Patents Assigned to Sanmina Corporation
  • Patent number: 11921326
    Abstract: An optical rotary joint includes a first annular portion and a second annular portion configured to rotate with respect to each other. Optical receivers on a receiver face of the second annular portion receive from optical transmit beam launchers on an emitter face of the first annular portion. The transmit beam launchers transmit optical signals to the optical receivers as the second annular portion rotates with respect to the first annular portion.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 5, 2024
    Assignee: Sanmina Corporation
    Inventors: John Michael Dugan, Curtis Pastor, Mark Alt
  • Patent number: 11925004
    Abstract: One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: March 5, 2024
    Assignee: Sanmina Corporation
    Inventors: Odie Banks Killen, Jr., Matthew J. Babcock, Brendan Ruggles
  • Patent number: 11867201
    Abstract: One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: January 9, 2024
    Assignee: Sanmina Corporation
    Inventors: Odie Banks Killen, Jr., Bradley S. Holway, Matthew J. Babcock
  • Patent number: 11851211
    Abstract: Aspects of the present disclosure are related unmanned aerial vehicles tethered to ground stations with an expendable airborne fiber-optic link. The tethers may be fiber-optic cables that can be used as a communications conduit between a ground station and a UAV for providing vehicle positioning/control information to the UAV as well as transmitting a large amount of information/data to the UAV. As the information being transmitted between to the UAV the ground station is critical, fiber-optic cables provide the bandwidth and transmission capabilities required with the added benefit of electromagnetic interference (EMI) and radio-frequency interference (RFI) immunity, making this an ideal solution for these applications.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: December 26, 2023
    Assignee: Sanmina Corporation
    Inventors: Max Edward Klein, David Porter, Walter Thomas Castleberry
  • Patent number: 11765827
    Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: September 19, 2023
    Assignee: Sanmina Corporation
    Inventors: Shinichi Iketani, Dale Kersten, George Dudnikov, Jr.
  • Patent number: 11546992
    Abstract: One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: January 3, 2023
    Assignee: SANMINA CORPORATION
    Inventors: Charles C. Hill, Franz Michael Schuette
  • Patent number: 11399439
    Abstract: The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: July 26, 2022
    Assignee: SANMINA CORPORATION
    Inventors: Douglas Ward Thomas, Shinichi Iketani, Dale Kersten
  • Patent number: 11304311
    Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: April 12, 2022
    Assignee: SANMINA CORPORATION
    Inventors: Shinichi Iketani, Drew Doblar
  • Patent number: 11301324
    Abstract: A server computer is configured to write a first copy of a block of data to a first namespace on a first non-volatile memory-based cache drive and a second copy of the block of data to a RAID controller for de-staging of the data to hard disk drives of a RAID array. Acknowledgment of hardening of the data on the hard disk drives initiates purging of the first copy of the block of data from the cache drive. High availability is enabled by writing a third copy of the block of data to a second server to store the block of data in a second namespace on a second non-volatile memory-based cache drive. Restoring of data after power loss accesses the data on the first non-volatile memory-based cache drive.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: April 12, 2022
    Assignee: SANMINA CORPORATION
    Inventors: Kais Belgaied, Richard Elling, Franz Michael Schuette
  • Patent number: 11246226
    Abstract: Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: February 8, 2022
    Assignee: SANMINA CORPORATION
    Inventors: Shinichi Iketani, Dale Kersten
  • Patent number: 11086813
    Abstract: A network-attached storage device is provided comprising a network card with an embedded operating system that provides autonomous operation of the network card, the network card including a network port to communicate with an external device and a peripheral component interconnect express (PCIe) interface to couple to a first PCIe device in the absence of a system host processor.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: August 10, 2021
    Assignee: Sanmina Corporation
    Inventors: Franz Michael Schuette, Daniel M. Gale, Charles C. Hill, Matthew T. Bowman, Ritesh Kumar
  • Publication number: 20210137466
    Abstract: A biosensor unit is coupled to a user device and may communicate with the user device over a short range wireless or wired interface. The biosensor unit includes an optical sensor used to obtain a plurality of PPG signals. The PPG signals are used to obtain an oxygen saturation level, a heart rate and a respiration rate of a user. The PPG signal may also be used to obtain a nitric oxide (NO) level and glucose level of the user. The user device may generate a graphical user interface to display the biosensor data to a user.
