Abstract: The present disclosure provides conductive plug structures and fabrication methods thereof. An exemplary fabrication process of the conductive plug structure includes providing a substrate; forming a mask layer having an opening on a surface of the substrate; etching the substrate to form a contact hole using the mask layer as an etching mask; etching the mask layer to increase a feature size of the opening; forming an insulation layer on an inner surface of the opening, an inner surface of the enlarged opening and a surface of the mask layer to have more edge corners, a thickness of the insulation layer being greater than a thickness of the remaining mask layer; forming a conductive layer filling the contact hole on the insulation layer; and planarizing the conductive layer and the insulation layer until a surface of the mask layer is exposed.

Abstract: A semiconductor device includes a plurality of substantially vertical semiconductor pillars on a substrate, and a hard mask layer overlying the plurality of semiconductor pillars. A contiguous portion of the hard mask layer connects two or more of the plurality of semiconductor pillars.

Abstract: The disclosed subject matter provides a Fin-FET with a thinned-down InP layer and thinning-down method thereof. In a Fin-FET, the fin structure is made of InGaAs and an InP layer is formed to cover the fin structure. The InP layer is obtained from an initial InP layer formed on the fin structure through a thinning down process including converting a surface portion of the InP layer into a Phosphorus-rich layer and removing the Phosphorus-rich layer. The thickness of the ultimately-formed InP layer is less than or equal to 1 nm. According to the disclosed method, the InP layer in the Fin-FET may be easily thinned down, and during the thinning-down process, contamination may be avoided.

Abstract: A receiver includes a first transfer gate, a first inverter, a second inverter, a second transfer gate, a third inverter, and a fourth inverter connected in series, a first power supply supplying power to the first and second inverters, a second power supply supplying power to the third and fourth inverters, a third power supply supplying power to the second transfer gate, first and second signals having opposite logic levels for controlling the first transfer gate. The third power supply is significantly lower than the first or second power supply. The leakage current of the receiver is significantly reduced in the core when the second power supply remains on but the first power supply is turned off while the performance of the receiver remains the same.

Abstract: The present disclosure provides Efuse bit cells and read/write methods thereof, and Efuse arrays. An exemplary Efuse bit cell includes a data latch configured to latch data of the Efuse bit cell, having two branches with a fuse disposed in a first branch and a resistor disposed in a second branch; a selection controller configured to control connections between one terminal of the first branch and a power source and between one terminal of the second branch and the power source, another terminal of the first branch and another terminal of the second branch being connected to ground; a first diode and a second diode, one of the first diode and the second diode being configured to input a write data signal; and a pass unit configured to transmit data stored in the Efuse bit cell and output a bit line signal.

Abstract: A write tracking circuit includes a dummy memory cell coupled to a first dummy bit line, a second dummy bit line, and a dummy word line, a logic operation unit coupled to the dummy word line and to the first dummy bit line and configured to output a write feedback signal based on a logic operation of a signal on the dummy word line and a signal on the first dummy bit line, and a delay unit coupled to the dummy memory cell at a storage node. The write tracking circuit provides a correct feedback signal to the clock generation module to ensure normal operation of the peripheral circuit, when a data write operation to the dummy memory cell failed.

Abstract: A memory cell includes a first diode, a second diode, and a random access memory cell element. The first diode and the random access memory cell element are series connected between a bit line and a word line. The second diode and the random access memory cell element are series connected between the word line and a reset line. A set path is formed through the first diode and the random access memory cell element, and a reset path is formed through the random access memory cell element and the second diode. The first diode is configured to performed a read operation and a set operation. The second diode is configured to perform a reset operation. The memory cell has higher forward current, lower leakage current and smaller size comparing with conventional memory cells.

