Abstract: A thermosensitive part sensing temperature; a temperature sensor for measurement provided in the unit and measuring temperature by contacting the unit with a body to be measured; a temperature detecting part detecting, from when the unit contacts the body, the time when the sensor senses a difference from an initial temperature of the sensor, and a measured temperature of the sensor at that time, and detecting, from when the difference is sensed, a time after a certain length of time and a measured temperature of the sensor at that time; an estimating part estimating, from the time when the difference is sensed and a time after a certain length of time, the time when the thermosensitive part contacts the body, and the measured temperature at that time; and a heat conduction analyzing part estimating the measured temperature based on output information from the temperature detecting part and the estimating part.

Abstract: Provided are a temperature sensor that performs high-speed sensing, whose cost is low, and whose layout is freely designed, the temperature sensor eliminating the need for complicated operations, and a method for manufacturing the temperature sensor. In a temperature sensor 1, terminal portions 9 of a connector portion 7 are exposed to an outside of a pipe section 2, a connector-side embedded portion 8 of the connector portion 7 is embedded in an embedding portion 4 of a side wall portion 3, an exposed portion 12 of a housing portion 11 is disposed in the pipe section 2, and an embedded base 13 of the housing portion 11 is embedded in the embedding portion 4. The housing portion 11 is made of a metal.

Abstract: A temperature measurement device (10) comprises: a thermosensitive unit (41) that senses temperature; a thin film thermosensitive element (1) for measurement capable of measuring the temperature by bringing the thermosensitive unit (41) into contact with a subject; a thin film thermosensitive element (2) for protective heating disposed to enable heat exchange with the thin film thermosensitive element (1) via an insulating layer (S1), and controlled so that the temperature thereof is equal to the temperature of the thin film thermosensitive element (1); a temperature control element (3) capable of causing the thin film thermosensitive element (1) to be in a temperature state in which the temperature thereof is a certain degree lower than the temperature of the subject; and a control processing unit (5) controlling the thin film thermosensitive element (1), the thin film thermosensitive element (2), and the temperature control element (3).

Abstract: A temperature sensor and a device are provided, in which the temperature sensor is capable of reducing thickness, increasing a contact area with an object whose temperature is to be measured, and improving measurement accuracy. A temperature sensor is provided with: a thermistor element; a lead-out wire connected to the thermistor element; a lead wire connected to the lead-out wire; an inner layer formed by heating and curing or by melting and solidifying a pair of sheet-like inner layer materials formed of a resin material; and outer layers formed of a pair of sheet-like outer layer materials formed of a resin material and having flat surfaces on both sides. The thermistor element, the lead-out wire, and a connection part between the lead-out wire and the lead wire are covered with the inner layer, and are also covered with the pair of outer layers by being sandwiched therebetween.

Abstract: Provided are an electronic component, a lead part connection structure, and a lead part connection method which can reduce damage of a lead part and improve joint strength. In this lead part connection structure, a lead part (3) made of a conductor and a conductive wire (5) made of a plurality of core wires (52) are connected to each other through welding, wherein the lead part (3) and the conductive wire (5) are connected to each other through welding in a condition in which the lead part (3) is fitted into the plurality of core wires (52) of the conductive wire (5). In the conductive wire (5), the core wires (52) are not integrated with each other in advance through welding.

Abstract: Provided are: a gas sensor which is able to have improved gas detection performance, while being capable of suppressing variation in the output characteristics among individual gas sensors; a gas detection device; a gas detection method; and a device which is provided with a gas sensor or a gas detection device. This gas detection device (10) is provided with: a heat sensitive resistive element (2); a lead part (22b) which is connected to the heat sensitive resistive element (2) by welding, while having no material being interposed therebetween; a gas sensor (1) which is thermally coupled to the heat sensitive resistive element (2), while comprising a porous gas molecule adsorption material (3) from which specific gas molecules are desorbed by means of heating; and an electric power supply unit which supplies electric power to the heat sensitive resistive element (2), thereby heating the heat sensitive resistive element (2).

Abstract: Provided are a gas detection device, a gas detection method, and a device including the gas detection device that are capable of enhancing responsiveness, gas detection sensitivity, and gas detection accuracy. A gas detection device (10) with a thermal-conductivity-type gas sensor (1) includes a connection circuit including a thermistor (2) having at least a pair of electrode parts (22a) and a resistor (11) connected to the thermistor (2); a power supply circuit (Ep) for applying a constant voltage to the connection circuit and putting the thermistor (2) in a thermal runaway state by supplying excess power to the thermistor (2); and a voltage detection unit for detecting a voltage between the electrodes of the thermistor (2) in the connection circuit.

