Patents Assigned to Samsung Electronics Co., Ltd. and
  • Storage controller compressing indicator data, storage device including the same, and method of operating the same
    Patent number: 12019871
    Abstract: A method of operating a storage controller includes receiving raw data indicating a series of bits each corresponding to one of threshold voltage states, performing a first state shaping for reducing a number of first target bits of the series of bits, logical values of the first target bits being equal to a logical value of a target threshold voltage state of the threshold voltage states in a first page of plural pages, generating first indicator data that indicates the first target bits based on the first state shaping, compressing the first indicator data, and storing the compressed first indicator data.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngsuk Ra, Hanbyeul Na, Kwanwoo Noh, Mankeun Seo, Hong Rak Son, Jae Hun Jang
  • Plasma processing apparatus and plasma processing method
    Patent number: 12020909
    Abstract: A plasma processing apparatus includes a chamber providing a space for processing a substrate, a substrate stage configured to support the substrate within the chamber and including a lower electrode, an upper electrode facing the lower electrode, a focus ring in or on an upper peripheral region of the substrate stage to surround the substrate, and a plasma adjustment assembly in at least one of a first position between the upper electrode and the lower electrode and a second position between the focus ring and the lower electrode, the plasma adjustment assembly including a photoreactive material layer and a plurality of light sources configured to irradiate light onto a local region of the photoreactive material layer. A capacitance of the local region is changed as the light is irradiated to the local region.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Yeob Lee, Sungyeol Kim, Jinyeong Yun, Minsung Kim, HoSun Yoo
  • Semiconductor package including interposer and method of manufacturing the semiconductor package
    Patent number: 12021036
    Abstract: A semiconductor package comprises a package substrate, a semiconductor chip on the package substrate, and an interposer substrate on the semiconductor chip. The interposer substrate comprises a first surface facing the semiconductor chip and a trench in the first surface, the trench vertically overlapping the semiconductor chip. An insulating filler is provided between the semiconductor chip and the interposer substrate, and at least partially fills the trench of the interposer substrate.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jongbo Shim, Jihwang Kim, Choongbin Yim
  • Apparatus and methods for multi-sensor SLAM systems
    Patent number: 12019147
    Abstract: An electronic device includes a Lidar sensor, a radar sensor, and a processor. The processor is configured to identify one or more objects from Lidar scans. The processor is configured to transmit, via the radar sensor, radar signals for object detection based on reflections of the radar signals received by the radar sensor. While the electronic device travels the area, the processor is configured to generate a first map indicating one or more objects within an area based on the Lidar scans and a second map based on the radar signals. The processor is configured to determine whether the second map indicates a missed object at the portion of the first map that is unoccupied. In response to a determination that the second map indicates the missed object, the processor is configured to modify the first map with the missed object.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Siddharth K. Advani, Neha Dawar, Vitali Loseu, Mandar Kulkarni, Yuming Zhu, Chiyu Zhang, Songwei Li, Jianzhong Zhang
  • Methods and apparatus for efficient blending in a graphics pipeline
    Patent number: 12020349
    Abstract: A method for performing a blending operation in a graphics processing unit may include multiplying a first value and a first blend factor for a component of a render target with a first multiply operation of a multiplier, multiplying a second value and a second blend factor for the component of the render target with a second multiply operation of the multiplier, and adding a first result of the first multiply operation and a second result of the second multiply operation. The method may further include bypassing the multiplier for a first blend factor of substantially zero. The method may further include, for a blend factor of substantially one: bypassing the multiplier, and providing the first value of the component of the render target as a result of the first multiply operation.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Derek J. Lentz, David Tannenbaum
  • Plasma etching method and semiconductor device fabrication method including the same
    Patent number: 12020903
    Abstract: A plasma etching method and a semiconductor device fabrication method, the plasma etching method including providing a source power having a first single pulse to an electrostatic chuck in order to generate a plasma on a substrate; providing a first bias power having a burst pulse different from the first single pulse to concentrate the plasma on the substrate; and providing a second bias power having a second single pulse the same as the first single pulse to accelerate the plasma toward the substrate.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yonghee Kim, Byunghun Han, Hyeongmo Kang, Donghyeon Na, Dougyong Sung, Seungbo Shim, Minjae Lee, Myungsun Choi, Minyoung Hur
  • Device and method of providing audiovisual content for the disabled