Abstract: A method is provided for fabricating a semiconductor testing structure. The method includes providing a substrate having a to-be-tested device structure formed on a surface of the substrate, a dielectric layer formed on the surface of the substrate and a surface of the to-be-tested structure, and conductive structures and an insulation layer electrically insulating the conductive structures formed on a first surface of the dielectric layer. The method also includes planarizing the conductive structures and the insulation layer to remove the conductive structures and the insulation layer until the first surface of the dielectric layer is exposed; and bonding the first surface of the dielectric layer with a dummy wafer by an adhesive layer. Further, the method includes removing the substrate to expose a second surface relative to the first surface of the dielectric layer of the dielectric layer and a surface of the to-be-tested device structure.

Abstract: An integrated device includes a field effect transistor formed within and upon an active region of a substrate and a resistor formed on an isolation region of the substrate. The field effect transistor includes a gate stacked structure having respective portions of a dielectric layer, a first conductive layer and a second conductive layer arranged in order from bottom to top. The resistor includes a resistor body being an enclosure portion of the first conductive layer and resistor terminals being portions of the second conductive layer on distal ends of the resistor body. A method for manufacturing a semiconductor device includes forming a gate stacked structure and a resistor stacked structure at the same time by patterning a dielectric layer, a first conductive layer and a second conductive layer. The method also includes forming a resistor having a resistor body by patterning the resistor stacked structure.

Abstract: The disclosed subject matter provides a method for fabricating a three-dimensional transistor. The method includes forming an active region and two isolation structures on a semiconductor substrate. The active region is formed between the two isolation structures. The method further includes forming a photoresist layer on the active region and the isolation structures, forming an opening in the photoresist layer to expose a top surface of the active region and a portion of a top surface of each isolation structure, and then forming a trench on each side of the active region by removing a portion of the corresponding isolation structure exposed in the opening through an etching process using the photoresist layer as an etch mask. After the etching process, the portion of the active region between the two trenches becomes a three-dimensional fin structure. The disclosed method simplifies fabrication process for three-dimensional transistors and reduces product cost.

Abstract: A memory cell includes a first diode, a second diode, and a random access memory cell element. The first diode and the random access memory cell element are series connected between a bit line and a word line. The second diode and the random access memory cell element are series connected between the word line and a reset line. A set path is formed through the first diode and the random access memory cell element, and a reset path is formed through the random access memory cell element and the second diode. The first diode is configured to performed a read operation and a set operation. The second diode is configured to perform a reset operation. The memory cell has higher forward current, lower leakage current and smaller size comparing with conventional memory cells.

Abstract: The present disclosure provides mark structures and fabrication methods thereof. An exemplary fabrication process includes providing a substrate having a device region, a first mark region and a second mark region; sequentially forming a device layer, a dielectric layer and a mask layer on a surface of the substrate; forming a first opening in the dielectric layer in the device region, a first mark in the dielectric layer in the first mark region, and a mark opening in dielectric layer in the second mark region, bottoms of the first opening, the first mark and the mark opening being lower than a surface of the dielectric layer, and higher than a surface of the device layer; and forming a second opening in the dielectric layer on the bottom of the first opening and a second mark in the dielectric layer on the bottom of the mark opening.

Abstract: An electrical fuse (eFuse) array includes eFuse cells arranged in multiple rows and columns. Each eFuse cell has an eFuse, a first diode, and a second diode coupled to an internal node, each eFuse cell further having first, second, and third terminals coupled, respectively, to the first diode, the second diode, and the eFuse. The eFuse array further includes a shared NMOSFET for each of the multiple rows, with a drain coupled to the third terminal of each of the plurality of eFuse cells in that row and a gate coupled to a word line. Each column includes a write bit line coupled to the second terminal of each of the eFuse cells in that column, and a read bit line coupled to the first terminal of the eFuse cell.