Abstract: Provided are: a temperature sensor capable of ensuring reliability and improving thermal responsiveness; and a device equipped with such a temperature sensor. The present invention is provided with: a surface-mounted heat sensitive element (10) having at least a pair of electrode parts (12a), (12b); lead parts (22a), (22b) that are electrically connected to the pair of electrode parts (12a), (12b) by welding; a holder (21) that holds and fixes the lead parts (22a), (22b); and an insulation coating part (23) that insulates at least a portion of the lead parts (22a), (22b) and the heat sensitive element (10). The lead parts (22a), (22b) are tabular metal plates and are formed of a metallic material having a melting point of not more than 1300° C.

Abstract: Provided are: a resistor unit a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.

Abstract: Provided are: a contact force sensor which has high accuracy and sensitivity and is capable of ensuring strength; and a device provided with the contact force sensor. The present invention comprises: a sensor body (2) manufactured by processing a semiconductor material, wherein the sensor body (2) is provided with: a ring-shaped portion (21); a central portion (22) formed substantially in the center of the ring-shaped portion (21); a spoke portion (23) connected to the ring-shaped portion (21) from the central portion (22) toward the outside; and stress-electricity conversion elements (5) which are disposed at positions facing each other on the front side and the back side of the spoke portion (23), and convert the displacement of the spoke portion (23) into an electric signal.

Abstract: Provided is a pressure sensor that is compact, ensures insulation, and is highly reliable. A pressure sensor (1) comprises: a sensor body (2); a pressure sensor element (21) provided on one surface side of the sensor body (2); a through hole (24) which is formed from the one surface side of the sensor body (2) toward another surface side of the sensor body, and through which a lead wire (3) electrically connected to the pressure sensor element (21) is passed; and an insulation layer (24a) formed in the inner wall of the through hole (24). Passed through the through hole (24) is a conducting body core part (32), which is a part of the lead wire (3) from which an insulation coating has been removed.

Abstract: Provided are a gas sensor, a gas detection device, a gas detection method and a device provided with the gas detection device, capable of improving gas detection performance. The gas detection device is provided with a gas sensor comprising a thermosensitive resistance element and a porous gas molecule adsorptive material thermally bonded to the thermosensitive resistance element that releases specified gas molecules due to heating and cooling, and a power supply control unit that heats and cools the thermosensitive resistance element by controlling the supply of power thereto. The gas detection method comprises a heating step for putting the porous gas molecule adsorptive material in a heated state and a detecting step for detecting a specific gas due to the temperature change in the thermosensitive resistance element by heating.

Abstract: The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).

Abstract: The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).

Abstract: The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.

Abstract: Provided are a sensor device which can be made small-sized, a catheter, and a system provided with the sensor device. A sensor device (1) is provided with a pipe-shaped distal-end-side member (23), a pressure sensor (4) and a temperature sensor (5) which are integrated and accommodated in an inner space of the distal-end-side member (23), and lead wires (6) connected to the pressure sensor (4) and the temperature sensor (5) and led out to the rear-end side. In the pressure sensor (4) and the temperature sensor (5), sensor elements (41), (51) are formed on one surface side of respective substrates (42), (52) thereof, and are disposed and integrated so that the other-surface sides of the substrates (42), (52) face each other.

Abstract: Provided are a thin and insulating temperature sensor which is heat resistant and can have improved reliability, responsiveness, and temperature measurement accuracy, and a device equipped with the temperature sensor, the temperature sensor being provided with: a heat sensitive element which has an insulating substrate, a heat sensitive film formed on the insulating substrate, and electrode layers formed on the insulating substrate and electrically connected to the heat sensitive film; a lead member having joint parts electrically connected to the electrode layers by being joined thereto by means of welding, and lead parts integrally extending from the joint parts; and a pair of insulating films which sandwich and seal at least the heat sensitive element and the joint parts of the lead member from both sides.

Abstract: The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.

Abstract: A temperature sensor and a device are provided, in which the temperature sensor is capable of reducing thickness, increasing a contact area with an object whose temperature is to be measured, and improving measurement accuracy. A temperature sensor is provided with: a thermistor element; a lead-out wire connected to the thermistor element; a lead wire connected to the lead-out wire; an inner layer formed by heating and curing or by melting and solidifying a pair of sheet-like inner layer materials formed of a resin material; and outer layers formed of a pair of sheet-like outer layer materials formed of a resin material and having flat surfaces on both sides. The thermistor element, the lead-out wire, and a connection part between the lead-out wire and the lead wire are covered with the inner layer, and are also covered with the pair of outer layers by being sandwiched therebetween.

Abstract: Provided are: a temperature sensor capable of ensuring reliability and improving thermal responsiveness; and a device equipped with such a temperature sensor. The present invention is provided with: a surface-mounted heat sensitive element (10) having at least a pair of electrode parts (12a), (12b); lead parts (22a), (22b) that are electrically connected to the pair of electrode parts (12a), (12b) by welding; a holder (21) that holds and fixes the lead parts (22a), (22b); and an insulation coating part (23) that insulates at least a portion of the lead parts (22a), (22b) and the heat sensitive element (10). The lead parts (22a), (22b) are tabular metal plates and are formed of a metallic material having a melting point of not more than 1300° C.