Patents Assigned to Samsung Electronics., LTD
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Patent number: 12549235Abstract: Disclosed is a 5th generation (5G) or 6th generation (6G) communication system for supporting higher data rates after a 4th generation (4G) communication systems such as long term evolution (LTE). An operating method of a base station includes receiving, from a user equipment (UE), information about channel state information (CSI) measured based on a first CSI-reference signal (RS), determining, based on the information about the CSI, one autoencoder (AE), from among a plurality of AEs, transmitting, to the UE, information indicating an encoder included in the determined AE, transmitting a second CSI-RS to the UE, receiving, from the UE, CSI compressed based on CSI measured using the second CSI-RS and the indicated encoder, and performing reconstruction based on the compressed CSI and a decoder included in the determined AE.Type: GrantFiled: June 14, 2023Date of Patent: February 10, 2026Assignee: Samsung Electronics., LtdInventors: Wonjun Kim, Suhwook Kim, Seunghyun Lee, Juho Lee, Hyeondeok Jang
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Publication number: 20190221210Abstract: An electronic device and a control method therefor are provided. The electronic device comprises: a plurality of microphones for receiving audio signals in which voice signals are included; a communicator for receiving state information according to information about a connection with the electronic device; and a processor for determining the noise environment around the electronic device based on one or more of audio amplitude information that is received by the plurality of microphones and that is output by an external device, and state information of the external device, and for processing the voice signal based on the determined noise environment so as to perform voice recognition.Type: ApplicationFiled: June 28, 2017Publication date: July 18, 2019Applicant: SAMSUNG ELECTRONICS., LTDInventor: Myung-suk SONG
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Patent number: 9996473Abstract: An apparatus for mapping user data into a selective underlying exposure address (SUE) space includes a memory that stores machine instructions and a processor that executes the instructions to combine first user data from a plurality of logically-addressed blocks to create a SUE page. The SUE page corresponds to a respective physical page of a respective physical block on each of a plurality of dies for which corresponding physical blocks of memory cells are jointly managed as a unit in a storage device. The processor further executes the instructions to store mapping information associating the first user data with the SUE page in a logical address space in the storage device.Type: GrantFiled: November 13, 2015Date of Patent: June 12, 2018Assignee: Samsung Electronics., LTDInventors: Andrew Tomlin, Justin Jones
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Patent number: 9866338Abstract: Encoding and decoding methods are provided. An information object is encoded according to a preset encoding scheme. A preset set of bits is selected from the encoded information object and the selected set of bits is output as a sample. A control packet including information on a sample number is generated. The sample is assembled with the control packet. The sample is modulated into a sound signal according to a preset scheme. An input sound signal is demodulated according to the preset scheme. Sample bits and control packet bits containing information of the sample are separated from each other in demodulated received bits. Address information corresponding to each bit of the sample is generated according to the control packet. A soft decision of the sample bits is summed for each piece of the generated address information. A sample decoding of the summed soft decision of the sample bits is performed.Type: GrantFiled: May 1, 2014Date of Patent: January 9, 2018Assignee: Samsung Electronics., LTdInventors: Hee-Won Jung, Seung-Gun Park, Gi-Sang Lee, Jun-Ho Koh, Sang-Mook Lee, Sergey Zhidkov
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Patent number: 6852607Abstract: A method of manufacturing a wafer level package includes forming a semiconductor wafer including semiconductor chips, and forming a package body on the sides of each semiconductor chip. The package body is formed by forming a space between each semiconductor chip and potting a package material in the space, which can be a mold resin. The wafer is then separated into separate semiconductor chips by cutting through the package body.Type: GrantFiled: May 10, 2002Date of Patent: February 8, 2005Assignee: Samsung Electronics., LTDInventors: Young Hee Song, Ming Young Son, Woong Ky Ha
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Publication number: 20030221709Abstract: A dishwasher includes a casing arranged within the dishwasher, an odor eliminating material installed within the casing, a shutter which selectively opens a part of the casing to expose the odor eliminating material, and a shutter driving device which operates the shutter. A control unit of the dish washer counts an actual drying time in a drying operation of the dishwasher, and opens the shutter by operating the shutter driving device in response to the counted drying time being equal to or greater than a preset drying time. The odor eliminating material eliminates odors in the dishwasher.Type: ApplicationFiled: September 9, 2002Publication date: December 4, 2003Applicant: SAMSUNG ELECTRONICS., LTDInventors: Tae-Young Jung, Sam-Yong Jang
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Publication number: 20030202444Abstract: A method and an apparatus for identifying the type of an optical recording medium are provided.Type: ApplicationFiled: April 22, 2003Publication date: October 30, 2003Applicant: SAMSUNG ELECTRONICS., LTDInventors: Jong-Ryull Kim, Pyong-Yong Seong, No-Jun Kwak, Chul-Ho Jeon, Ki-Bong Yun, Bong-Hwoan Choi