Patents Assigned to SEMITEC Corporation
  • Patent number: 12359987
    Abstract: Provided are: a contact force sensor which has high accuracy and sensitivity and is capable of ensuring strength; and a device provided with the contact force sensor. The present invention comprises: a sensor body (2) manufactured by processing a semiconductor material, wherein the sensor body (2) is provided with: a ring-shaped portion (21); a central portion (22) formed substantially in the center of the ring-shaped portion (21); a spoke portion (23) connected to the ring-shaped portion (21) from the central portion (22) toward the outside; and stress-electricity conversion elements (5) which are disposed at positions facing each other on the front side and the back side of the spoke portion (23), and convert the displacement of the spoke portion (23) into an electric signal.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: July 15, 2025
    Assignee: SEMITEC Corporation
    Inventors: Yutaro Tabata, Manabu Orito, Tadashi Matsudate
  • Publication number: 20250224281
    Abstract: Provided are a gas detection device, a gas detection method, and a device including the gas detection device that are capable of enhancing responsiveness, gas detection sensitivity, and gas detection accuracy. A gas detection device (10) with a thermal-conductivity-type gas sensor (1) includes a connection circuit including a thermistor (2) having at least a pair of electrode parts (22a) and a resistor (11) connected to the thermistor (2); a power supply circuit (Ep) for applying a constant voltage to the connection circuit and putting the thermistor (2) in a thermal runaway state by supplying excess power to the thermistor (2); and a voltage detection unit for detecting a voltage between the electrodes of the thermistor (2) in the connection circuit.
    Type: Application
    Filed: March 28, 2025
    Publication date: July 10, 2025
    Applicant: SEMITEC Corporation
    Inventors: Toshiyuki NOJIRI, Dezhi CHENG
  • Patent number: 12298191
    Abstract: Provided are a gas detection device, a gas detection method, and a device including the gas detection device that are capable of enhancing responsiveness, gas detection sensitivity, and gas detection accuracy. A gas detection device (10) with a thermal-conductivity-type gas sensor (1) includes a connection circuit including a thermistor (2) having at least a pair of electrode parts (22a) and a resistor (11) connected to the thermistor (2); a power supply circuit (Ep) for applying a constant voltage to the connection circuit and putting the thermistor (2) in a thermal runaway state by supplying excess power to the thermistor (2); and a voltage detection unit for detecting a voltage between the electrodes of the thermistor (2) in the connection circuit.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: May 13, 2025
    Assignee: SEMITEC Corporation
    Inventors: Toshiyuki Nojiri, Dezhi Cheng
  • Patent number: 12146800
    Abstract: Provided are a thin and insulating temperature sensor which is heat resistant and can have improved reliability, responsiveness, and temperature measurement accuracy, and a device equipped with the temperature sensor, the temperature sensor being provided with: a heat sensitive element which has an insulating substrate, a heat sensitive film formed on the insulating substrate, and electrode layers formed on the insulating substrate and electrically connected to the heat sensitive film; a lead member having joint parts electrically connected to the electrode layers by being joined thereto by means of welding, and lead parts integrally extending from the joint parts; and a pair of insulating films which sandwich and seal at least the heat sensitive element and the joint parts of the lead member from both sides.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: November 19, 2024
    Assignee: SEMITEC Corporation
    Inventor: Toshiyuki Nojiri
  • Patent number: 12068094
    Abstract: Provided are: a resistor unit; a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: August 20, 2024
    Assignee: SEMITEC Corporation
    Inventors: Shingo Fujihara, Yuji Jumonji
  • Publication number: 20240266093
    Abstract: Provided are a resistor that is compact, highly accurate, and highly reliable, a method of manufacturing the same, and a device including the resistor. A resistor (10) includes: an insulating substrate (1); a terminal electrode (2) formed on the insulating substrate (1); a bottom electrode (3) that is formed on the insulating substrate (1), is connected to the terminal electrode (2), and has a resistance adjustment pattern (43), and in which a portion thereof that is closer to the terminal electrode (2) has lower resistance than a portion thereof that is farther from the terminal electrode (2); a resistance body (6) formed on the bottom electrode (3); and a top electrode (7) that is formed on the resistance body (6) and is disposed opposite to the bottom electrode (3).
