Patents Assigned to Samsung Electronics Co., Ltd.
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Patent number: 11764671Abstract: A voltage converter including first to fourth switches between a first voltage node and ground, fifth to eighth switches between the first voltage node and the ground, a first floating capacitor between a first node between the first and second switches and a second node between the third and fourth switches, a second floating capacitor between a third node between the fifth and sixth switches and a fourth node between the seventh and eighth switches, a ninth switch between a second voltage node and a center node, a first inductor between the second node and a third voltage node, a center capacitor between the center node and the ground, a tenth switch between the second voltage node and the third voltage node, a first capacitor between the third voltage node and the ground, and a second capacitor between the second voltage node and the ground may be provided.Type: GrantFiled: November 29, 2021Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Kwang Chan Lee, Hyoungseok Oh, Hojun Yu, Jeongkwang Lee, Jungwook Heo
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Patent number: 11765175Abstract: Systems and methods for facilitating user interaction with a simulated object that is associated with a physical location in the real world environment is herein disclosed. In one aspect, embodiments of the present disclosure include a method, which may be implemented on a system, of identifying the simulated object that is available for access based on location data. The location data can include a location of a device in a time period, the device for use by a user to access the simulated object. One embodiment includes, verifying an identity of the user; and in response to determining that the user is authorized to access the simulated object, providing the simulated object for presentation to the user via the device.Type: GrantFiled: November 24, 2020Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventor: Nova T. Spivack
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Patent number: 11763289Abstract: A method of operating a payment device for selectively enabling a payment function according to the validity of a host is provided. The method relates to a method of operating the payment device which includes a near field communication controller (NFCC) and a host communicating with the NFCC. The method selectively enables the payment function according to the validity of the host, thereby preventing illegal or unwanted payment.Type: GrantFiled: October 23, 2020Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventor: Joong Chui Yoon
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Patent number: 11762256Abstract: A light emitting diode (LED) package includes a substrate having a pair of first wiring electrodes and a pair of second wiring electrodes, an LED chip on the substrate, the LED chip being electrically connected to the pair of first wiring electrodes, a wavelength conversion film on the LED chip, an electrochromic film on the wavelength conversion film, the electrochromic film electrically connected to the pair of second wiring electrodes, and the electrochromic film being configured to have a first color before application of a voltage and to be transparent after application of the voltage, an optical lens on the electrochromic film, and a lateral structure having a reflective layer covering at least a portion of a lateral surface of each of the LED chip and the wavelength conversion film, and a color layer on the reflective layer and having a second color.Type: GrantFiled: July 9, 2021Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongsup Song, Tetsuo Ariyoshi, Taehyun Lee
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Patent number: 11764156Abstract: Example embodiments relate to a layer structure having a diffusion barrier layer, and a method of manufacturing the same. The layer structure includes first and second material layers and a diffusion barrier layer therebetween. The diffusion barrier layer includes a nanocrystalline graphene (nc-G) layer. In the layer structure, the diffusion barrier layer may further include a non-graphene metal compound layer or a graphene layer together with the nc-G layer. One of the first and second material layers is an insulating layer, a metal layer, or a semiconductor layer, and the remaining layer may be a metal layer.Type: GrantFiled: June 29, 2021Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Hyunjae Song, Seunggeol Nam, Yeonchoo Cho, Seongjun Park, Hyeonjin Shin, Jaeho Lee
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Patent number: 11765660Abstract: The disclosure relates to a method and apparatus for reducing power consumption of a terminal in a wireless communication system, and an operation method of a terminal for reducing power consumption of the terminal in a wireless communication system according to an embodiment of the disclosure includes transmitting a power saving mode request (PSR) message requesting a power saving mode to a base station and receiving configuration information or indicator information relating to the power saving mode from the base station.Type: GrantFiled: April 16, 2019Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Taehyoung Kim, Youngbum Kim, Younsun Kim, Jeongho Yeo, Seunghoon Choi
