Abstract: A memory system includes a storage device including a turbo write buffer and a user storage area implemented with a nonvolatile memory, and a host configured to transfer a read request to the storage device. In response to the read request, the storage device transfers read data and read data information including attributes of the read data to the host.

Abstract: A storage device, including a printed circuit board including a connector including a plurality of pins capable of being coupled to an external host device, a controller socket, a first slot, a second slot, a third slot, and a fourth slot; a first universal flash storage (UFS) device, a second UFS device, a third UFS device, and a fourth UFS device, wherein each UFS device of the first to fourth UFS devices is removably installed in a corresponding slot of the first to fourth slots; and a storage controller mounted in the controller socket, and configured to control the first to fourth UFS devices, wherein the first UFS device and the second UFS device are configured to communicate with the storage controller through a first channel, and the third UFS device and the fourth UFS device are configured to communicate with the storage controller through a second channel.

Abstract: A storage device is disclosed. A first storage media may store data. The first storage media may be of a first storage type and may be organized into at least two blocks. A second storage media may also store data. The second storage media may be of a second storage type different from the first type, and may also be organized into at least two blocks. A controller may manage reading data from and writing data to the first storage media and the second storage media. Metadata storage may store device-based log data for errors in the storage device. The drive-based log data may include a first log data for the first storage media and a second log data for the second storage media. An identification circuit may identify a suspect block in the at least two blocks in the first storage media and the second storage media, responsive to the device-based log data.

Abstract: A rack-mountable data storage system includes: a chassis including one or more switchboards; a midplane interfacing with the one or more switchboards; and one or more data storage devices removably coupled to the midplane using a connector. At least one data storage device of the one or more data storage devices include a logic device to interface with the midplane. The logic device provides a device-specific interface of a corresponding data storage device with the midplane. The at least one data storage device is configured using the logic device according to a first protocol based on a signal on a pin of the connector, and the at least one data storage device is reconfigurable according to a second protocol based on a change of the signal on the pin of the connector using the logic device.

Abstract: An integrated circuit (IC) device includes a conductive region including a first metal on a substrate. An insulating film is on the conductive region. A conductive plug including a second metal passes through the insulating film and extends in a vertical direction. A conductive barrier pattern is between the conductive region and the conductive plug. The conductive barrier pattern has a first surface in contact with the conductive region and a second surface in contact with the conductive plug. A bottom surface and a lower sidewall of the conductive plug are in contact with the conductive barrier pattern, and an upper sidewall of the conductive plug is in contact with the insulating film. The conductive barrier pattern includes a vertical barrier portion between the insulating film and the conductive plug, and the vertical barrier portion has a width tapering along a first direction away from the conductive region.

Abstract: Disclosed herein is a display apparatus. The display apparatus includes: a liquid crystal panel; and a backlight unit configured to emit light to the liquid crystal panel. The backlight unit includes: a substrate extending along a first direction; a light emitting diode provided on the substrate; a refractive cover provided on the light emitting diode to refract light emitted from the light emitting diode; and a lens provided on the substrate and the refractive cover, the lens comprising a bottom surface having a first length in the first direction that is less than a second length in a second direction perpendicular to the first direction.

Abstract: An electronic apparatus is disclosed.

Abstract: An image processing apparatus, including a processor configured to execute instructions stored in a memory to: obtain characteristic information of a first image, divide the characteristic information into a plurality of groups, input each group into a respective layer of a plurality of layers included in a convolutional neural network and perform a convolution operation using one or more kernels to obtain a plurality of pieces of output information, generate an attention map including weight information corresponding to each pixel included in the first image, based on the plurality of pieces of output information, generate a spatially variant kernel including a kernel corresponding to the each pixel, based on the attention map and a spatial kernel including weight information according to a position relationship between the each pixel and a neighboring pixel, and generate a second image by applying the spatially variant kernel to the first image.

Abstract: A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upper surface of the base film, and a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film. The upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, and a long axis length of the bridge film is greater than a long axis length of the base film.

Abstract: A method includes attaching a first anisotropic conductive film including first conductive particles to a front surface of a substrate structure; compressing a first redistribution structure on the front surface of the substrate structure such that a first redistribution conductor of the first redistribution structure that is exposed is electrically connected by the first conductive particles to a connection terminal or a vertical connection conductor that is exposed from the substrate structure, attaching a second anisotropic conductive film including second conductive particles to a rear surface of the substrate structure; and compressing a second redistribution structure on the rear surface of the substrate structure such that a second redistribution conductor of the second redistribution structure that is exposed is electrically connected by the second conductive particles to the vertical connection conductor.

Abstract: A semiconductor device includes; a semiconductor substrate including a chip area and a scribe lane area, a low-k layer on the semiconductor substrate, an interlayer insulating layer on the low-k layer, a trench area in the scribe lane area, a gap-fill insulating layer in the trench area and vertically extending from the semiconductor substrate through the low-k layer and the interlayer insulating layer to expose an upper surface of the gap-fill insulating layer through the interlayer insulating layer, and a first metal liner covering a side surface of the gap-fill insulating layer and disposed between the gap-fill insulating layer and the low-k layer and between the gap-fill insulating layer and the interlayer insulating layer.