    Type: Application
    Filed: July 25, 2022
    Publication date: August 8, 2024
    Applicant: SEMITEC Corporation
    Inventor: Masahiro KANAMORI
  • Publication number: 20240201030
    Abstract: Provided is a temperature calibration method that makes it possible to efficiently calibrate temperature in a short time and enhance temperature calibration accuracy. This temperature calibration method uses a temperature calibration device (10) comprising a temperature calibration block (2) having formed therein a placement part (25) for a reference temperature sensor (5) and a temperature sensor (T) to be calibrated. In this temperature calibration method, a temperature state in a gradual temperature variation transition process of the temperature calibration block (2) is taken to be a calibration temperature. The temperature calibration device (10) comprises: a vacuum-insulated container (1) comprising a vacuum region (Va) surrounding the temperature calibration block (2) and an accommodation part for accommodating the temperature calibration block (2); and a Peltier module (3) that is thermally coupled to the temperature calibration block (2).
    Type: Application
    Filed: March 24, 2022
    Publication date: June 20, 2024
    Applicants: SEMITEC Corporation, National Institute of Technology, HIROSAKI UNIVERSITY
    Inventors: Shigenao MARUYAMA, Takahiro OKABE, Yuya ISEKI, Takashi NONAKA, Takuma KOGAWA, Yasushi HOSOKAWA, Manabu ORITO
  • Publication number: 20240151601
    Abstract: An atmospheric-pressure detecting sensor includes a thermistor for pressure detection and a thermistor for pressure compensation. The thermistor for pressure detection detects change in amount of heat loss in accordance with a thermal conductivity of an atmosphere. The thermistor for pressure compensation serves as a reference for pressure detection. At least resistance values of the thermistor for pressure detection and the thermistor for pressure compensation are paired as electrical characteristics and at least heat dissipation constants of the thermistor for pressure detection and the thermistor for pressure compensation are paired as thermal characteristics.
    Type: Application
    Filed: March 8, 2022
    Publication date: May 9, 2024
    Applicant: SEMITEC Corporation
    Inventors: Momoka YAMAZAKI, Toshiyuki NOJIRI
  • Publication number: 20240068884
    Abstract: A thermosensitive part sensing temperature; a temperature sensor for measurement provided in the unit and measuring temperature by contacting the unit with a body to be measured; a temperature detecting part detecting, from when the unit contacts the body, the time when the sensor senses a difference from an initial temperature of the sensor, and a measured temperature of the sensor at that time, and detecting, from when the difference is sensed, a time after a certain length of time and a measured temperature of the sensor at that time; an estimating part estimating, from the time when the difference is sensed and a time after a certain length of time, the time when the thermosensitive part contacts the body, and the measured temperature at that time; and a heat conduction analyzing part estimating the measured temperature based on output information from the temperature detecting part and the estimating part.
    Type: Application
    Filed: January 12, 2022
    Publication date: February 29, 2024
    Applicants: SEMITEC Corporation, National Institute of Technology, HIROSAKI UNIVERSITY
    Inventors: Shigenao MARUYAMA, Yuya ISEKI, Takuma KOGAWA, Takashi NONAKA, Yasushi HOSOKAWA, Takahiro OKABE, Yutaro TABATA, Tadashi MATSUDATE, Toshinori NAKAJIMA, Masaya HIGASHI, Manabu ORITO
  • Publication number: 20230296450
    Abstract: Provided are a temperature sensor that performs high-speed sensing, whose cost is low, and whose layout is freely designed, the temperature sensor eliminating the need for complicated operations, and a method for manufacturing the temperature sensor. In a temperature sensor 1, terminal portions 9 of a connector portion 7 are exposed to an outside of a pipe section 2, a connector-side embedded portion 8 of the connector portion 7 is embedded in an embedding portion 4 of a side wall portion 3, an exposed portion 12 of a housing portion 11 is disposed in the pipe section 2, and an embedded base 13 of the housing portion 11 is embedded in the embedding portion 4. The housing portion 11 is made of a metal.