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Patent number: 11762428Abstract: An electronic device including a first housing and a second housing facing each other and combined with each other to be folded or unfolded is disclosed, the electronic device includes: a first grip sensor included in the first housing; a second grip sensor included in the second housing; and a processor, wherein the processor is configured to: determine a folded state or an unfolded state of the electronic device, sense proximity and/or contact of a human body using the second grip sensor and adjust a radiated power of the electronic device and/or a power of the electronic device based on the sensed proximity and/or contact of the human body based on the electronic device being determined to be in the unfolded state, and sense the proximity and/or contact of the human body using the first grip sensor and adjust the radiated power of the electronic device and/or the power of the electronic device based on the sensed proximity and/or contact of the human body based on the electronic device being determined toType: GrantFiled: May 2, 2022Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jeonggyun Park, Jangje Park, Sangpil Lee, Dongkeun Jung
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Patent number: 11763058Abstract: Disclosed is a method for fabricating of a semiconductor device. The method includes receiving a first layout including patterns for the fabrication of the semiconductor device, performing machine learning-based process proximity correction (PPC) based on features of the patterns of the first layout to generate a second layout, and performing optical proximity correction (OPC) on the second layout to generate a third layout.Type: GrantFiled: December 4, 2020Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Sooyong Lee, Jeeyong Lee, Jaeho Jeong
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Patent number: 11762736Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.Type: GrantFiled: January 20, 2022Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sungrae Kim, Kijun Lee, Myungkyu Lee, Yeonggeol Song, Jinhoon Jang, Sunghye Cho, Isak Hwang
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Patent number: 11765628Abstract: A baseband circuit that receives, from a RFIC, and being configured to process, a signal including a plurality of synchronization signal blocks generated in a neighbor cell and a signal including radio resource control parameters generated in a serving cell, includes: a storage; a controller configured to write/read data to/from the storage; and a signal processor controlled by the controller, wherein the controller sets a number of measurement target SSBs based on the RRC parameters, wherein the signal processor checks a validity of the set number of SSBs, and the controller stores valid SSB information in the storage based on the checking result, verifies a number of valid SSBs based on the stored valid SSB information, and controls the signal processor or invalidates the neighbor cell so that the signal processor measures reference signal received power of the neighbor cell based on a verification result.Type: GrantFiled: April 9, 2021Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dahae Chong, Joohyun Do
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Patent number: 11764121Abstract: Provided is a stacked semiconductor package including a package base substrate including a plurality of signal wires and at least one power wire, wherein a plurality of top surface connecting pads and a plurality of bottom surface connecting pads are on a top surface and a bottom surface of the package base substrate, respectively; and a plurality of semiconductor chips that are sequentially stacked on the package base substrate and are electrically connected to the top surface connecting pads, the plurality of semiconductor chips including a first semiconductor chip that is a bottommost semiconductor chip, and a second semiconductor chip that is on the first semiconductor chip, wherein the signal wires are arranged apart from a portion of the package base substrate, the first portion that overlaps a first edge of the first semiconductor chip, the first edge overlapping the second semiconductor chip in a vertical direction.Type: GrantFiled: September 6, 2022Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventor: Keun-ho Choi
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Patent number: 11764415Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.Type: GrantFiled: December 28, 2020Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Seok Hong, Jeong Kuk Shon, Young-Gyoon Ryu
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Patent number: 11763535Abstract: An electronic device is provided. The electronic device includes: a display; a camera; a memory; and a processor configured to identify a video captured in real time through the camera as a plurality of image sections, obtain spatial information corresponding to each image section, map the obtained spatial information to each of the plurality of image sections and store same in the memory, and control the display to add a virtual object image to the video and display the same on the basis of the spatial information mapped to each of the plurality of image sections when a user command for adding the virtual object image to the video is input.Type: GrantFiled: August 23, 2019Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Jaeyun Jeong
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Patent number: 11765913Abstract: A memory device includes a substrate including a memory cell region and a dummy cell region, a plurality of first conductive lines disposed on the substrate and extending in a first direction, a plurality of second conductive lines disposed on the substrate and extending in a second direction, and a plurality of memory cells formed at intersections of the plurality of first conductive lines and the plurality of second conductive lines. Each of the plurality of memory cells includes a switching unit and a variable resistance memory unit. Each of the plurality of first conductive lines includes a first conductive line main region disposed in the memory cell region, and a first conductive line edge region disposed in the dummy cell region and spaced apart from the first conductive line main region.Type: GrantFiled: September 22, 2020Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Minchul Han
