Abstract: An integrated drug delivery and biosensor (IDDB) system is implemented on a patch or arm band. The drug delivery system includes needles adapted to pierce the skin and direct injection of a predetermined dosage of medication through the needles into the epidermis of the skin of a patient. The integrated biosensor monitors absorption of the medication into the epidermis of the skin of the patient and may also monitor concentration of the medication or other relevant substances in arterial blood flow of the patient. The integrated biosensor may also monitor a patient's vitals in response to the medication. The integrated biosensor may then alter dosage or frequency of administration of dosages or even halt a dosage of medication in response to the patient's vitals or absorption of the medication.

Abstract: A system is provided comprising: a packet routing network; Flash storage circuitry; a management processor coupled as an endpoint to the network; an input/output (I/O) circuit coupled as an endpoint to the network; a packet processing circuit coupled as an endpoint to the network; and a RAID management circuit coupled as an endpoint to the network and configured to send and receive packets to and from the Flash storage circuitry; wherein the management processor is configured to determine routing of packets among the I/O circuit, packet processing circuit and RAID management circuit.

Abstract: A method is provided to configure endpoints of a packet routing network, in which one or more endpoints includes Flash storage; multiple endpoints are provided that are configured to impart services to packets; a plurality of information structure portions are provided that associate flow identifiers with next hop destination endpoint addresses to define a plurality of flow identifier-next hop destination endpoint addresses pairs (pairs); different pairs are stored within non-transitory storage devices at different endpoints so that relationships among the next hop destination endpoint addresses of the pairs stored at different endpoints define multiple respective sequences of endpoints that each includes one or more endpoints configured to impart a service and an endpoint that includes Flash storage.

Abstract: In one aspect, an optical media converter is provided for use within aircraft data networks. In one example, the optical media converter converts electrical doublet signals to optical Manchester signals, and vice versa. In an illustrative example, the optical media converter includes a receiver circuit coupled to a fiber optic port for receiving a Manchester-encoded input signal using an edge-coupled filter that filters out signals not associated with edges within the time-varying input signal Manchester signal. The optical media converter also provides, for example, for high common mode rejection and includes logic to correct for bit-width skew. The optical media converter is well-suited for use in converting doublet signals generated by a serial interface module of a line replaceable unit of an ARINC 629-compatible system into optical Manchester signals for transmission over a fiber optic bus system interconnected by a star coupler.

Abstract: A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.

Abstract: A side loading enclosure for a rack mount type storage unit is provided. The enclosure provides for easier access to hard disk drives (HDDs) for maintenance and repair as well as the ability to increase the number of HDDs that can be mounted in a single enclosure. The enclosure may include a bottom plate, a pair of side plates, and a pair of end plates. Located within the enclosure are a first row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a first printed circuit board and a second row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a second printed circuit board. The one or more stacks of HDDS in the first row is separate from and located parallel to the one or more stacks of HDDs in the second row.

Abstract: A memory module is provided comprising a substrate having an interface to a host system, volatile memory, non-volatile memory, and a logic device. The logic device may receive the indicator of an external triggering event and copies data from the volatile memory devices to the non-volatile memory devices upon receipt of such indicator. When the indicator of the triggering event has cleared, the logic device restores the data from the non-volatile to the volatile memory devices. The memory module may include a passive backup power source (e.g., super-capacitor) that is charged by an external power source and temporarily provides power to the memory module to copy the data from volatile to non-volatile memory. A voltage detector within the memory module may monitor the voltage of an external power source and generates an indicator of a power loss event if voltage of the external power source falls below a threshold level.

Abstract: A retaining clip to be used with a storage device in a host computer system, wherein the retaining clip is configured to secure an interposer serving as electrical and logic state interface between the device and the structure of the host system. The retaining clip engages with the device through a peg inserted into a mounting hole for the device and secures the interposer by holding it against the device's data or power connector by a tab extending over the interposer and exerting pressure against it towards the device. Additional fins extending from the body of the clip in substantially opposite direction from the tab secure the tab against the enclosure of the host computer system.

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract: An insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract: A memory device with die stacking is provided. A plurality of substrates layers are stacked together into a stack. Each substrate layer may include a substrate having a plurality of cavities to receive integrated circuit components within the thickness of the substrate. A plurality of conductive spheres are arranged between at least two adjacent substrate layers and are electrically coupled to the integrated circuit components in at least one of the two adjacent substrates. The two adjacent substrate layers of the stack include: (a) a first substrate having a first plurality of cavities to receive integrated circuit components, and (b) a second substrate having a second plurality of cavities to receive integrated circuit components, wherein the first plurality of cavities is offset from a second plurality of cavities.

Abstract: In one aspect, an optical media converter is provided for use within aircraft data networks. In one example, the optical media converter converts electrical doublet signals to optical Manchester signals, and vice versa. In an illustrative example, the optical media converter includes a receiver circuit coupled to a fiber optic port for receiving a Manchester-encoded input signal using an edge-coupled filter that filters out signals not associated with edges within the time-varying input signal Manchester signal. The optical media converter also provides, for example, for high common mode rejection and includes logic to correct for bit-width skew. The optical media converter is well-suited for use in converting doublet signals generated by a serial interface module of a line replaceable unit of an ARINC 629-compatible system into optical Manchester signals for transmission over a fiber optic bus system interconnected by a star coupler.

Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: A structural bracket, for use with flat pack frames, formed from a single flat sheet of metal that is constructed without the use of welding points so as to simplify the manufacturing process is provided. The flat sheet of metal may have a generally triangular configuration that includes notches at strategic locations in the sheet of metal to create flaps that may be folded over to form the sidewalls of the brackets. The sidewalls of the brackets may be used to secure vertical and/or horizontal rails together when assembling a flat pack equipment rack. Additionally, a pair of structural brackets may be secured together by fasteners forming a single bisected structural bracket. The utilization two separate brackets to form a single bisected structural bracket provides for a flat pack solution for equipment racks while being as structurally strong as a traditional, fully welded frame.

Abstract: A side loading enclosure for a rack mount type storage unit is provided. The enclosure provides for easier access to hard disk drives (HDDs) for maintenance and repair as well as the ability to increase the number of HDDs that can be mounted in a single enclosure. The enclosure may include a bottom plate, a pair of side plates, and a pair of end plates. Located within the enclosure are a first row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a first printed circuit board and a second row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a second printed circuit board. The one or more stacks of HDDS in the first row is separate from and located parallel to the one or more stacks of HDDs in the second row.

Abstract: An insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.