Abstract: The present disclosure provides asynchronous successive approximation register analog-to-digital converter (ASAR ADC) circuits and signal conversion method thereof. An exemplary ASAR AC circuit includes a sample/hold circuit configured to input a first analog signal and output a second analog signal; a digital-to-analog converter circuit configured to output a third analog signal; a first voltage comparison circuit configured to respond to a valid level of a latch signal, and output a first logic level and a second logic level; a first logic circuit configured to respond to a valid level of a flag signal, and identify a comparison result of the first voltage comparison circuit and output the first digit signal; and a pulse generation circuit configured to generate the latch signal and the flag signal with a generation time of the valid levels independently from the first logic level and the second logic level.

Abstract: A array of electrically programmable fuse (eFuse) units includes at least one connecting switch connecting two adjacent eFuse units. Each eFuse unit includes an eFuse, a write switch for passing through a first portion of a write current, a read/write switch for passing through a second portion of the write current or a read current, and a common node. The eFuse, the write switch, the read/write switch, and the at least one connecting switch are connected to each other at the common node. By turning on and off the at least one connecting switch, the current is split among the eFuse units, so that the size of the write switch can be reduced, thus reducing the total area of the array.

Abstract: A method is provided for fabricating a NAND flash memory. The method includes providing a semiconductor substrate having an isolation material layer formed on the semiconductor substrate, a selection gate material layer formed on the isolation material layer, and a plurality of alternately stacked gate dielectric material layers and control gate material layers formed on the selection gate material layer; forming a hard mask layer having a plurality of openings on a surface of the uppermost control gate material layer; forming a stacked gate structure on the semiconductor substrate, wherein the stacked gate structure includes a selection gate on the semiconductor substrate and control gates on the selection gate, and a width of the stacked gate structure is the same as a width of the hard mask layer on a top surface of the stacked gate structure; isolating the selection gate and the control gates by a gate dielectric layer.

Abstract: A method for forming a semiconductor device includes providing a semiconductor substrate including a PMOS region and an NMOS region. A spacer material layer is deposited. Then, a first photo masking and etch process is used to form first sidewall spacers on the sidewalls of the gate structures in the NMOS region. A sacrificial surface layer is formed. Next, a second photo masking and etch process is used to form second sidewall spacers on the sidewalls of the gate structures in the PMOS region. After the second photoresist layer is removed, with the sacrificial layer masking the NMOS region, stress layers are formed in source/drain regions in the PMOS region, and a cover layer is formed on the stress layers. The method further includes removing the sacrificial material layer, the first sidewall spacers, and the second sidewall spacer.

Abstract: A memory device may include a first inverter, a second inverter, and a control transistor. The control transistor is electrically connected to each of an output terminal of the first inverter and an input terminal of the second inverter for controlling an electrical connection between the output terminal of the first inverter and the input terminal of the second inverter.

Abstract: A method for forming a semiconductor device includes forming a fin device structure in a buffer layer on a substrate. The fin device structure includes a lower portion extending over the silicon substrate and a fin structure protruding above the lower portion. The method also includes forming a sacrificial layer disposed over the fin device structure and forming a device semiconductor layer disposed over a surface of the sacrificial layer. A gate dielectric layer is then formed and is disposed over a surface of the device semiconductor layer. A gate electrode layer is formed and disposed over a surface of the gate dielectric layer. The method includes removing a portion of the sacrificial layer to form a cavity surrounding the fin structure and performing an oxidation process to form a thermal oxide layer in the cavity surrounding the side surface of the fin structure.

Abstract: A method of fabricating a fin for a FinFET device includes providing a semiconductor substrate, forming a patterned silicon germanium layer on the semiconductor substrate, epitaxially growing a silicon layer on a top surface and sidewalls of the patterned silicon germanium layer, forming a sacrificial layer covering the patterned silicon germanium layer, and removing the sacrificial layer and a portion of the silicon layer disposed on the top surface of the patterned silicon germanium layer until a top surface of the sacrificial layer is co-planar with the top surface of the patterned silicon germanium layer. The method further includes removing the patterned silicon germanium layer and removing the sacrificial layer to form the fin. The epitaxially formed fin does not have the issues of line width roughness and edge roughness to improve the performance of the FinFET device.