Abstract: A thermal image sensor and a method of manufacturing the same. The thermal image sensor includes: a substrate; a row electrode and a column electrode on the substrate; a multi-layer stack including an absorption layer and a temperature sensor; supporting arms that extend from diagonal corners of the multi-layer stack and that are spaced apart from both sides of the multi-layer stack, wherein the supporting arms have a concave-convex shape including a plurality of concave portions and a plurality of convex portions; and legs protruding from the row electrode and the column electrode, wherein the legs are connected to extended ends of the supporting arms to allow the multi-layer stack to float above the substrate.

Abstract: A memory controller with improved user fairness, a storage device including the memory controller, and an operating method of the memory controller are provided. A memory controller includes a command-unit workload calculator configured to calculate a workload by a unit of each command, based on resource consumption of a memory device, which is determined by performing at least one memory operation included in each of the commands, a user-unit workload calculator configured to calculate a workload caused by each of a plurality of users, based on the workload calculated by the unit of the command, and a command fetch unit configured to preferentially fetch, from a host, a command issued by a user who has caused a relatively small workload, based on calculation results of workloads of the plurality of users.

Abstract: Disclosed is an image sensor comprising a first semiconductor substrate that includes a first pixel region and a second pixel region, a first photoelectric conversion element on the first pixel region, a second photoelectric conversion element on the second pixel region, a first floating diffusion section on the first pixel region, a second floating diffusion section on the second pixel region, a first transfer gate electrode between the first photoelectric conversion element and the first floating diffusion section, a second transfer gate electrode between the second photoelectric conversion element and the second floating diffusion section, a second semiconductor substrate on the first semiconductor substrate, and pixel transistors connected to the first and second photoelectric conversion elements. A width of the second photoelectric conversion element is less than that of the first photoelectric conversion element. At least one of the pixel transistors is on the second semiconductor substrate.

Abstract: A memory box includes memory devices comprising memory cells configured to store data, a sensor configured to measure state information of the memory devices, and a mode manager configured to divide the memory devices into a plurality of groups, receive a priority between the plurality of groups from a host device, receive the state information from the sensor, and dynamically control an operation mode of the plurality of groups based on the priority and the state information

Abstract: A storage device includes: authentication device for receiving a certificate generated based on a first private key that corresponds to a first public key, the first public key, and a second public key from a debugging device, authenticating the first public key, authenticating the second public key when the authentication of the first public key is successful, and outputting a debugging enable signal when the authentication of the second public key is successful; a processor for receiving a debugging signal from the debugging device in response to the debugging enable signal, and performing debugging based on the debugging signal.

Abstract: A substrate inspection apparatus includes a substrate support portion that fixedly holds a semiconductor substrate such that an upper surface and a lower surface of the semiconductor substrate are exposed; an upper inspection portion including an upper probe having a first end portion spaced apart from the upper surface, and an upper charge sensor in the first end portion that obtains an upper surface charge sensing value from the upper surface; and a lower inspection portion including a lower probe having a second end portion spaced apart from the lower surface, and a lower charge sensor in the second end portion that obtains a lower surface charge sensing value from the lower surface.

Abstract: Provided are an optical proximity correction (OPC) method and a mask manufacturing method including the OPC method for implementing a simulation contour more stiffly to ensure a processing margin. The OPC method includes receiving a design layout for a target pattern, obtaining an OPC pattern by performing first OPC on the design layout, extracting a transition area as an area having a width that changes from a first width to a second width, which is less than the first width, from the target pattern, obtaining a simulation contour for the transition area, calculating at least one of a correction length and a correction angle based on the simulation contour, obtaining a first OPC pattern for the transition area based on at least one of the correction length and the correction angle, and obtaining a final OPC pattern by merging the first OPC pattern with the OPC pattern.

Abstract: A method of decoding motion information may include: obtaining, from a bitstream, change information indicating whether to change motion information of a neighboring block; when the change information indicates a change of the motion information and a higher block is able to use one reference picture list, identifying the number of pictures included in the reference picture list of the current block; selecting, as a reference picture of the current block, a reference picture of the neighboring block based on the number of pictures; when the reference picture of the neighboring block is selected as the reference picture of the current block, obtaining a motion vector of the current block by applying an offset to a motion vector of the neighboring block; and reconstructing the current block by using a reference block indicated by the motion vector of the current block in the reference picture of the current block.

Abstract: A method of manufacturing a semiconductor package, the method includes preparing a first semiconductor chip including a plurality of first upper connection pads, disposing a plurality of connection bumps electrically connected to the plurality of first upper connection pads on the first semiconductor chip, forming an insulating adhesive layer at least partially covering the plurality of connection bumps on an upper surface of the first semiconductor chip, removing a plurality of regions to be removed of the insulating adhesive layer, and bonding a second semiconductor chip including a plurality of second lower connection pads on the insulating adhesive layer, wherein each of the plurality of regions to be removed is a portion of the insulating adhesive layer that at least partially overlaps a connection bump among the plurality of corresponding connection bumps in a vertical direction.

Abstract: A pressure gauge zero point calibration method of a pressure gauge having a diaphragm includes performing a first external zero point calibration at a first time, performing a second external zero point calibration at a second time, the second time occurring after the first time, generating a first usage during a first zero point interval, the first zero point interval spanning from the first time to the second time, determining a usage-based offset slope by dividing a zero point offset difference by the first usage, generating a second usage during a second zero point interval, the second zero point interval spanning from the second time to a third time, the third time occurring after the second time, obtaining a third zero point offset based on the usage-based offset slope and the second usage, and applying the third zero point offset to the pressure gauge, the pressure gauge having a diaphragm.

