Abstract: A power semiconductor module having a substrate, with a power semiconductor component, a connecting device, external terminal elements, a potting body and a pressure device, wherein the substrate has an insulant body and substrate conductor tracks, and the power semiconductor component is on a substrate conductor track, the connecting device is embodied as a film stack having a first electrically conductive film, a second electrically conductive film and an electrically insulating film arranged therebetween, wherein the external terminal elements each have a contact device for a substrate conductor track. The potting body completely covers the entire connecting device, envelops the substrate, and the external terminal elements apart from contact portions, and the pressure device exerts pressure on the potting body directly with a spring.

Abstract: A power semiconductor module has a substrate, a power semiconductor, a connecting device, a potting body, a pressure device, external terminal elements and a housing, the substrate has an insulant body and substrate conductor tracks, wherein the power semiconductor component is arranged on one of the substrate conductor tracks and electrically connected thereto. The connecting device is a film stack having a first electrically conductive film, a second electrically conductive film, an electrically insulating film therebetween, the connecting device is covered by the potting body, the pressure device exerts pressure on the potting body with a spring, the external terminal elements are arranged on the preformed housing or connected in a positively locking manner and have a contact device to an assigned substrate conductor track.

Abstract: A three-level power semiconductor module has a housing, a switching device, a first, a second and a third DC voltage terminal element and an AC voltage terminal element, wherein respective terminal areas of the DC voltage terminal elements have an identical normal direction and are arranged next to one another in a projection in the normal direction, and wherein the third terminal area of the third DC voltage terminal element lies in a first plane and the second terminal area of the second DC voltage terminal element lies in a second plane parallel to the first plane as seen in the normal direction. An arrangement having a plurality of such three-level power semiconductor modules is provided.

Abstract: A three-level power semiconductor module has a housing, with a switching device, with a first, a second and a third DC voltage terminal element which form a group, with an AC voltage terminal element wherein the switching device is formed as a TNPC circuit arrangement, which has a DC branch with an upper first switch, with a lower fourth switch and with a center tap and a T branch with a second switch and with a third switch connected in series with the second switch, wherein the first switch is formed of a plurality of first part switches, a majority of these part switches lie in the direction from the group of DC voltage terminals to the AC voltage terminal on a first straight line wherein the fourth switch is formed of a plurality of fourth part switches, wherein a majority of these part switches lie in the direction from the group of DC voltage terminals to the AC voltage terminal on a second straight line adjacent to the first and the focal points of the second and third switch lie in the direction from

Abstract: A three-level power semiconductor module with a housing, with a switching device, with a first, a second and a third DC voltage terminal element, and with an AC voltage terminal element.

Abstract: A device and a method for determining a load index of a power converter as part of a charging device for electrically operated vehicles. Included is a power converter which has power electronics switching equipment and a control device for controlling this, wherein a logging device stores a plurality, preferably at least three, particularly at least five, of characteristics of the charging device and in particular of the power converter, having an evaluation device, which evaluates the plurality of characteristics and determines the load index therefrom and, when a first threshold value of the load index is reached, transmits this information about this to a first superordinate decision device.

Abstract: An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

Abstract: A sintering press for producing a sintered connection between a first connection partner and a second connection partner disposed thereabove, having a suction-fixing installation for fixing the first connection partner, having a compression piece which is disposed above the suction-fixing installation.

Abstract: A power semiconductor module includes a substrate, having power semiconductor components, further including a housing element, and having a DC voltage connection device having a flat lead connection device and a second flat lead connection element, wherein the flat lead connection device has a first flat lead connection element encased by a plastic element of the flat lead connection device and materially bonded to the plastic element, wherein a connection section of the first flat lead connection element projects from the plastic element, a connection section of the second flat lead connection element is arranged on the plastic element or is at least partly enclosed by the plastic element and bonded to the plastic element so that a section of the plastic element is between the first flat lead connection element and the connection section of the second flat lead connection element.

Abstract: A power electronic assembly with a housing and a capacitor device therein. The capacitor device has capacitor elements, each with a first and a second capacitor contact device, and a capacitor busbar having a first metal shaped body with a first contact point and a second metal shaped body with a second contact point. The first metal shaped body of first polarity has a plurality of first terminal contact devices each connected to a first capacitor contact device and the second metal shaped body of second polarity has a plurality of second terminal contact devices each connected to a second capacitor contact device. The individual current paths each formed from a first partial current path between the first contact point and a first terminal contact device and a second partial current path between the second terminal contact device associated with the first and the second contact point each have the same current path length.

