Abstract: Anon-volatile memory structure capable of storing layers of a deep neural network (DNN) and perform an inferencing operation within the structure is presented. A stack of bonded die pairs is connected by through silicon vias. Each bonded die pair includes a memory die, having one or more memory arrays onto which layers of the neural network are mapped, and a peripheral circuitry die, including the control circuits for performing the convolution or multiplication for the bonded die pair. The multiplications can either be done in-array on the memory die or in-logic on the peripheral circuitry die. The arrays can be formed into columns along the vias, allowing an inferencing operation to be performed by propagating an input up and down the columns, with the output of one level being the input of the subsequent layer.

Abstract: An apparatus is provided that includes a plurality of NAND strings having a common set of word lines. Each NAND string includes data memory cells for data storage and dummy memory cells connected in series with the data memory cells. A first group of NAND strings includes dummy memory cells with a first pattern of threshold voltages and a second group of NAND strings includes dummy memory cells with a second pattern of threshold voltages for separate isolation of data memory cells of the first and second groups of NAND strings from corresponding bit lines.

Abstract: A storage device is disclosed herein. The storage device comprises a block including a plurality of memory cells and a circuit coupled to the plurality of memory cells of the block. The circuit is configured to program memory cells of a plurality of strings of a word line of the block and verify, for a plurality of sets of the memory cells, a data state of a set of the memory cells, where each set of the plurality of sets of the memory cells includes a memory cell from each string of the plurality of strings of the word line. Further, the circuit is configured to determine a number of sets of the plurality of memory cell sets that are verified to be in a first data state and determine, based on the number of sets, whether the block is faulty.

Abstract: Technology for reconfigurable input precision in-memory computing is disclosed herein. Reconfigurable input precision allows the bit resolution of input data to be changed to meet the requirements of in-memory computing operations. Voltage sources (that may include DACs) provide voltages that represent input data to memory cell nodes. The resolution of the voltage sources may be reconfigured to change the precision of the input data. In one parallel mode, the number of DACs in a DAC node is used to configure the resolution. In one serial mode, the number of cycles over which a DAC provides voltages is used to configure the resolution. The memory system may include relatively low resolution voltage sources, which avoids the need to have complex high resolution voltage sources (e.g., high resolution DACs). Lower resolution voltage sources can take up less area and/or use less power than higher resolution voltage sources.

Abstract: Ternary content addressable memory (TCAM) circuits are provided herein. In one example implementation, a TCAM circuit can include a first spin-orbit torque (SOT) magnetic tunnel junction (MTJ) element having a pinned layer coupled to a first read transistor controlled by a first search line, and having a spin hall effect (SHE) layer coupled in a first configuration across complemented write inputs. The TCAM circuit can include a second SOT MTJ element having a pinned layer coupled to a second read transistor controlled by a second search line, and having a SHE layer coupled in a second configuration across the complemented write inputs. The TCAM circuit can include a bias transistor configured to provide a bias voltage to drain terminals of the first read transistor and the second read transistor, and a voltage keeper element that couples the drain terminals to a match indicator line.

Abstract: An apparatus includes nonvolatile memory cells arranged in columns including a plurality of redundant columns with control circuits coupled to the nonvolatile memory cells. The control circuits are configured to maintain an ordered list of bad columns replaced by redundant columns. The control circuits are configured to detect an out-of-order entry in the ordered list of bad columns replaced by redundant columns.

Abstract: Methods and circuits for storing column redundancy data are provided herein. A circuit may comprise a column redundancy data array, which may store an address and a plurality of match bits. A first portion of bits of the address may reference a range of columns of a memory array and a second portion of bits of the address may reference a division of the memory array in which a column of the range of columns is located. Each of the match bits may indicate whether one of the columns of the range of columns is defective.

Abstract: An apparatus is provided that includes a plurality of non-volatile memory cells, a plurality of bit lines, a plurality of memory holes, and a control circuit. The plurality of memory holes each include a corresponding one of the memory cells. Each memory hole is associated with and coupled to a corresponding one of the bit lines. The control circuit is configured to read the memory cells in four separate read intervals.

Abstract: A memory array is provided that includes a plurality of word lines and a plurality of bit lines, and a plurality of memory cells each including a corresponding magnetic memory element coupled in series with a corresponding selector element. Each memory cell is coupled between one of the word lines and one of the bit lines. Each memory cell has a half-pitch F, and comprises an area between 2F2 and 4F2.

Abstract: A storage device is disclosed herein. The storage device comprises a block including a plurality of memory cells and a circuit coupled to the plurality of memory cells of the block. The circuit is configured to determine data states for a first set of memory cells of a neighboring word line of the set of word lines, determine a bit line voltage bias and a sense time for a memory cell of a second set of memory cells of the selected word line based on a data state determined for a memory cell for each memory cell of the second set of memory cells, and perform a verify operation on the selected word line using the bit line voltage bias and the sense time determined for each memory cell of the second set of memory cells.