    Type: Application
    Filed: December 18, 2020
    Publication date: May 13, 2021
    Applicant: Sanmina Corporation
    Inventor: Robert Steven Newberry
  • Patent number: 10996041
    Abstract: Containment vessels are adapted to facilitate blast and dispersion mitigation. According to one example, a containment vessel may include at least one containment layer. At least one expansion member may be coupled to the at least one containment layer to apply a force sufficient to expand a perimeter of the containment layer(s) laterally outward. A closure system may be coupled with the containment layer(s), where the closure system is configured to cinch the perimeter of the containment layer(s) around a target object without manual intervention. Unmanned aerial vehicle (UAV) including a containment vessel, as well as methods of making a containment vessel are also disclosed. Other aspects, embodiments, and features are also included.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: May 4, 2021
    Assignee: SANMINA CORPORATION
    Inventor: Max Edward Klein
  • Patent number: 10993333
    Abstract: A method for making an ultra-thin dielectric printed circuit board (PCB) is provided. A first side of a first conductive layer is removably coupled to a disposable base. A first ultra-thin dielectric layer and a second conductive layer are laminated to a second side of the first conductive layer, where the first ultra-thin dielectric layer is positioned between the first and second conductive layers, and the first ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may then be patterned to form electrical paths. The patterned second conductive layer is then filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may then be coupled to the second conductive layer. The disposable base may then be detached from the first conductive layer.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: April 27, 2021
    Assignee: SANMINA CORPORATION
    Inventors: Shinichi Iketani, Toshiya Suzuki
  • Patent number: 10973470
    Abstract: A photoplethysmography (PPG) circuit obtains PPG signals at a plurality of wavelengths of light reflected from tissue of a user. A processing device generates parameters using the PPG signals to screen the user for an infection, such as sepsis, influenza and/or COVID-19. The processing device may also determine a severity level of the infection and a confidence level in the determination. The parameters may include a measurement of nitric oxide (NO) level, respiration rate, heart rate and/or oxygen saturation.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: April 13, 2021
    Assignee: SANMINA CORPORATION
    Inventors: Robert Steven Newberry, Matthew Rodencal
  • Patent number: 10952682
    Abstract: A photoplethysmography (PPG) circuit obtains PPG signals at a plurality of wavelengths of light reflected from tissue of a user. A processing device generates parameters using the PPG signals to determine a glucose level in blood flow of the user. The parameters include one or more ratio values obtained using the plurality of PPG signals; a phase delay between the plurality of PPG signals; a correlation of phase shape between the plurality of PPG signals or a periodicity of one or more of the plurality of PPG signals.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: March 23, 2021
    Assignee: SANMINA CORPORATION
    Inventors: Robert Steven Newberry, Matthew Rodencal
  • Patent number: 10945676
    Abstract: A biosensor identifies a blood type using photoplethysmography (PPG) technology. A PPG circuit obtains a plurality of spectral responses at a plurality of wavelengths detected from skin of a user. A processing circuit determines a blood factor indicator using the plurality of spectral responses. The blood factor indicator may include a signal quality parameter or a ratio R value. A calibration database includes a correlation of the blood factor indicator to a plurality of blood types. The blood type of the user is identified using the blood factor indicator and the calibration database.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 16, 2021
    Assignee: Sanmina Corporation
    Inventor: Robert Steven Newberry
  • Patent number: 10932727
    Abstract: User equipment is configured to collect biosensor data from an integrated biosensor or by receiving biosensor data from one or more external biosensors. The user equipment includes a Health Monitoring (HM) application. The HM application is configured to receive the biosensor data and display the biosensor data on the display of the user equipment. The user equipment may also communicate biosensor data over a local or wide area network to a third party, such as a pharmacy or health care provider.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: March 2, 2021
    Assignee: SANMINA CORPORATION
    Inventor: Robert Steven Newberry
  • Patent number: 10926875
    Abstract: Unmanned aerial vehicle (UAV) capture devices and methods of operation are disclosed. A UAV capture device may include a netting system including a net launch device and a net, a propulsion system including a plurality of propellers coupled to one or more motors, a positioning system, a camera system, and a processing system coupled to the netting system, the propulsion system, the positioning system, and the camera system. The processing system may include logic to operate the propulsion system to autonomously navigate to a general location of a target UAV, to operate the propulsion system to pursue the target UAV, to deploy the netting system to propel the net at the target UAV, and to confirm if the target UAV is captured in the net. Other aspects, embodiments, and features are also included.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: February 23, 2021
    Assignee: SANMINA CORPORATION
    Inventor: Max Edward Klein
  • Patent number: D928346
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: August 17, 2021
    Assignee: Sanmina Corporation
    Inventors: Allan Cube, Ren Baculi, Glen Gommels