Patents Assigned to SEMILED OPTOELECTRONICS CO., LTD.
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Publication number: 20120086035Abstract: A light emitting diode device includes a substrate, one or more light emitting diode chips on the substrate configured to emit electromagnetic radiation, and a lens configured to encapsulate the light emitting diode chips having a surface with a micro-roughness structure. The micro-roughness structure functions to improve the light extraction of the electromagnetic radiation and to direct the electromagnetic radiation outward from the lens.Type: ApplicationFiled: November 23, 2011Publication date: April 12, 2012Applicant: SEMILEDS OPTOELECTRONICS CO., LTD.Inventor: Jui-Kang Yen
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Patent number: 8148733Abstract: Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.Type: GrantFiled: June 15, 2011Date of Patent: April 3, 2012Assignee: Semileds Optoelectronics Co., Ltd.Inventors: Wen-Huang Liu, Chen-Fu Chu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan, Yuan-Hsiao Chang
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Patent number: 8143112Abstract: Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.Type: GrantFiled: January 29, 2010Date of Patent: March 27, 2012Assignee: Semileds Optoelectronics Co., Ltd.Inventors: Trung Tri Doan, Chuong Anh Tran, Chen-Fu Chu, Chao-Chen Cheng, Jiunn-Yi Chu, Wen-Huang Liu, Hao-Chun Cheng, Feng-Hsu Fan, Jui-Kang Yen
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Patent number: 8129237Abstract: A vertical light-emitting diode (VLED) structure fabricated with a SixNy layer responsible for providing increased light extraction out of a roughened n-doped surface of the VLED are provided. Such VLED structures fabricated with a SixNy layer may have increased luminous efficiency when compared to conventional VLED structures fabricated without a SixNy layer. Methods for creating such VLED structures are also provided.Type: GrantFiled: May 15, 2008Date of Patent: March 6, 2012Assignee: SemiLEDS Optoelectronics Co., Ltd.Inventor: Chuong Anh Tran
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Patent number: 8124454Abstract: Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.Type: GrantFiled: October 11, 2006Date of Patent: February 28, 2012Assignee: SemiLEDS Optoelectronics Co., Ltd.Inventors: Chen-Fu Chu, Trung Tri Doan, Chuong Anh Tran, Chao-Chen Cheng, Jiunn-Yi Chu, Wen-Huang Liu, Hao-Chun Cheng, Feng-Hsu Fan, Jui-Kang Yen
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Publication number: 20120032217Abstract: The invention provides a white light emitting diode device, which includes: a conductive substrate; a multilayered light emitting semiconductor epitaxial structure formed on the conductive substrate; a contact provided on the multilayered light emitting semiconductor epitaxial structure; a transparent layer provided on the multilayered light emitting semiconductor epitaxial structure; a wavelength converting layer provided on the transparent layer; and an optical layer provided on the wavelength converting layer. The invention also provides a method of manufacturing the white light emitting diode device.Type: ApplicationFiled: May 27, 2011Publication date: February 9, 2012Applicant: Semileds Optoelectronics Co., Ltd., a Taiwanese CorporationInventor: Jui-Kang Yen
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Patent number: 8101966Abstract: A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.Type: GrantFiled: November 9, 2010Date of Patent: January 24, 2012Assignee: SemiLEDS Optoelectronics Co., Ltd.Inventor: Jui-Kang Yen
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Publication number: 20110316017Abstract: The invention relates to a wafer-type light emitting device having a substrate, one or more light emitting semiconductors formed on the substrate, one or more frames provided over the one or more light emitting semiconductors, and one or more wavelength-converting layers applied on the one or more light emitting semiconductors and confined by the one or more frames, wherein the wafer-type light emitting device is diced into a plurality of separate light emitting units.Type: ApplicationFiled: May 27, 2011Publication date: December 29, 2011Applicant: Semileds Optoelectronics Co., Ltd., a Taiwanese CorporationInventors: Wen-Huang Liu, Yuan-Hsiao Chang, Hung-Jen Kao, Chung-Che Dan, Feng-Hsu Fan, Chen-Fu Chu
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Publication number: 20110316027Abstract: The invention relates to a chip-type light emitting device including one or more light emitting semiconductors and one or more frames provided over a top of the one or more light emitting semiconductors.Type: ApplicationFiled: May 27, 2011Publication date: December 29, 2011Applicant: Semileds Optoelectronics Co., Ltd., a Taiwanese CorporationInventors: Wen-Huang Liu, Chung-Che Dan, Yuan-Hsiao Chang, Hung-Jen Kao
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Publication number: 20110309390Abstract: A lighting device comprising LEDs with phosphor layers includes a plurality of LED sets which can emit light with a peak emission wavelength between 360 nm and 490 nm; and a plurality of sets of phosphor layers covering the corresponding LED sets among the plurality of LED sets. At least two of the plurality of LED sets respectively have peak emission wavelength different from each other. The dominant fluorescence wavelength of at least one of the plurality of sets of phosphor layers ranges from 500 nm to 580 nm, and the dominant fluorescence wavelength of at least one of the other sets of phosphor layers ranges from 590 nm to 650 nm.Type: ApplicationFiled: March 11, 2010Publication date: December 22, 2011Applicant: SEMILEDS OPTOELECTRONICS CO., LTD.Inventors: Wen-Huang Liu, Trung-Tri Doan, Chuong-Anh Tran
