Abstract: In one embodiment, a telephone system that includes a number of payphones intended for communication with servers via at least one communication network is disclosed. In one embodiment, the communication network includes a communication interface able to monitor communications between the said payphones and at least a first group of servers.

Abstract: An IC card system for a game machine using an IC card includes a game token input device for inputting a game token onto the IC card based on the amount of money deposited. The IC card system also includes a game device that decreases the number of game tokens stored on the IC card when the IC card is used with the game device. The IC system also includes a totaling device that determines the number of tokens inputted by the game token input device and the number of tokens used by the game devices, at a particular location.

Abstract: An integrated circuit device is disclosed. The device includes an active film having a semiconducting material and an integrated circuit disposed on an active face of the active film. The integrated circuit includes a plurality of circuit elements. In addition, the device includes an additional film fixed to the active face of the active film, the additional film at least partially covering said integrated circuit, and an anti-fraud mechanism disposed within the additional film, the anti-fraud mechanism being positioned to align with one of the plurality of circuit elements. In some aspects, the additional film includes a protective sub-film and a sealing sub-film, wherein the protective sub-film is sealed to the active face of the active film by the sealing sub-film.

Abstract: A contactless memory card that includes a card body (1), an integrated circuit (3) embedded in the card body, and a coupling antenna (4) connected to two contact pads (6) of the integrated circuit. The antenna is made in a spiral pattern, with its turns passing over the flush face (5) of the integrated circuit.

Abstract: The printed circuit has connection pads emerging in a face of the integrated circuit, which face is covered in an insulating layer (5) having openings in register with the connection pads, and at least one conductor track (7) extending over the first insulating layer and having one end connected to one of the connection pads of the integrated circuit. A second insulating layer (8) covers the first insulating layer and has openings (9) in register with each conductor track (7) of the first layer and in register with each connection pad that is not connected to a conductor track (7), and it carries at least one repositioning conductor track (10) extending over the second insulating layer (8) having one end connected to a conductor track (7) of the first insulating layer.