Patents Assigned to Sensata Technologies
  • Patent number: 10118326
    Abstract: A mold fabrication element has a hollowed volume defining a respective continuous inner surface. A fabricator resource disposes the mold fabrication element into a cavity of an injection mold assembly; surface contours on the inner surface of cavity as well as the respective continuous inner surface of the mold fabrication element exposed in the cavity define an outer surface of a resulting injection molded part. To create the injection molded part, the fabricator resource injects liquefied material into the cavity. The injected material contacts the continuous inner surface of the hollowed volume in the mold fabrication element as well as the surface contours of the cavity. After the injected material solidifies, the fabricator resource removes a combination of the injection molded part and the mold fabrication element. The fabricator resource separates the mold fabrication element from the injection molded part for further processing and use of the injection molded part.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: November 6, 2018
    Assignee: Sensata Technologies, Inc.
    Inventor: Keith R. Washburn
  • Patent number: 10101230
    Abstract: Methods and apparatus for reduction of non-linearity errors in automotive pressure sensors. A pressure sensor includes a pressure sensing element including a pair of parallel electrodes, a pair of ceramic plates, rigid glass seals and a connection between the pair of parallel electrodes and an integrated circuit (IC). The IC executes a linear mapping function of a 1/CX value after a CX value is captured from the pressure sensing element, C representing a capacitance, the linear mapping function reducing a non-linearity error to enable two point calibration of a relationship between pressure and capacitance.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: October 16, 2018
    Assignee: Sensata Technologies, Inc.
    Inventor: Norman Lecomte
  • Publication number: 20180283974
    Abstract: A pressure sensing apparatus with multiple, isolated pressure sensors provided therein. The apparatus includes a base cover portion having multiple sections and each section defines an opening. A sensor is positioned in each base cover portion and a portion of each sensor is exposed to the respective opening. A flanged base is coupled to the base cover portion to define multiple separate chambers and a housing is provided around the base cover portion and base and the housing has multiple conduits in fluid connection with respective cover openings.
    Type: Application
    Filed: April 4, 2017
    Publication date: October 4, 2018
    Applicant: Sensata Technologies, Inc.
    Inventors: Tyler S. Hanna, Nicholas Papadeas, Christopher J. Fontana
  • Patent number: 10054511
    Abstract: A method for correcting offset drift in a sensor used in cyclic sensing is provided. The method includes: identifying a target value for a parameter of a signal between sensing cycles of the sensor; ascertaining a difference between a measured value for the signal and the target value; ascertaining a duration between the sensing cycles; using the difference and the duration, calculating a number of steps to attain the target value from the measured value; and adjusting the measured value by the number of steps to substantially agree with the target value. A pressure sensor is disclosed.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: August 21, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Jan-Willem Sloetjes, Serge Groenhuijzen, Bart Jan Mathijs Salden
  • Publication number: 20180231429
    Abstract: A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.
    Type: Application
    Filed: February 16, 2017
    Publication date: August 16, 2018
    Applicant: Sensata Technologies, Inc.
    Inventors: Erik Krommenhoek, Arnout van den Bos
  • Patent number: 9978551
    Abstract: A circuit breaker having a first micro switch, a second micro switch and a transmission mechanism. The transmission mechanism drives the first micro switch and the second micro switch, which are arranged in a circuit breaker shell. The first micro switch and the second micro switch are arranged on one side of the shell side by side, and a corresponding first transmission rod and a corresponding second transmission rod in the transmission mechanism respectively drive the first micro switch and the second micro switch. Since the circuit breaker is provided with no external device, the space occupied by the circuit breaker is reduced, thereby facilitating construction and installation. Since the two micro switches are built-in side by side, different signals can be simultaneously output.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: May 22, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Jian Chen, Jianjun Fu, Wei Zhou
  • Patent number: 9979279
    Abstract: In electrical systems with DC-DC converters having synchronous rectification (SR) on the output stage, the input voltage can be monitored. When a potentially destructive transient occurs, the SR is rapidly turned on in a non-synchronous manner to “crowbar” the main power transformer. The resulting short circuit is reflected back to the DC input under current-limited pulse width modulation (PWM) control. In effect, the entire surge rating of the power train is applied to the potentially destructive input transient. The clamping capacity can be controlled accurately and is significantly more than what is available in prior art components and systems. When the input voltage is pulled down to safe levels, the clamp circuit disengages and the DC-DC converter returns to normal operation. DC output voltage regulation to the connected load is not maintained during this clamping event, but maintaining output voltage regulation during such destructive transients is not required.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 22, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Kirk Randall Soldner, Gary Neil Johnson
  • Patent number: 9921265
    Abstract: Featured are devices, systems and methods for testing an electronic device, such as an integrated chip. Such a testing method includes disposing a thermal clutch between a variable heat sink that absorbs heat energy and a heat source member that selectively delivers heat energy. When the thermal clutch is operated in a first manner the thermal clutch thermally couples the variable heat sink to the electronic device under test (DUT) and when operated in the second manner, the thermal clutch thermally de-couples the variable heat sink from the DUT. Also, when the thermal clutch is operated in the second manner, the heat source member is thermally coupled to the DUT and is operated so as to produce heat energy which is thus provided to the thermally coupled DUT.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: March 20, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Christopher A. Lopez, Rick A. Davis
  • Publication number: 20180073950
    Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.