Abstract: A half-bridge circuit arrangement and a method for actuation, has a first, upper circuit breaker, an actuation device associated therewith and a second, lower circuit breaker, an actuation device. The power input of the upper circuit breaker is connected to a first potential of a DC voltage source, the power output of the lower circuit breaker is connected to a second potential of a DC voltage source, and the center tap between the two circuit breakers is connected to an AC voltage output, wherein, after one of the two circuit breakers which is switched on as voltage generation switch for a first voltage generation period has been switched off, the other circuit breaker.

Abstract: A power semiconductor module has a base plate with a housing and a switching device. The switching device has a substrate and a connecting device with a first and a second main face. A group of power semiconductor components is arranged on a conductor track of the substrate, and has a group midpoint. A pressure device is formed on the substrate in the normal direction to exert pressure, which pressure device has a pressure body and a pressure inducing body, wherein a pressure element is arranged protruding from the pressure body, wherein the pressure element presses onto a pressure section of the second main face of the connecting device, and wherein the pressure inducing body has a pressure transmission section with a pressure transmission point.

Abstract: A pressing device for indirectly or directly applying pressure to power-semiconductor components of a power-semiconductor module, having a pressing plate, having a pressing nub element which is formed from an elastic material and which has a pressing nub plate and pressing nubs projecting therefrom, and having a receiving device for receiving the pressing nub element, which receiving device has a base plate provided with recesses, wherein the recesses run through the base plate, wherein the pressing nub plate is arranged on the base plate and the pressing nubs run through the recesses and, on the main side of the base plate facing away from the pressing nub plate, project beyond this main side of the base plate, and wherein the pressing nub plate is arranged between the pressing plate and the base plate.

Abstract: A power semiconductor arrangement has a switching facility, a housing, having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility. The housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible. A cover facility for covering the first opening is on the housing so as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates with the external second plug-in connecting facility, whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility.

Abstract: A power electronic arrangement has a power converter module including a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and has a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection. The second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection. The second DC voltage terminal element or the second DC voltage connection element has a continuous welding cavity in the region of the first connection.

Abstract: A converter device has a converter that has power semiconductor switches and has a control device that is designed to drive the power semiconductor switches. The control device is designed to drive the power semiconductor switches so that electrical switching losses occurring in the converter are reduced during use.

Abstract: A power semiconductor module has a substrate, with power semiconductor components, and a DC voltage connecting device, which has a first and a second flat conductor connecting element and at least one first metal layer connecting element and at least one second metal layer connecting element, wherein the second flat conductor connecting element is arranged spaced apart in the normal direction of the first flat conductor connecting element from the first flat conductor connecting element, the first flat conductor connecting element is electrically connected by the first metal layer connecting element and the second flat conductor connecting element is electrically connected by the second metal layer connecting element to the metal layer, the first flat conductor connecting element has a flat conductor end section and a flat conductor connection section arranged between the one first metal layer connecting element and the flat conductor end section.

Abstract: A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

Abstract: A power electronic assembly with a housing and a capacitor device therein. The capacitor device has capacitor elements, each with a first and a second capacitor contact device, and a capacitor busbar having a first metal shaped body with a first contact point and a second metal shaped body with a second contact point. The first metal shaped body of first polarity has a plurality of first terminal contact devices each connected to a first capacitor contact device and the second metal shaped body of second polarity has a plurality of second terminal contact devices each connected to a second capacitor contact device. The individual current paths each formed from a first partial current path between the first contact point and a first terminal contact device and a second partial current path between the second terminal contact device associated with the first and the second contact point each have the same current path length.

Abstract: A functional component and having a partial plastic housing element with a plastic housing wall, the plastic housing wall having a device identification region integrated into the plastic housing wall and thus realizing a constituent part of the plastic housing wall. The device identification region comprising identification elements integrated into the plastic housing wall, those identification elements that realize part of a surface of the plastic housing wall realizing device identification elements, the device identification region being realized individually for the device by the device identification elements, such that the device can be unambiguously identified by means of the device identification region.