Abstract: An interface structure connecting an electronic component to a circuit board. The interface structure includes a base defining an elongated through hole with a central axis and a coil spring retained in the elongated through hole. The coil spring has a proximal portion and a distal portion extending from the elongated through hole in an uncompressed condition and being offset at an angle with respect to the central axis. As the coil spring is compressed, the coil spring creates a force having a component substantially perpendicular to the central axis.

Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.

Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Abstract: Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).