Abstract: A memory device includes a memory cell array configured to store data; and a data output circuit configured to transmit status data to an external device through at least one data line in a latency period in response to a read enable signal received from the external device and transmit the data read from the memory cell array to the external device through the at least one data line in a period subsequent to the latency period.

Abstract: A method, apparatus, and non-transitory computer readable medium for video tone mapping. The method includes a target display receiving a quantized video generated by a master display, the quantized video being mastered for a first range of luminance values associated with the master display; receiving metadata from a tone mapping curve parameter extraction, the metadata comprising at least one maximum value of a luminance parameter of the quantized video as mastered for the first range of luminance values; and de-quantizing the quantized video to produce a de-quantized video. The method also includes at least one processor of the target display applying a tone mapping function defined by a normalized Bezier curve to the de-quantized video; and generating, based on applying the tone mapping function, a tone mapped video mastered for a second range of luminance values associated with the target display.

Abstract: A three-dimensional (3D) image display apparatus is provided. The apparatus includes a plurality of light sources; a spatial light modulator configured to modulate light from the plurality of light sources according to 3D image information; and a focusing optical system configured to focus an image formed by the spatial light modulator onto a focal plane. The plurality of light sources may be arranged such that multiple focal points, respectively corresponding to the plurality of light sources, are formed on the focal plane near a pupil of a user.

Abstract: An image processing device, which includes processing circuitry configured to cause the image processing device to first detect a first bad pixel based on first image data, correct the first bad pixel based on first values of first peripheral pixels in response to the first detection to obtain a first correction result, the first peripheral pixels being peripheral to the first bad pixel, second detect the first bad pixel and a second bad pixel based on the first image data, the second bad pixel being adjacent to the first bad pixel, correct the second bad pixel based on second values of second peripheral pixels to obtain a second correction result, the second peripheral pixels being peripheral to the second bad pixel, and correct the first bad pixel by using the first correction result stored in a buffer in response to the second detection.

Abstract: An electronic device is provided. The electronic device includes a memory for storing at least one dynamic shortcut command, a display, and a processor operatively connected with the memory and the display, the processor configured to store a first dynamic shortcut command including first type information for at least one first dynamic variable word in the memory, when acquiring a user utterance, detect the first dynamic shortcut command in the memory based on the first dynamic variable word included the user utterance, change the first type information included in the detected first dynamic shortcut command into the first dynamic variable word included in the user utterance, and execute a task corresponding to the changed first dynamic shortcut command including the first dynamic variable word included in the user utterance. Various other embodiments may be provided. The method performing shortcut command in the electronic device may be performed using an artificial intelligence model.

Abstract: An integrated circuit device is provided as follows. A fin-type active region extends on a substrate in a first horizontal direction. A gate line extends on the fin-type active region in a second horizontal direction intersecting the first horizontal direction. A source/drain region is disposed in the fin-type active region at one side of the gate line. An insulating cover extends parallel to the substrate, with the gate line and the source/drain region arranged between the insulating cover and the substrate. A source/drain contact that vertically extends through the insulating cover has a first sidewall covered with the insulating cover and an end connected to the source/drain region. A fin isolation insulating unit vertically extends through the insulating cover into the fin-type active region. The source/drain region is arranged between the fin isolation insulating unit and the gate line.

Abstract: Disclosed herein is a refrigerator, and more particularly, to a refrigerator including a water supply system. The refrigerator includes a main body including a storage compartment, and a water supply assembly disposed in the storage compartment. The water supply assembly includes a first filter mounting portion provided to allow a first filter to be mounted thereon, and a second filter mounting portion provided to allow a second filter to be mounted thereon, and including a residual water guide configured to guide residual water in the second filter mounting portion to the first filter mounting portion.

Abstract: Provided is a backlight unit, a display apparatus, and a method of manufacturing the display apparatus capable of securing a uniform and wide illumination area with a small number of light sources through reflection of a reflective layer. The backlight unit includes a plurality of light sources configured to emit light; a first reflective layer configured to reflect the light emitted from the plurality of light sources; and a second reflective layer configured to reflect the light reflected from the first reflective layer, wherein an amount of reflection from the first reflective layer and an amount of transmission through the first reflective layer are different from each other according to an angle of incidence of light incident on the first reflective layer.