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Patent number: 8012774Abstract: A light emitting diode (LED) device having a substantially conformal wavelength-converting layer for producing uniform white light and a method of making said LED at both the wafer and individual die levels are provided. The LED device includes a metal substrate, a p-type semiconductor coupled to the metal substrate, an active region coupled to the p-type semiconductor, an n-type semiconductor coupled to the active region, and a wavelength-converting layer coupled to the n-type semiconductor.Type: GrantFiled: September 8, 2006Date of Patent: September 6, 2011Assignee: SemiLEDs Optoelectronics Co., Ltd.Inventors: Chuong A. Tran, Trung T. Doan, Jui-Kang Yen, Yung-Wei Chen
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Patent number: 8003994Abstract: Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.Type: GrantFiled: June 25, 2010Date of Patent: August 23, 2011Assignee: SemiLEDs Optoelectronics Co., LtdInventors: Wen-Huang Liu, Chen-Fu Chu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan, Yuan-Hsiao Chang
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Patent number: 7968379Abstract: A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies.Type: GrantFiled: November 18, 2008Date of Patent: June 28, 2011Assignee: SemiLEDs Optoelectronics Co., Ltd.Inventors: Chen-Fu Chu, Trung Tri Doan, Hao-Chun Cheng, Feng-Hsu Fan, Fu-Hsien Wang
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Publication number: 20110114966Abstract: A high-brightness vertical light emitting diode (LED) device having an outwardly located metal electrode. The LED device is formed by: forming the metal electrode on an edge of a surface of a LED epitaxy structure using a deposition method, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), evaporation, electro-plating, or any combination thereof; and then performing a packaging process. The composition of the LED may be a nitride, a phosphide or an arsenide. The LED of the invention has the following advantages: improving current spreading performance, reducing light-absorption of the metal electrode, increasing brightness, increasing efficiency, and thereby improving energy efficiency. The metal electrode is located on the edge of the device and on the light emitting side. The metal electrode has two side walls, among which one side wall can receive more emission light from the device in comparison with the other one.Type: ApplicationFiled: November 3, 2010Publication date: May 19, 2011Applicant: Semileds Optoelectronics Co., Ltd., a Taiwanese CorporationInventors: Wen-Huang Liu, Li-Wei Shan, Chen-Fu Chu
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Publication number: 20110108851Abstract: The invention relates to a vertical light emitting diode (VLED) having an outwardly disposed electrode, the vertical light emitting diode comprises a conductive base, a semiconductor epitaxial structure formed on the conductive base, a passivation layer formed at the periphery of the semiconductor epitaxial structure, and a conductive frame formed on the passivation layer and contacting with the edge of the upper surface of the semiconductor epitaxial structure such that the conductive frame is electrically connected to the semiconductor epitaxial structure.Type: ApplicationFiled: November 4, 2010Publication date: May 12, 2011Applicant: Semileds Optoelectronics Co., Ltd., a Taiwan CorporationInventors: Chen-Fu Chu, Wen-Huang Liu, Hao-Chun Cheng
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Patent number: 7897420Abstract: Systems and methods are disclosed for fabricating a semiconductor light-emitting diode (LED) device by forming an n-doped gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.Type: GrantFiled: December 14, 2007Date of Patent: March 1, 2011Assignee: SemiLEDS Optoelectronics Co., Ltd.Inventors: Chen-Fu Chu, Hao-Chun Cheng, Feng-Hsu Fan, Wen-Huang Liu, Chao-Chen Cheng
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Patent number: 7892891Abstract: Techniques for dicing wafer assemblies containing multiple metal device dies, such as vertical light-emitting diode (VLED), power device, laser diode, and vertical cavity surface emitting laser device dies, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, such techniques are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.Type: GrantFiled: October 11, 2006Date of Patent: February 22, 2011Assignee: SemiLEDS Optoelectronics Co., Ltd.Inventors: Chen-Fu Chu, Trung Tri Doan, Chuong Anh Tran, Chao-Chen Cheng, Jiunn-Yi Chu, Wen-Huang Liu, Hao-Chun Cheng, Feng-Hsu Fan, Jui-Kang Yen
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Patent number: 7863639Abstract: A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.Type: GrantFiled: April 12, 2006Date of Patent: January 4, 2011Assignee: SemiLEDs Optoelectronics Co. Ltd.Inventor: Jui-Kang Yen
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Patent number: 7852015Abstract: A solid state light module incorporating light emitting diodes (LEDs) disposed on a metal substrate, a solid state lighting system employing such modules, and method of replacing LEDs of the light modules are provided. The metal substrate may allow for lower LED junction temperature and, hence, a longer device lifetime. In addition, the metal substrate may allow for the potential omission of a heat sink, which may reduce light module size, when compared to conventional solid state light emitters.Type: GrantFiled: October 11, 2006Date of Patent: December 14, 2010Assignee: SemiLEDS Optoelectronics Co., Ltd.Inventors: Jui-Kang Yen, Trung Tri Doan, Yung-Wei Chen, Ching-Tai Cheng
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Patent number: D653630Type: GrantFiled: April 22, 2011Date of Patent: February 7, 2012Assignee: Semileds Optoelectronics Co., Ltd.Inventor: Wen-Huang Liu