • Patent number: 11901422
    Abstract: A semiconductor device includes a source/drain region in a fin-type active pattern, a gate structure adjacent to the source/drain region, and an insulating layer on the source/drain region and the gate structure. A shared contact plug penetrates through the insulating layer and includes a first lower portion connected to the source/drain region, a second lower portion connected to the gate structure, and an upper portion connected to upper surfaces of the first lower portion and the second lower portion. A plug spacer film is between the insulating layer and at least one of the first lower portion and the second lower portion and includes a material different from a material of the insulating layer.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Deok Han Bae, Hyung Jong Lee, Hyun Jin Kim
  • Patent number: 11898244
    Abstract: A method of forming a lithium (Li)-based film, may include: supplying a Li source material into a reaction chamber in which a substrate is disposed; supplying phosphor (P) and oxygen (O) source materials and a nitrogen (N) source material into the reaction chamber; and generating plasma in the reaction chamber to form a Li-based film on the substrate from the Li, P, O, and N source materials, wherein the supplying of the Li source material into the reaction chamber and the supplying of the P and O source materials and the N source material into the reaction chamber are performed with a time interval, and wherein the Li source material supplied into the reaction chamber is deposited on the substrate, and the P and O source materials supplied into the reaction chamber are adsorbed on the Li source material.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jooho Lee, Yongsung Kim, Sanghoon Song, Wooyoung Yang, Changseung Lee, Sungjin Lim, Junsik Hwang
  • Patent number: 11901363
    Abstract: Resistance measuring structures for a stacked integrated circuit device are provided. The resistance measuring structures may include a first Complementary Field Effect Transistor (CFET) stack, a second CFET stack, and a conductive connection. The first CFET may include a first upper transistor that includes a first upper drain region and a first lower transistor that is between the substrate and the first upper transistor and includes a first lower drain region. The second CFET may include a second upper transistor that includes a second upper drain region and a second lower transistor that is between the substrate and the second upper transistor and includes a second lower drain region. The conductive connection may electrically connect the first upper drain region and the second upper drain region.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byounghak Hong, Seunghyun Song, Myunggil Kang, Kang-Ill Seo
  • Patent number: 11900570
    Abstract: An image processing system includes a memory configured to store a plurality of reference images used for image quality tuning, an image signal processor configured to receive a plurality of captured images corresponding to the plurality of reference images and configured to generate a plurality of corrected images by being configured to perform a corresponding image processing operation among a plurality of image processing operations, and a tuning module configured to set parameters of the plurality of image processing operations based on the plurality of corrected images and the plurality of reference images.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyounghwan Moon, Jungyeob Chae
  • Patent number: 11900043
    Abstract: Disclosed is an operating method of an electronic device which includes receiving a design layout for manufacturing the semiconductor device, generating a first layout by performing machine learning-based process proximity correction (PPC), generating a second layout by performing optical proximity correction (OPC), and outputting the second layout for a semiconductor process. The generating of the first layout includes generating a first after cleaning inspection (ACI) layout by executing a machine learning-based process proximity correction module on the design layout, generating a second after cleaning inspection layout by adjusting the design layout based on a difference of the first after cleaning inspection layout and the design layout and executing the process proximity correction module on the adjusted layout, and outputting the adjusted layout as the first layout, when a difference between the second after cleaning inspection layout and the design layout is smaller than or equal to a threshold value.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sooyong Lee, Dongho Kim, Sangwook Kim, Jungmin Kim, Seunghune Yang, Jeeyong Lee, Changmook Yim, Yangwoo Heo
  • Patent number: 11903080
    Abstract: Methods and apparatuses in a wireless communication system. A method of operating a first UE includes: determining whether to initiate a SL DRX operation for a SL groupcast/broadcast operation; identifying at least one of a SL DRX cycle length, a SL DRX start offset, and SL DRX timers for the SL groupcast/broadcast operation; identifying, based on at least one of a destination ID and the SL DRX start offset, a time instance in which a SL DRX cycle starts, wherein the time instance comprises at least one of a slot, a subframe, and a frame; and receiving, from a second UE belongs to the destination ID, a PSCCH and a PSSCH based on the at least one of the SL DRX cycle length, the SL DRX start offset, the destination ID, and the SL DRX timers.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyeongin Jeong, Emad N. Farag
  • Patent number: 11898910
    Abstract: A Raman sensor includes a light source assembly having a plurality of light sources configured to emit light to a plurality of skin points of skin, each of the plurality of skin points having a predetermined separation distance from a light collection region of the skin from which Raman scattered light is collected; a light collector configured to collect the Raman scattered light from the light collection region of the skin; and a detector configured to detect the collected Raman scattered light.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho Jun Chang, Sung Hyun Nam, Alexey Anikanov, Yun S Park, Eui Seok Shin, Woochang Lee
  • Patent number: 11900929
    Abstract: According to an embodiment of the disclosure, an electronic device may include a speaker, a microphone, a wireless communication circuit, and at least one processor connected to the speaker, the microphone, and the wireless communication circuit. The at least one processor may be configured to: in response to a user's voice command received through the microphone, perform a task corresponding to the voice command, based on an information amount contained in a result of the task, determine a type of the result to be visually appropriate or auditorily appropriate, and based on the type of the result, determine a device for providing the result as a screen device or a speaker.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongho Kim, Hyunjin Kim, Sunah Kim, Dayoung Lee, Jaeyoung Lee, Jungkun Lee