Abstract: An apparatus and method of a network entity in a wireless communication system is provided. The apparatus and method comprises: identifying a non-terrestrial network (NTN) type associated with an NTN; configuring a set of operational parameters for performing wireless communication based on the NTN type; identifying, based on a network configuration associated with the NTN, one or more interfaces to transmit information indicating the NTN type; and transmitting, to a user equipment (UE) or a network function (NF), the information indicating the NTN type via the identified one or more interfaces.

Abstract: A semiconductor nanocrystal particle including zinc (Zn), tellurium (Te) and selenium (Se), a method of producing the same, and an electronic device including the same are disclosed. In the semiconductor nanocrystal particle, an amount of the tellurium is less than an amount of the selenium, the particle includes a core including a first semiconductor material including zinc, tellurium, and selenium and a shell disposed on at least a portion of the core and including a second semiconductor material having a different composition from the first semiconductor material, and the semiconductor nanocrystal particle emits blue light including a maximum peak emission at a wavelength of less than or equal to about 470 nanometers.

Abstract: Embodiments of an electronic device are disclosed. The electronic device may include a USB Type-C connector including at least one configuration channel (CC) pin and a processor operatively connected to the USB Type-C connector. The processor may be configured to: obtain first information of a connected audio output device by using a USB driver; transmit the first information and/or audio card information of the audio output device to an audio framework through a USB framework; control the audio framework to access an interface corresponding to the audio card information; and activate, when at least a portion of second information of the audio output device is obtained through the USB driver while accessing the interface, the interface by transmitting the at least a portion of the second information to the audio framework through the USB framework. Various additional embodiments in addition to the disclosed embodiments are possible.

Abstract: A semiconductor device includes a substrate; and a fin protruding from the substrate. The fin includes a first material and a second material. The fin includes a lower section, a middle section, and an upper section. The middle section has a smaller width at a middle portion than a width at lower and upper portions of the middle section. A concentration of the second material gradually decreases from the middle portion in upward and downward directions.

Abstract: An electronic device includes a memory, a communication circuit, and a processor. The memory is configured to store an application and an edge enabler client. The communication circuit is configured to communicate with at least one of a first server, a second server, or a third server. The application is configured to perform one or more functions corresponding to the third server. The processor is configured to receive access information for accessing the second server from the first server. The processor is configured to receive access information of the third server from each of a plurality of second servers. The processor is configured to check at least one or more third servers capable of providing a service The processor is configured to select the third server to request access among a plurality of third servers. The processor is configured to perform the service using the selected third server.

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

Abstract: Provided are a dielectric material including a compound represented by Formula 1, a device including the same, and a method of preparing the dielectric material: (1?x)KaNabNbO3.xM(AcSbd)O3??[Formula 1] wherein, in Formula 1, M is a Group 2 element, A is a trivalent element, and 0<x<1, 0<a<1, 0<b<1, 0<c<1, 0<d<1, a+b=1, and c+d=1.

Abstract: Provided is a semiconductor architecture including a carrier substrate, a landing pad included in the carrier substrate, a first semiconductor device provided on a first surface of the carrier substrate, the first semiconductor device including a first component provided on the landing pad, and a second semiconductor device provided on a second surface of the carrier substrate, a second component protruding from the second semiconductor device being provided on the landing pad.

Abstract: An electronic device according to an embodiment may comprise: a housing including a first slit having a length corresponding to a first frequency and a second slit extending from one point of the first slit in a different direction from the first slit and having a length corresponding to a second frequency, and configured to resonate at the first frequency and the second frequency by the first slit and the second slit; a printed circuit board disposed in the housing and at least partially made of a non-conductive material in regions corresponding to the first slit and the second slit; and a power supply unit for supplying power through one point of the housing, adjacent to the first slit or the second slit. Various other embodiments recognized from the specification are also possible.

Abstract: A semiconductor device includes: a substrate including a cell area and an interface area; a gate electrode disposed in the substrate within the cell area and extending in a first direction; a plurality of bit lines intersecting the gate electrode and extending in a second direction intersecting the first direction, wherein the plurality of bit lines includes a plurality of first bit lines and a plurality of second bit lines alternately disposed in the first direction; edge spacers disposed within the interface area and contacting the plurality of second bit lines; and edge insulating layers disposed between the edge spacers and contacting the plurality of first bit lines, wherein at least a portion of each of the edge insulating layers is disposed within the interface area.