    Type: Application
    Filed: August 25, 2021
    Publication date: September 21, 2023
    Applicants: NIFCO INC., SEMITEC Corporation
    Inventors: Hiroyuki NAKAMURA, Takuhiko NAKAJIMA, Satoshi IKEYA
  • Publication number: 20230296447
    Abstract: A temperature measurement device (10) comprises: a thermosensitive unit (41) that senses temperature; a thin film thermosensitive element (1) for measurement capable of measuring the temperature by bringing the thermosensitive unit (41) into contact with a subject; a thin film thermosensitive element (2) for protective heating disposed to enable heat exchange with the thin film thermosensitive element (1) via an insulating layer (S1), and controlled so that the temperature thereof is equal to the temperature of the thin film thermosensitive element (1); a temperature control element (3) capable of causing the thin film thermosensitive element (1) to be in a temperature state in which the temperature thereof is a certain degree lower than the temperature of the subject; and a control processing unit (5) controlling the thin film thermosensitive element (1), the thin film thermosensitive element (2), and the temperature control element (3).
    Type: Application
    Filed: June 15, 2021
    Publication date: September 21, 2023
    Applicants: SEMITEC Corporation, National Institute of Technology, HIROSAKI UNIVERSITY
    Inventors: Shigenao MARUYAMA, Takahiro OKABE, Yuya ISEKI, Takashi NONAKA, Takuma KOGAWA, Yasushi HOSOKAWA, Yutaro TABATA, Tadashi MATSUDATE, Toshinori NAKAJIMA, Masaya HIGASHI, Manabu ORITO
  • Patent number: 11644368
    Abstract: A temperature sensor and a device are provided, in which the temperature sensor is capable of reducing thickness, increasing a contact area with an object whose temperature is to be measured, and improving measurement accuracy. A temperature sensor is provided with: a thermistor element; a lead-out wire connected to the thermistor element; a lead wire connected to the lead-out wire; an inner layer formed by heating and curing or by melting and solidifying a pair of sheet-like inner layer materials formed of a resin material; and outer layers formed of a pair of sheet-like outer layer materials formed of a resin material and having flat surfaces on both sides. The thermistor element, the lead-out wire, and a connection part between the lead-out wire and the lead wire are covered with the inner layer, and are also covered with the pair of outer layers by being sandwiched therebetween.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: May 9, 2023
    Assignee: SEMITEC Corporation
    Inventor: Mitsutoshi Ogura
  • Publication number: 20230093829
    Abstract: Provided are an electronic component, a lead part connection structure, and a lead part connection method which can reduce damage of a lead part and improve joint strength. In this lead part connection structure, a lead part (3) made of a conductor and a conductive wire (5) made of a plurality of core wires (52) are connected to each other through welding, wherein the lead part (3) and the conductive wire (5) are connected to each other through welding in a condition in which the lead part (3) is fitted into the plurality of core wires (52) of the conductive wire (5). In the conductive wire (5), the core wires (52) are not integrated with each other in advance through welding.
    Type: Application
    Filed: March 17, 2021
    Publication date: March 30, 2023
    Applicant: SEMITEC Corporation
    Inventor: Mitsutoshi OGURA
  • Patent number: 11531013
    Abstract: Provided are: a gas sensor which is able to have improved gas detection performance, while being capable of suppressing variation in the output characteristics among individual gas sensors; a gas detection device; a gas detection method; and a device which is provided with a gas sensor or a gas detection device. This gas detection device (10) is provided with: a heat sensitive resistive element (2); a lead part (22b) which is connected to the heat sensitive resistive element (2) by welding, while having no material being interposed therebetween; a gas sensor (1) which is thermally coupled to the heat sensitive resistive element (2), while comprising a porous gas molecule adsorption material (3) from which specific gas molecules are desorbed by means of heating; and an electric power supply unit which supplies electric power to the heat sensitive resistive element (2), thereby heating the heat sensitive resistive element (2).
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: December 20, 2022
    Assignee: SEMITEC Corporation
    Inventors: Toshiyuki Nojiri, Dezhi Cheng
  • Publication number: 20220341864
    Abstract: Provided are a gas detection device, a gas detection method, and a device including the gas detection device that are capable of enhancing responsiveness, gas detection sensitivity, and gas detection accuracy. A gas detection device (10) with a thermal-conductivity-type gas sensor (1) includes a connection circuit including a thermistor (2) having at least a pair of electrode parts (22a) and a resistor (11) connected to the thermistor (2); a power supply circuit (Ep) for applying a constant voltage to the connection circuit and putting the thermistor (2) in a thermal runaway state by supplying excess power to the thermistor (2); and a voltage detection unit for detecting a voltage between the electrodes of the thermistor (2) in the connection circuit.