  • Patent number: 11898912
    Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungho Jang, Jungchul Lee, Jinseob Kim, Gwangsik Park, Minhwan Seo, Janghwi Lee, Wondon Joo, Jiyoung Chu, Daehoon Han
  • Patent number: 11903038
    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Embodiments of the present invention provide a method for RACH re-attempt, a user equipment and a base station.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yingjie Zhang, Bin Yu, Chen Qian, Di Su, Qi Xiong, Jingxing Fu
  • Patent number: 11900939
    Abstract: A display apparatus includes an input unit configured to receive a user command; an output unit configured to output a registration suitability determination result for the user command; and a processor configured to generate phonetic symbols for the user command, analyze the generated phonetic symbols to determine registration suitability for the user command, and control the output unit to output the registration suitability determination result for the user command. Therefore, the display apparatus may register a user command which is resistant to misrecognition and guarantees high recognition rate among user commands defined by a user.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nam-yeong Kwon, Kyung-mi Park
  • Patent number: 11901385
    Abstract: A semiconductor package includes a semiconductor chip structure that includes an image sensor chip and a logic chip that contact each other, a transparent substrate disposed on the semiconductor chip structure, and an adhesive structure disposed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate. The adhesive structure includes a first adhesive segment disposed on a top surface of the semiconductor chip structure and a second adhesive segment disposed on a bottom surface of the transparent substrate. The second adhesive segment covers top and lateral surfaces of the first adhesive segment. The image sensor chip is closer to the transparent substrate than the logic chip.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO, LTD.
    Inventor: Byoungrim Seo
  • Patent number: 11901386
    Abstract: An image sensor includes a first region and a second region surrounding the first region. A substrate includes a first surface and a second surface that is opposite to the first surface. A photoelectric conversion element is disposed on the substrate. A passivation layer is disposed on the first surface of the substrate. A microlens is disposed on the passivation layer in the first region and is not disposed on the passivation layer in the second region. A pattern structure is disposed on an upper surface of the passivation layer in the second region. The pattern structure includes a metal and has at least one lateral side wall having a sloped profile.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyeong Jae Byeon, Byung Jun Park, Jin Pyo Kim
  • Patent number: 11900166
    Abstract: Provided herein are an electronic apparatus and a controlling method thereof. An electronic apparatus according to the disclosure includes a communicator, a memory storing information on a recipe wherein a plurality of unit functions for provision of a service are combined, and a processor configured to, based on receiving information for a unit function that can be performed at each electronic apparatus from each of a plurality of electronic apparatuses through the communicator, identify a plurality of electronic apparatuses matched to the plurality of unit functions included in the recipe based on the received information, and control the communicator to transmit a signal for performing each matched unit function to each of the plurality of identified electronic apparatuses.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jeonghoon Park
  • Patent number: 11900015
    Abstract: An electronic device is provided.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bongkyu Kim, Jinbong Ryu, Jongmoon Park, Myeongseok Lee, Sanghun Lee, Saetbyeol Lee
  • Patent number: 11901269
    Abstract: A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member; a capping metal layer disposed directly between the heat-dissipating member and the encapsulant; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the heat-dissipating member includes holes passing through at least a portion of the heat-dissipating member, and the holes overlap the inactive surface of the semiconductor chip.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seongchan Park, Sanghyun Kwon, Hyungkyu Kim, Han Kim, Choonkeun Lee, Seungon Kang
  • Patent number: 11903206
    Abstract: A three-dimensional semiconductor device includes an upper substrate, a gate-stacked structure on the upper substrate, the gate-stacked structure including gate electrodes stacked within a memory cell array region, while being spaced apart from each other in a direction perpendicular to a surface of the upper substrate, and extending into an extension region adjacent to the memory cell array region to be arranged within the extension region to have a staircase shape, and at least one through region passing through the gate-stacked structure within the memory cell array region or the extension region, the at least one through region including a lower region and an upper region wider than the lower region.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Seon Ahn, Ji Sung Cheon, Young Jin Kwon, Seok Cheon Baek, Woong Seop Lee
  • Patent number: 11901631
    Abstract: An electronic device according to various embodiments may include: a column-shaped housing including a processor and a communication module comprising communication circuitry disposed therein; a rollable display wound on a column face of the housing, wherein a printed circuit board is disposed on the housing; an array antenna mounted or embedded on the printed circuit board as a module; and a director unit including at least one director comprising a conductive material corresponding to a beam being formed by the array antenna and disposed on at least a part of the rollable display in a state in which the rollable display is wound.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyihyun Jang, Sumin Yun, Kyunggu Kim, Kyungmoon Seol, Jinwoo Jung, Jaebong Chun
  • Patent number: D1014484
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dawi Lee, Yoonyoung Kim, Bumsoo Park
  • Patent number: D1014550
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jihyun Lee, Joonil Park, Jina Lee