    Patent number: 12020560
    Abstract: An electronic device is provided.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaesung Park, Anant Baijal
  • Method and apparatus for modular MIMO
    Patent number: 12021583
    Abstract: A method for operating a user equipment (UE) comprises receiving configuration information about L uplink (UL) reference signals (RSs), M downlink (DL) RSs, and a calibration report, where the L UL RSs are associated with the M DL RSs; transmitting the UL RSs according to the configuration information; measuring the DL RSs; determining, based on the measured DL RSs and a reference DL RS, calibration information; and transmitting the calibration report including the calibration information.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gilwon Lee, Jeongho Jeon, Eko Onggosanusi, Jianzhong Zhang
  • Display module and display apparatus having the same
    Patent number: 12020628
    Abstract: A display module including: a module substrate; a plurality of pixels provided on the module substrate; and a plurality of micro pixel controllers provided in spaces between the plurality of pixels, and configured to supply driving current to at least two pixels of the plurality of pixels, wherein each micro pixel controller of the plurality of micro pixel controllers includes a plurality of pixel circuits configured to, based on a first voltage and a second voltage being applied to the micro controller, control an amplitude of the driving current based on the first voltage and control a pulse width of the driving current based on the second voltage, and, based on the display module being in a power saving mode, the first voltage is adjusted to decrease a brightness of the plurality of pixels.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jongsu Oh, Sangyoung Park
  • Electronic device including structure that reduces vibration in camera module
    Patent number: 12022179
    Abstract: An electronic device includes a first housing including a first surface and a second surface; a second housing including a third surface and a fourth surface; a hinge structure; a camera module disposed within the first housing; and a first magnet disposed within the second housing and facing the camera module. The camera module includes: a case including one surface facing the first surface and the another surface facing the second surface and spaced apart from the first surface; a lens assembly movable within the case; and an actuator accommodating a second magnet and including a carrier configured to move the lens assembly in a direction toward the one surface of the case or a direction toward the other surface of the case; and the first magnet limits the movement of the lens assembly by interaction with the second magnet when the electronic device is in the folding state.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chiyoung Park, Youngsoo Jang, Manho Kim
  • Video encoding method and apparatus, and video decoding method and apparatus using blocks split in various shapes from images
    Patent number: 12022073
    Abstract: A video decoding method includes: determining a largest size of a coding unit and a smallest size of the coding unit by using information about the largest size of the coding unit and information about the smallest size of the coding unit, the information being obtained from a bitstream; obtaining, from the bitstream, information about a largest size of a block allowed to be ternary split and information about a smallest size of the block allowed to be ternary split, determining the largest size of the block allowed to be ternary split, determining the smallest size of the block allowed to be ternary split, determining whether to ternary split a current block, and decoding blocks generated by ternary splitting the current block.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minsoo Park, Minwoo Park, Heechul Yang
  • Non-volatile memory package and storage device comprising the same
    Patent number: 12020765
    Abstract: Provided is a non-volatile memory package that is electrically optimized with a plurality of different non-volatile memory chips through a ball map, by fixing positions of buffer chips connected to the plurality of different non-volatile memory chips.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Woon Park, Joon Ki Paek
  • Semiconductor package having an interposer and method of manufacturing semiconductor package
    Patent number: 12021032
    Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer includes a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yanggyoo Jung, Jinhyun Kang, Sungeun Kim, Sangmin Yong, Seungkwan Ryu
  • Method and device for transmitting and receiving reference signal in millimeter wave wireless communication system
    Patent number: 12021774
    Abstract: The disclosure relates to a method and device for communication between a base station (BS) and a user equipment (UE) in a millimeter wave wireless communication system. An operating method of a BS in a wireless communication system according to an embodiment may include: transmitting, via higher layer signaling, one or more reference signal configurations to a UE so as to transmit a reference signal by using a single carrier; transmitting, to the UE, information about a reference signal configuration to be used for the UE from among the one or more reference signal configurations, via at least one of the higher layer signaling, a physical downlink control channel (PDCCH), or a media access control control element (MAC CE); and transmitting, to the UE, the reference signal via a data channel, based on the information about the reference signal configuration to be used for the UE.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyoungju Ji, Younsun Kim, Heecheol Yang, Juho Lee
