Abstract: A power electronic arrangement has a plurality of single-phase power semiconductor modules and one multi-phase power semiconductor module, wherein each single-phase power semiconductor module has a first, at least frame-like housing, two first DC voltage terminal elements, a first AC voltage terminal element, first auxiliary terminal elements and a first switching device. The multi-phase power semiconductor module has a second, at least frame-like housing, two second DC voltage terminal elements, at least two second AC voltage terminal elements, second auxiliary terminal elements and a second switching device. The first and second DC voltage terminal elements each form a stack in a section of their length and on the terminal sections are designed identically. All the power semiconductor modules are arranged in a row in the direction of the normal vectors of the respective first longitudinal side.

Abstract: A production method and a power electronic connecting device for a power semiconductor module, wherein the connecting device is designed as a flexible film stack of a first and a second electrically conductive film and an electrically insulating film arranged therebetween, wherein at least one of the electrically conductive films is structured in itself and thus forms a plurality of film conductor tracks, wherein a first one of these film conductor tracks has, in a first section, a first average thickness and, in a second section, a second average thickness which is at least 10%, preferably at least 20%, smaller than the first average thickness.

Abstract: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.

Abstract: A power electronics system has a switching device and a liquid cooling device. A switching device has a plate element, and power semiconductor devices are arranged on conductor tracks and connected by means of a connecting device, wherein the liquid cooling device has a first partial body having an inlet volume region and an outlet volume region and a second partial body. A cooling volume region is formed between the two partial bodies, wherein heat transfer bodies protrude into the cooling volume region from the second partial body. The second partial body is arranged in a recess of the first partial body and the two partial bodies are connected to each other and have a common plane surface which forms a first main surface.

Abstract: A circuit arrangement and a step-down converter have a first and a second input connection, with a first, upper and a second, lower step-down converter element. The first step-down converter element has a first input capacitor, the first capacitor connection of which is connected to the first input connection and the second capacitor connection of which is connected to the second output connection. A first series connection has a first switch and a first diode in parallel with the first input capacitor, and a first coil input of a first coil is connected to the center tap between the first switch and the first diode, the first coil output of said first coil being connected to the first output connection, and wherein the second step-down converter element has a second input capacitor.

Abstract: A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.

Abstract: Load bridges (2) of an inverter unit (1) include load branches having semiconductor switches (4, 5, 15, 16), that have a node point (6) which is connected to a load (7) and to two different potentials (P1, P2). Node points (6) are connected via a first resistance circuit (8) to potential (P1). Node points (6) are further connected via second resistance circuits (9) to tap-off points (11). The tap-off points (11) are connected via third resistance circuits (10) to the other potential (P2). At each of the tap-off points (11), a potential (U1, U2, U3) is tapped-off and is fed to a monitoring device (12). The monitoring device (12) determines the difference (U1?) between the tapped-off potentials and the second potential (P2). The control device (3) considers the signals (M1, M2, M3) for the actuation of the load bridges (2).

Abstract: An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

Abstract: A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Abstract: A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

Abstract: A power semiconductor module has a substrate and an insulation layer and a metal layer arranged on the insulation layer, forming conductor tracks, comprising power semiconductor components arranged on the metal layer and conductively contacted with the metal layer. A pressure device arranged above the substrate in the normal direction of the insulation layer and having a pressure body and pressure elements running toward the substrate. The pressure elements each being connected to the pressure body to move resiliently in the normal direction via a spring element. The pressure body exerting a pressure onto the pressure elements in the direction toward the substrate via the spring elements, the pressure elements being arranged in such a way that, owing to the pressure exerted by the pressure body, they press onto power semiconductor component surrounding regions, surrounding the power semiconductor components, of the substrate.

Abstract: A method for manufacturing a power semiconductor module and a power semiconductor module having, in each case, a housing, a switchgear arranged in this housing and having a plurality of connection elements, has the following method steps: A) forming a housing with pre-fixed connection elements; B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear; C) arranging a positioning device for fixing the position of the connection elements with respect to one another; D) fixing the connection elements relative to one another and to the housing.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.

Abstract: A power semiconductor device has a substrate on which power semiconductor switches are arranged and has a circuit board which includes conductive first plug-in connection contacts, a capacitor, a capacitor holding element that includes a reception device for receiving the capacitor, a temperature sensor for the capacitor, a temperature sensor holding element that has a plug-in region for conductive second plug-in connection contacts. There are temperature sensor connecting lines which electrically connect the temperature sensor and the second plug-in connection contacts to one another, at least one section of a temperature sensor connecting line being configured as a conductor track on the temperature sensor holding element, the second plug-in connection contacts forming an electrically conductive plug-in connection with the first plug-in connection contacts.

Abstract: A power semiconductor chip having: a semiconductor component body; a multilayer metallization arranged on the semiconductor component body; and a nickel layer arranged over the semiconductor component body. The invention further relates to a method for producing a power semiconductor chip and to a power semiconductor device. The invention provides a power semiconductor chip which has a metallization to which a copper wire, provided without a thick metallic coating, can be reliably bonded without damage to the power semiconductor chip during bonding.

Abstract: A power semiconductor module has a substrate, with power semiconductor components, and a DC voltage connecting device, which has a first and a second flat conductor connecting element and at least one first metal layer connecting element and at least one second metal layer connecting element, wherein the second flat conductor connecting element is arranged spaced apart in the normal direction of the first flat conductor connecting element from the first flat conductor connecting element, the first flat conductor connecting element is electrically connected by the first metal layer connecting element and the second flat conductor connecting element is electrically connected by the second metal layer connecting element to the metal layer, the first flat conductor connecting element has a flat conductor end section and a flat conductor connection section arranged between the one first metal layer connecting element and the flat conductor end section.

Abstract: A converter device has a converter that has power semiconductor switches and has a control device that is designed to drive the power semiconductor switches. The control device is designed to drive the power semiconductor switches so that electrical switching losses occurring in the converter are reduced during use.

Abstract: A power electronic switching device has a substrate facing in a normal direction with a first and a second conductive track, and a power semiconductor component is arranged on the first conductive track by an electrically conductive connection. The power semiconductor component has a laterally surrounding edge and an edge region and a contact region on its first primary side facing away from the substrate, and with a three-dimensionally preformed insulation molding that has an overlap segment, a connection segment and an extension segment, wherein the overlap segment, starting from the edge partially overlaps the edge region of the power semiconductor component.

Abstract: A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

Abstract: A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.