Abstract: An electronic device includes: memory storing instructions, a communication circuit comprising a Bluetooth communication module and a Wi-Fi module, and a processor operatively connected with the memory and the communication circuit. and the instructions are configured to, when executed by the processor, cause the electronic device to: broadcast first capability information of the electronic device associated with a Wi-Fi direct connection, receive second capability information of an external electronic device associated with the Wi-Fi direct connection, select a group owner and a frequency band for the Wi-Fi direct connection, based on the first capability information and the second capability information, transmit group owner information indicating the selected group owner and the selected frequency band to the external electronic device, and establish a peer-to-peer (P2P) connection with the external electronic device by using the selected frequency band.

Abstract: A cleaning apparatus including a robot cleaner including a main body having a lower portion to which a mop is detachably mountable; and a station on which the robot cleaner is placeable, the station including a water storage container configured to store water, a washing chamber configured so that, while the robot cleaner is placed on the station and a mop is mounted to the lower portion of the main body, the mop is washable in the washing chamber, a steam generation device to generate steam using water from the water storage container, a pump configured to pump the water in the water storage container out of the water storage container, a first pipe to guide the water pumped out of the water storage container to the washing chamber, and a second pipe to guide the water pumped out of the water storage container to the steam generation device.

Abstract: A system for determining an activity state of a user includes: a first electronic device; and a second electronic device, where the first electronic device is configured to: request the second electronic device to identify a first activity state detected as an activity state of a user in first electronic device, receive a second activity state corresponding to an identification result of identifying the first activity state in the second electronic device received from the second electronic device in response to the request and update the activity state of the user based on the second activity state, and where the second electronic device is configured to: based on receiving the request for identifying the first activity state from the first electronic device, identify whether the activity state of the user is the first activity state and transmit the second activity state corresponding to the identification result to the first electronic device.

Abstract: An induction heating device including a vessel detection coil layer that is patterned with a plurality of vessel detection coils printed thereon to detect a cooking vessel placed on the induction heating device; a plurality of heating coil pattern layers that are patterned with heating coils printed thereon; and an insulating layer between the plurality of heating coil pattern layers and the vessel detection coil layer, to insulate the plurality of heating coil pattern layers from the vessel detection coil layer, wherein the vessel detection coil layer, the plurality of heating coil pattern layers, and the insulating layer are in a stacked, hot-pressed heating coil board in which a thickness of the insulating layer is 140 ?m or less.

Abstract: An electronic device for estimating object information and generating a virtual object and a method of operating the electronic device are disclosed. The method includes obtaining an image, obtaining a class feature, a pose feature, and a relationship feature of an object included in the image, correcting each of the class feature, the pose feature, and the relationship feature using any combination of any two or more of the class feature, the pose feature, and the relationship feature of the object, and obtaining class information, pose information, and relationship information of the object based on the corrected class feature, the corrected pose feature, and the corrected relationship feature, respectively.

Abstract: A refrigerator including a storage compartment; a rotatable door to open and close the storage compartment; a movable lever mounted on the door; a guide, having first and second contact surfaces, to guide movement of the lever while the door is rotated; and a door pusher to press the door to open the storage compartment. While the door is rotated, the lever is moved along in contact with the guide. While the lever is contacting the first contact surface, the lever applies a force to the door in a direction of closing the storage compartment. While the lever is contacting the second contact surface, the lever applies a force to the door in a direction of opening the storage compartment. The door pusher is operable to press the door in the direction of opening the storage compartment until the lever is in contact with the second contact surface.

Abstract: Provided is a semiconductor device which includes: a substrate; a 1st source/drain region above the substrate; and an under-blocking layer below the 1st source/drain region, wherein the under-blocking layer faces the substrate, and comprises one or more insulation materials, wherein the under-blocking layer is disposed below a level of a top surface of the substrate.

Abstract: An imaging system that includes a first polarization structure that polarizes light provided from a light source into first polarized light, a first power supply connected to the first polarization structure and that applies a first voltage to the first polarization structure, a meta-lens on which the first polarized light is incident, a second polarization structure that converts the first polarized light that passes through the meta-lens into second polarized light, a second power supply connected to the second polarization structure and that applies a second voltage to the second polarization structure, and an image sensor that senses the second polarized light. The first voltage and the second voltage are different from each other.

Abstract: A semiconductor chip includes a substrate. a device layer and an interconnection layer sequentially on the substrate, and a bonding pad on the interconnection layer. A bottom surface of the bonding pad may be located at a constant level, and a side surface of the bonding pad may have a roughened shape.

Abstract: An electronic device may include: a transceiver may include an analog-to-digital converter (ADC) and a digital-to-analog converter (DAC); a coupler connected to the transceiver through a feedback path; at least one memory storing instructions; and at least one communication processor configured to execute the instructions to: provide a digital transmission signal to the transceiver; receive a digital feedback signal from the transceiver; and obtain a reflection coefficient based on the digital transmission signal and the digital feedback signal. The DAC may be configured to convert the digital transmission signal into an analog signal, and the ADC may be configured to convert a signal into a digital signal to obtain the digital feedback signal, based on sampling information controlled according to a resource block size of the digital transmission signal.