    Type: Application
    Filed: October 16, 2020
    Publication date: October 27, 2022
    Applicant: SEMITEC Corporation
    Inventors: Toshiyuki NOJIRI, Dezhi CHENG
  • Patent number: 11460353
    Abstract: Provided are: a temperature sensor capable of ensuring reliability and improving thermal responsiveness; and a device equipped with such a temperature sensor. The present invention is provided with: a surface-mounted heat sensitive element (10) having at least a pair of electrode parts (12a), (12b); lead parts (22a), (22b) that are electrically connected to the pair of electrode parts (12a), (12b) by welding; a holder (21) that holds and fixes the lead parts (22a), (22b); and an insulation coating part (23) that insulates at least a portion of the lead parts (22a), (22b) and the heat sensitive element (10). The lead parts (22a), (22b) are tabular metal plates and are formed of a metallic material having a melting point of not more than 1300° C.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: October 4, 2022
    Assignee: SEMITEC Corporation
    Inventor: Takaaki Hirabayashi
  • Publication number: 20220301750
    Abstract: Provided are: a resistor unit a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.
    Type: Application
    Filed: August 21, 2020
    Publication date: September 22, 2022
    Applicant: SEMITEC Corporation
    Inventors: Shingo FUJIHARA, Yuji JUMONJI
  • Publication number: 20220291059
    Abstract: Provided are: a contact force sensor which has high accuracy and sensitivity and is capable of ensuring strength; and a device provided with the contact force sensor. The present invention comprises: a sensor body (2) manufactured by processing a semiconductor material, wherein the sensor body (2) is provided with: a ring-shaped portion (21); a central portion (22) formed substantially in the center of the ring-shaped portion (21); a spoke portion (23) connected to the ring-shaped portion (21) from the central portion (22) toward the outside; and stress-electricity conversion elements (5) which are disposed at positions facing each other on the front side and the back side of the spoke portion (23), and convert the displacement of the spoke portion (23) into an electric signal.
    Type: Application
    Filed: June 26, 2020
    Publication date: September 15, 2022
    Applicant: SEMITEC Corporation
    Inventors: Yutaro TABATA, Manabu ORITO, Tadashi MATSUDATE
  • Publication number: 20220276110
    Abstract: Provided is a pressure sensor that is compact, ensures insulation, and is highly reliable. A pressure sensor (1) comprises: a sensor body (2); a pressure sensor element (21) provided on one surface side of the sensor body (2); a through hole (24) which is formed from the one surface side of the sensor body (2) toward another surface side of the sensor body, and through which a lead wire (3) electrically connected to the pressure sensor element (21) is passed; and an insulation layer (24a) formed in the inner wall of the through hole (24). Passed through the through hole (24) is a conducting body core part (32), which is a part of the lead wire (3) from which an insulation coating has been removed.
    Type: Application
    Filed: June 26, 2020
    Publication date: September 1, 2022
    Applicant: SEMITEC Corporation
    Inventors: Tadashi MATSUDATE, Manabu ORITO
  • Patent number: 11397160
    Abstract: Provided are a gas sensor, a gas detection device, a gas detection method and a device provided with the gas detection device, capable of improving gas detection performance. The gas detection device is provided with a gas sensor comprising a thermosensitive resistance element and a porous gas molecule adsorptive material thermally bonded to the thermosensitive resistance element that releases specified gas molecules due to heating and cooling, and a power supply control unit that heats and cools the thermosensitive resistance element by controlling the supply of power thereto. The gas detection method comprises a heating step for putting the porous gas molecule adsorptive material in a heated state and a detecting step for detecting a specific gas due to the temperature change in the thermosensitive resistance element by heating.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: July 26, 2022
    Assignee: SEMITEC Corporation
    Inventors: Toshiyuki Nojiri, Dezhi Cheng