Abstract: An example of an apparatus includes a plurality of memory cells arranged in a plurality of NAND strings that are connected to a source line and a control circuit connected to the source line. The control circuit is configured to provide a first current to the source line to pre-charge the source line to a target voltage for sensing data states of the plurality of memory cells and provide a second current to the source line to return the source line to the target voltage in a recovery period between sensing data states. The control circuit is configured to provide the second current at any one of a plurality of current levels.

Abstract: A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.

Abstract: A method for programming a target memory cell of a memory array of a non-volatile memory system, the method comprising performing a read operation of one or more memory cells neighboring a target memory cell, thereby determining a data pattern of the one or more neighboring memory cells, storing the data pattern and, during a program operation of the target memory cell, adjusting a verify voltage level according to the stored data pattern of the one or more neighboring memory cells.

Abstract: Apparatuses and techniques are described for reducing read time in a memory device. A source voltage signal, Vcelsrc, and a body voltage signal, Vp-well, of a source region and a p-well, respectively, of a substrate of a NAND string are controlled to reduce the channel resistance. Vcelsrc can be temporarily reduced, e.g., provided with a negative voltage kick, while Vp-well is non-decreasing during a read operation. The negative voltage kick decreases a body bias of the NAND string in its channel to reduce the channel resistance and increase the current. The negative voltage kick can be initiated when a bit line clamp transistor is made conductive to allow a current to flow in the NAND string. The magnitude and duration of the negative voltage kick can be adjusted based on various factors.

Abstract: An apparatus includes a plurality of NAND strings in a block with word lines connected to cells of the NAND strings and select lines connected to select gate transistors of the NAND strings. A plurality of blocks are connected together and selected for operations using a block select signal. A control circuit is configured to, after a read operation of memory cells of the block, hold a block select signal applied to a block select line to select a group of blocks having a same block select line at an on level. The control circuit can further discharge an unselected control gate in the group of blocks from a charged level to a lower level, lower than charged, prior to turning off the block select signal and charge the unselected control gate to a level greater than the lower level after the block select signal transitions from the on level to an off level.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes a block of memory cells arranged in strings and connected to word lines overlying one another in a stack. The block is divided into first and second sub-blocks programmed as a whole in a sub-block mode and includes a particular group connected to a particular word line. A control circuit determines whether the particular group being read is in the second sub-block when operating in the sub-block mode. The control circuit also determines whether one of the first and second sub-blocks is not programmed based on whether the particular group being read is in the second sub-block. The control circuit applies an adjusted read voltage to the word lines of the one of the first and second sub-blocks while reading the particular group based on whether the one of the first and second sub-blocks is not programmed.

Abstract: Technology is disclosed herein for a semiconductor die, and controlling operation of the semiconductor die. In some aspects, a semiconductor die is configured to test an I/O circuit on the semiconductor die. The semiconductor die has an input circuit that compares a voltage signal at one of a first input or a second input with a reference voltage at the other of the first input or the second input to generate an input voltage signal. The first input may be connected to an I/O contact. During a normal mode a control circuit on the die provides a reference voltage to second input. During a test mode, the control circuit internally loops back a test signal from an output circuit to the second input of the input circuit. Thus, the test signal avoids the I/O contact.

Abstract: An apparatus includes nonvolatile memory cells arranged in columns including a plurality of redundant columns with control circuits coupled to the nonvolatile memory cells. The control circuits are configured to maintain an ordered list of bad columns replaced by redundant columns. The control circuits are configured to detect an out-of-order entry in the ordered list of bad columns replaced by redundant columns.

Abstract: An apparatus including a memory structure comprising non-volatile memory cells and a microcontroller. The microcontroller is configured to output Core Timing Control (CTC) signals that are used to control voltages applied in the memory structure. In one aspect, information from which the CTC signals may be generated is pre-computed and stored. This pre-computation may be performed in a power on phase of the memory system. When a request to perform a memory operation is received, the stored information may be accessed and used to generate the CTC signals to control the memory operation. Thus, considerable time and/or power is saved. Note that this time savings occurs each time the memory operation is performed. Also, power is saved due to not having to repeatedly perform the computation.

Abstract: An apparatus including a memory structure comprising non-volatile memory cells and a microcontroller. The microcontroller is configured to output Core Timing Control (CTC) signals that are used to control voltages applied in the memory structure. In one aspect, information from which the CTC signals may be generated is pre-computed and stored. This pre-computation may be performed in a power on phase of the memory system. When a request to perform a memory operation is received, the stored information may be accessed and used to generate the CTC signals to control the memory operation. Thus, considerable time and/or power is saved. Note that this time savings occurs each time the memory operation is performed. Also, power is saved due to not having to repeatedly perform the computation.