Patents Assigned to Semiconductor Technologies & Instruments
  • 3-D lead inspection
    Patent number: 6532063
    Abstract: A semiconductor lead inspection device includes a camera and an illumination source for backlighting the leads of the semiconductor device to form an image in the camera. The camera and the illumination device are arranged on optical paths which alternatively pass through or are reflected by a beamsplitter. A surface is illuminated to backlight the leads and a light deflecting device is arranged for deflecting the backlit image of the semiconductor leads to form an image in the camera.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: March 11, 2003
    Assignee: Semiconductor Technologies & Instruments
    Inventors: Seow Hoon Tan, Sreenivas Rao
  • System and method for transferring components between packing media
    Patent number: 6151864
    Abstract: A system for transferring components between packing media, such as tube packing media and tape packing media, is provided. The system includes a first packing media handling system, such as a tube handling system. The system also includes a second packing media handling system, such as a tape packing media system. A component handling system can transfer components from the tubes to the taping system, or from the taping system to the tubes.
    Type: Grant
    Filed: April 28, 1999
    Date of Patent: November 28, 2000
    Assignee: Semiconductor Technologies & Instruments
    Inventors: Han Chin Fong, Sua Jit Sim