  • Semiconductor package and method of manufacturing the semiconductor package
    Patent number: 12021034
    Abstract: A semiconductor package includes an interposer having a first surface and a second surface opposite to the first surface and including a plurality of bonding pads, and first and second semiconductor devices on the interposer. Each of the plurality of bonding pads includes a first pad pattern provided to be exposed from the first surface and having a first width and a second pad pattern provided on the first pad pattern and having a second width greater than the first width.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Solji Song, Byeongchan Kim, Jumyong Park, Jinho An, Chungsun Lee, Jeonggi Jin, Juil Choi
  • Semiconductor device testing and clock recovery
    Patent number: 12021961
    Abstract: A test device includes a comparison circuit configured to receive a plurality of input signals and generate a plurality of comparison signals based on the plurality of input signals; and a field programmable gate array (FPGA) configured to recover clock data, based on the plurality of comparison signals, wherein the FPGA includes a sampling circuit configured to generate a plurality of sample data signals by sampling the plurality of comparison signals; an edge extraction circuit configured to generate a plurality of edge data signals, based on logic values of bits in the plurality of sample data signals; an edge combining circuit configured to generate combined edge data by performing a logic operation on the plurality of edge data signals; and a filter circuit configured to recover the clock data by filtering the combined edge data.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shinki Jeong, Junyeon Won
  • Memory device for reducing row hammer disturbance, and a method of refreshing the same
    Patent number: 12020739
    Abstract: A memory device includes a memory cell array connected to a plurality of wordlines and a plurality of bitlines; a row decoder configured to select a wordline, among the plurality of wordlines, in response to a row address; a column decoder configured to corresponding bitlines, among the plurality of bitlines, in response to a column address; a sense amplification circuit having a plurality of amplifiers connected to the selected corresponding bitlines; a row hammer detector configured to generate a refresh row address when the number of accesses to a row corresponding to the row address is a multiple of a predetermined value; and a refresh controller configured to perform a refresh operation on a row corresponding to the refresh row address. The row corresponding to the refresh row address is disposed adjacent to the row corresponding to the row address.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunghye Cho, Kijun Lee, Eunae Lee
  • Method and apparatus for transmitting and receiving terminal support information in wireless communication system
    Patent number: 12022387
    Abstract: The present disclosure provides a method of transmitting and receiving user equipment (UE) assistance information in a wireless communication system, the method including: receiving, from a base station, information about at least one power saving mode candidate set; selecting at least one of the at least one power saving mode candidate set; transmitting, to the base station, UE assistance information including information about the selected at least one power saving mode candidate; and performing communication with the base station based on a power saving mode determined by the base station based on the UE assistance information.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Taehyoung Kim, Jeongho Yeo, Jinkyu Kang, Youngbum Kim, Seunghoon Choi
  • Electronic device including speaker module
    Patent number: 12022255
    Abstract: According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing accommodating at least a portion of the first housing and configured to guide sliding movement of the first housing, a flexible display including a first display area disposed on the first housing and a second display area extending from the first display area, a speaker module including a speaker unit including at least one speaker disposed in the second housing and a speaker enclosure accommodating the speaker unit and including a vent hole, and a seal connected to the first housing and the speaker enclosure and configured to be variable based on the sliding movement of the first housing.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Choonghyo Park, Kiwon Kim, Myoungsung Sim, Changshik Yoon, Woojin Cho, Joonrae Cho, Hyunggwang Kang, Byounghee Lee, Sangsoo Park, Hochul Hwang
  • Pipe fixing device
    Patent number: RE50023
    Abstract: A pipe fixing device comprising a plurality of pipes, for conducting liquid or gas, arranged to cross each other, and a fixing member for fixing the plurality of pipes. The fixing member comprises a plurality of pipe fixing bores, and a plurality of fitting bores for the fitting of bands used to tighten the pipes. The present invention can secure not only easy insertion of the pipes arranged to cross each other, but also enhancement in a coupling force of the pipes through the use of the tightening bands, resulting in stable and reliable fixation of the pipes.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mun Sub Kim, Jai Kwon Lee, Jin Yong Mo, Deug Yong Park, Hyung Suk Han, Ju Hwan Kim