    Type: Application
    Filed: September 14, 2016
    Publication date: March 15, 2018
    Applicant: Sensata Technologies, Inc.
    Inventors: Jun H. Bae, Nikhil B. Lal, Guanshi Li, Shuo Robert Chen, Mark W. McBrine
  • Patent number: 9915577
    Abstract: An oil filled pressure sensor is provided. The sensor includes a drift-stabilized pressure sensing element mounted to and electrically isolated from a header body, the pressure sensing element immersed in an oil filled cavity and temperature stabilized for sensing pressure in the cavity without substantial signal drift. A method of fabrication is provided.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: March 13, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Douglas B. Strott, Russell P. Brodeur, Keith R. Washburn
  • Patent number: 9909947
    Abstract: In an embodiment, a pressure sensor includes a tip secured to a port. The tip includes an opening for receiving pressure to be measured by the pressure sensor. The port includes a threaded section for mounting the pressure sensor in a fixture such as, for example, a rail. The port also includes a flexible section, a cavity, and an opening. The opening in the tip receives pressure from an outside source and channels the pressure to the opening of the port. The opening of the port receives the pressure from the tip and channels the pressure to the cavity. The pressure received in the cavity applies a force to the flexible section which flexes in response to the force. Moreover, forces are provided by the tip and the threaded section to keep the tip secured to the port.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: March 6, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Calvin S. Reuter, Ernie Schoot Uiterkamp, Daniel Goncalves, Andrew Willner, Mark McBrine, Prasanth Ambady
  • Patent number: 9875834
    Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: January 23, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Janselme M. Eral, Richard R. Guerrero
  • Patent number: 9857397
    Abstract: Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: January 2, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Oscar Rivera Hernandez, Mariela Reynoso Castillo, Ismael Favela Duran
  • Patent number: 9748678
    Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: August 29, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Neil S. Petrarca, Keith St. Pierre
  • Patent number: 9739673
    Abstract: In an embodiment, a sensor substrate includes a first end, a second end, and a body. The body contains provisions for accommodating one or more sense elements. The first end and the second end contain attachment points for attaching the sensor substrate to a shaft. In addition, the first end and the second end include curved portions. For a particular end, a spacing of the attachment points and/or a depth of the curved portion may define, in part, a flexibility of the end. This flexibility may be used to control a sensitivity of the sense elements.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: August 22, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew LeGendre, Cory Bousquet, Neil Petrarca
  • Patent number: 9714876
    Abstract: Methods and apparatus for a semiconductor strain gauge pressure sensor. An apparatus includes a sense element configured to be exposed to a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge including a five pad single full Wheatstone bridge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that comprises the sense element, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 25, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Shihong Huo, Cory Bousquet, Daniel Goncalves
  • Patent number: 9709622
    Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: July 18, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Christopher A. Lopez, Thomas F. Lemczyk, Rick A. Davis
  • Patent number: 9709461
    Abstract: A multi-function sensor includes a body that includes a sensing circuit disposed on a substrate, the sensing circuit including a pressure sensor and a temperature sensor, the temperature sensor being disposed on a flexible portion of the substrate. A method of fabrication and additional embodiments are disclosed.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 18, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Joris Robert Jan Lenferink, Jorke Jellema, Paulus Thomas Johannes Gennissen
  • Patent number: 9638559
    Abstract: Featured are systems and methods for measuring differential and absolute pressure of a flowing fluid/gas in a fluid system. In such a method the fluid system is configured with first and second pressure taps that are spaced from each so the second pressure tap is downstream of the first pressure tap in a direction of flow. An absolute pressure sense element and a differential pressure sense element are provided, where the absolute pressure sense element is first fluidly coupled to one of the first or second pressure tap to measure an absolute pressure representative of the flowing fluid/gas. The differential pressure sense element is second fluidly coupled to each of the first and second pressure taps so as to measure a differential pressure of the flowing fluid/gas between the first and second pressure taps.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: May 2, 2017
    Assignee: Sensata Technologies Inc.
    Inventors: Peter Zummo, Victor Bender
  • Patent number: 9568388
    Abstract: A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: February 14, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Cory Z. Bousquet, June Park