Abstract: A laser detecting circuit is provided. The laser detecting circuit includes a latch circuit with a first inverter configured to invert a first output signal at a first node to generate a second output signal at a second node, and a second inverter configured to generate the first output signal based on the second output signal. The second inverter includes a plurality of PMOS transistors connected in series between a first source voltage and the first node, and a plurality of NMOS transistors. A gate of each of the plurality of PMOS transistors is connected to the second node, and a drain of each of the plurality of NMOS transistors is connected to the first node. The plurality of NMOS transistors includes dummy NMOS transistors and normal NMOS transistors.

Abstract: A semiconductor device includes a semiconductor substrate having first and second regions therein, a first lower semiconductor pattern, which protrudes from the semiconductor substrate in the first region and extends in a first direction across the semiconductor substrate, and a first gate electrode, which extends across the first lower semiconductor pattern and the semiconductor substrate in a second direction. A plurality of semiconductor sheet patterns are provided, which are spaced apart from each other in a third direction to thereby define a vertical stack of semiconductor sheet patterns, on the first lower semiconductor pattern. A first gate insulating film is provided, which separates the plurality of semiconductor sheet patterns from the first gate electrode. A second lower semiconductor pattern is provided, which protrudes from the semiconductor substrate in the second region. A plurality of wire patterns are provided, which are spaced apart from each other on the second lower semiconductor pattern.

Abstract: A photodetector includes a gate electrode extending in a first direction, a ferroelectric layer on the gate electrode and maintaining a state of polarization formed by a gate voltage applied to the gate electrode, a light absorbing layer on the ferroelectric layer and extending in a second direction intersecting the gate electrode, the light absorbing layer including a two-dimensional (2D) material of a layered structure, a source electrode on the ferroelectric layer and connected to a first end of the light absorbing layer, and a drain electrode on the ferroelectric layer and connected to the a second end of the light absorbing layer.

Abstract: An image sensor includes a substrate having first and second surfaces and first and second regions. Unit pixels including photoelectric conversion layers are arranged inside the first region. A pixel separation pattern extends from the first surface to the second surface in the first region, separates each of the unit pixels, and includes a pixel separation spacer film and a pixel separation filling film. A dummy pixel separation pattern extends from the first surface to the second surface in the second region, and includes a dummy pixel separation filling film. A wiring structure disposed on the second surface includes an inter-wiring insulating film and a first wiring. A first contact directly connects the dummy pixel separation filling film and connects the dummy pixel separation filling film to the first wiring. A height of the pixel separation filling film is greater than a height of the dummy pixel separation filling film.

Abstract: A semiconductor device including a switching element on a substrate, a pad isolation layer on the switching element, a conductive pad passing through the pad isolation layer and connected to the switching element, an insulating pattern on the pad isolation layer and having a height greater than a horizontal width, a lower electrode on side surfaces of the insulating pattern on side surfaces of the insulating pattern and in contact with the conductive pad, a capacitor dielectric layer on the lower electrode and having a monocrystalline dielectric layer and a polycrystalline dielectric layer, the monocrystalline dielectric layer being relatively close to side surfaces of the insulating pattern compared to the polycrystalline dielectric layer an upper electrode on the capacitor dielectric layer may be provided.

Abstract: An exterior material for cooking appliance capable of improving visibility, Vickers hardness, and scratch resistance by forming laser holes in a surface of an exterior material including a Diamond like carbon (DLC) coating layer, and a method for manufacturing the exterior material. The cooking appliance exterior material includes a base material, a Diamond like carbon (DLC) coating layer provided on the base material, an adhesive layer provided between the base material and the DLC coating layer to attach the DLS coating layer to the base material to incase an adhesion force between the base material and the DLC coating layer, and a plurality of laser holes provided in a surface of the exterior material.

Abstract: Provided is an electronic apparatus configured to provide an image based on artificial intelligence (AI), the electronic apparatus including a processor configured to execute one or more instructions stored in the electronic apparatus to obtain a first image by AI-downscaling an original image by a downscaling neural network, obtain first image data by encoding the first image, based on a display apparatus not supporting an AI upscaling function, obtain a second image by decoding the first image data, obtain a third image by AI-upscaling the second image by an upscaling neural network, and provide, to the display apparatus, second image data obtained by encoding the third image.

Abstract: An electronic device extracts feature data from an input image, calculates one or more class maps from the feature data using a classifier layer, calculates one or more cluster maps from the feature data using a clustering layer, and generates image segmentation data using the one or more class maps and the one or more cluster maps.

Abstract: A defense method of a memory device according to an embodiment includes obtaining a plurality of defense types to refresh a row of a memory cell array that is subjected to an attack, determining respective operation times for the defense types, and performing a refresh operation for the row of the memory cell array by switching among the defense types based on the respective operation times that were determined.