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Patent number: 11764900Abstract: Methods, a Base Station (BS), and a User Equipment (UE) in a wireless communication system for transmitting and receiving control information are provided. The method for transmitting control information by a BS in a wireless communication system includes receiving information related to a signal transmitted by a second BS that the second BS which is a neighboring BS of the first BS, determining whether a second UE using an identical resource to that used by a first UE included in a cell of the first BS exists within a cell of the second BS based on the received information, when the second UE exists, generating control information for controlling a signal transmitted to the second UE by the second BS based on the received information, and transmitting the generated control information to the first UE through a control channel.Type: GrantFiled: September 20, 2022Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Han-Ju Kim, Chae-Man Lim, Min-Goo Kim, Jong-Han Lim, Hyuk-Joon Kwon, Jung-Won Lee
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Patent number: 11762433Abstract: A hinge module according to one embodiment includes a fixed structure including a central portion, a guide portion having an edge facing an edge of the central portion, and a support portion configured to connect the central portion and the guide portion, wherein an interior space is formed between the central portion and the guide portion, a connecting shaft extending into the interior space through the central portion and including a gear formed on at least a part of an outer circumferential surface of the connecting shaft, and a rotary structure disposed in the interior space, the rotary structure including a circular arc shaped gear having a plurality of gear teeth arranged in a circular arc shape and that are engaged with the gear, wherein the rotary structure rotates about a virtual axis of rotation passing through a center of a circular arc of the circular arc shaped gear.Type: GrantFiled: March 6, 2023Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Jungjin Kim, Jongyoon Kim, Chungkeun Yoo, Jongmin Kang, Suman Lee, Sungkyu Hwang
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Patent number: 11765963Abstract: A stretchable device includes a substrate, the substrate including first regions having a first stiffness and a second region between adjacent first regions and having a second stiffness that is lower than the first stiffness, a unit device array including unit devices on separate, respective first regions of the substrate, and an encapsulant covering the unit device array. The unit device array includes pixel electrodes isolated on separate, respective first regions of the substrate, common electrodes isolated on separate, respective first regions and each facing a separate pixel electrode, the stretchable device configured to apply a same voltage to the plurality of common electrodes, and active layers on separate, respective first regions and each between a separate pixel electrode and a separate common electrode.Type: GrantFiled: September 28, 2022Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Joo Young Kim, Youngjun Yun, Don-Wook Lee
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Patent number: 11764207Abstract: Diode structures of stacked devices and methods of forming the same are provided. Diode structures may include a substrate, an upper semiconductor layer that is spaced apart from the substrate in a vertical direction, an upper thin semiconductor layer protruding from a side surface of the upper semiconductor layer in a first horizontal direction, a lower semiconductor layer that is between the substrate and the upper semiconductor layer and has a first conductivity type, a lower thin semiconductor layer protruding from a side surface of the lower semiconductor layer in the first horizontal direction, a first diode contact that is electrically connected to the lower semiconductor layer, and a second diode contact that is electrically connected to one of the upper semiconductor layer and a portion of the substrate. The one of the upper semiconductor layer and the portion of the substrate may have a second conductivity type.Type: GrantFiled: December 17, 2021Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Byounghak Hong, Seungchan Yun, Kang-ill Seo
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Patent number: 11764459Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.Type: GrantFiled: December 28, 2022Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Juneseok Lee, Junsig Kum, Kwanghyun Baek, Dohyuk Ha, Jinsu Heo, Youngju Lee, Jungyub Lee
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Patent number: 11765467Abstract: Provided is an image sensor including: a pixel array including a plurality of pixel groups each including first pixels to which a first conversion gain is applied and second pixels to which a second conversion gain is applied; a readout circuit configured to receive a first pixel signal corresponding to the first pixels and a second pixel signal corresponding to the second pixels through a single readout with respect to each of the plurality of pixel groups, generate first image data, based on first pixel signals of the plurality of pixel groups, and generate second image data, based on second pixel signals of the plurality of pixel groups; and an image signal processor configured to generate output image data by merging the first image data and the second image data in units of a pixel group.Type: GrantFiled: June 3, 2021Date of Patent: September 19, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Jeongguk Lee, Yunseok Choi, Dochang Ahn, Soyoung Jeong