Patents Assigned to Sensata Technologies
  • Patent number: 9222615
    Abstract: In an embodiment, a support ring may include an arm and a hook. The arm may be located at a first end of the support ring. The arm may provide a spring force to a circuit board that is loaded in the support ring. The hook may be located at a second end of the support ring. The hook may extend upward from the support ring. The second end may be opposite the first end. The hook may provide a reaction force on the circuit board. The reaction forced may be a force in reaction to the spring force. The support ring may include one or more legs. The legs may extend downward from the support ring.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: December 29, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Hedzer Dedde Wiersma, Ernie Shoot Uiterkamp, Andrew LeGendre
  • Patent number: 9146164
    Abstract: In an embodiment, an apparatus includes a first substrate. The first substrate may have a first side for accommodating a first diaphragm. The first substrate may also have a second side. The second side may include a polygonal-shaped depression that is sized to accommodate a second diaphragm associated with a second substrate. The first substrate and first diaphragm may be included in a first assembly and the second substrate and second diaphragm may be included in a second assembly. The first assembly and the second assembly may be included in a stack where at least a portion of the second diaphragm is positioned to fit inside the polygonal-shaped depression in the stack.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: September 29, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Wico Hopman, George Van Der Donk, Maarten Van Noorden, Sean DiStefano
  • Patent number: 9134384
    Abstract: Position sensor (10) for determining a linear position in a sensing direction, e.g. for application in a vacuum actuator. The position sensor (10) has a first sensor part and a second sensor part moveable with respect to each other. The first sensor part comprises an annular magnet (2) and a magnetic field sensor (3) positioned at a first distance (11) from the annular magnet on the magnet axis (1a). The second sensor part comprises a flux shaper (1) moveable through the annular magnet (2) along the sensing direction between a first and a second position, in the first position the flux shaper being substantially at the first distance (11) from the magnetic field sensor (3). The flux shaper is arranged to influence the magnetic field in a space between the annular magnet (2) and the magnetic field sensor (3).
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: September 15, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Albert Ferdinand Zwijze, Paulus Thomas Johannes Gennissen, Michiel Boersma, Jeroen Martinus, Roger Appelo
  • Publication number: 20150241478
    Abstract: Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).
    Type: Application
    Filed: February 21, 2014
    Publication date: August 27, 2015
    Applicant: Sensata Technologies
    Inventors: Rick A. Davis, Christopher Lopez
  • Patent number: 9116074
    Abstract: Disclosed is a pressure-measuring plug for a combustion engine. An interconnection structure in the plug body electrically couples by means of a flexible printed circuit board (PCB) an electrical sensing element at one end of the plug body to connector terminals of the plug at the other end of the plug body. An elongated support structure fixates a part of the flexible PCB in the plug body to enable the flexible PCB to withstand automotive conditions and to facilitate during assembly to put the flexible PCB through the hollow plug body.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: August 25, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Engbertus Berkel, Bart Jan Mathijs Salden, Jochem Hendrik Talsma
  • Patent number: 9080895
    Abstract: A magnetic rotational position sensor assembly for measurement of a rotational angular position of a rotating structure. The sensor assembly includes a shaft member extending along a primary rotational axis for primary rotational movement in response to rotation of the rotating structure, a motion conversion member structured and configured to transform the primary rotational movement of the shaft member into secondary movement, a magnet member secured to the motion conversion member for displacement along a travel path in response to the converted secondary movement of the motion conversion member, and a non-contact magnetic sensor that senses a change in position of the magnet member by sensing a corresponding variation in the magnetic field during displacement of the magnet member along the travel path in response to rotation of the rotating structure, wherein the magnetic sensor generates an output signal representative of a relative rotational angular position of the rotating structure.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: July 14, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Tom Martin, David McKeeman, Mark Vorndran, Gary Johnson
  • Patent number: 9063031
    Abstract: Disclosed is a pressure-measuring plug for a combustion engine. The pressure-measuring plug comprises a plug body and a ring-shaped sensing structure. The plug body comprises an external thread for mounting the plug body into a cylinder head of the combustion engine. The ring-shaped sensing structure comprises an outer section and an inner core. A proximal end of the plug body is attached to the outer section. The inner core comprises a through hole for receiving a rod-shaped element. The ring-shaped sensing structure allows the inner core to move relatively to the outer section along a cylinder axis of the ring-shaped sensing structure. The inner core further comprises an internal thread for mounting in the through hole a rod-shaped element with an external thread.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: June 23, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Cris Ruis Zwollo, Serge Groenhuijzen, Marc Borgers
  • Patent number: 9064659
    Abstract: A circuit interruption device includes at least one constriction zone. The constriction zone provides for interference with arcing of an electrical signal. The device may include at least one expansion zone. The device may include at least one movable component to assist in creation of the at least one constriction zone. A method of fabrication is provided.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: June 23, 2015
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Michael Lavado, Eric Morrison, William Bentley, Peter Berg, Keith Kawate, Thomas Gasper, Keith Singer, Keith Washburn, Joseph L. Medeiros, Chistian Pellon
  • Patent number: 9027410
    Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: May 12, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Erik Hop, Gerard Klaasse, Rob Slakhorst, Wico Hopman, Arnout van den Bos
  • Patent number: 9025286
    Abstract: Techniques disclosed herein include systems and methods for assembly of electric motor starter connecting packages that enable increased automation and reduced assembly via top-down assembly of circuit components, thereby allowing robotic placement, connection, and securing of circuit components. The connecting package can include an electric motor starter, with optional overload protector, packaged as one unit. The motor starter can include an electrical circuit containing a triac, current transformer, Positive Temperature Coefficient (PTC) element, resistor, and a capacitor. A cover and base of the connecting package enclose and firmly secure connected circuit elements without needing a circuit board or filler material. The device design enables quick testing of the motor starter circuit and circuit elements after being enclosed by the housing.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: May 5, 2015
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Keith Washburn, Christian V. Pellon, Kevin Dropps, Mark C. Carlos, Daniel Quinn
  • Patent number: 8950247
    Abstract: The invention relates to a pressure-measuring plug for a combustion engine comprising a plug body with a body tip section facing in use the combustion chamber and comprising a passage, a ring-shaped sensing structure comprising an outer section, an inner section and an annular diaphragm, the plug body being attached to the outer section, a circular membrane comprising an outer part coupled to the outer section and an inner part coupled to the inner section, the membrane provides a sealing protecting the annular diaphragm against the harsh environment in a combustion chamber; and, a plug chamber formed by the circular membrane and the body tip section wherein the passage of the body tip section provides an open connection between the plug chamber and the combustion chamber. The passage is part of a channel structure which functions as a soot filter.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 10, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Marc Borgers, Cris Ruiz Zwollo, Huub Toneman
  • Patent number: 8937482
    Abstract: Apparatus and method adapted for use with an optionally pre-conditioned air supply that is pressurized, for ramping a component to a temperature setpoint, having a vortex tube, a ventilated mount connected to the vortex tube, a pedestal adapted for thermal connection with the component, and a heat exchanger thermally connected with the pedestal and extending within an inward hollowed and enclosed chamber of the ventilated mount, the chamber having wall thickness and size and having a plurality of smaller apertures, or a single larger aperture, therein, and optionally baffling, so as to be adapted for regulating the airflow through the chamber for effectively ramping the temperature of the component and to maximize noise abatement performance.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: January 20, 2015
    Assignee: Sensata Technologies, Inc.
    Inventor: Tom Lemczyk
  • Patent number: 8935961
    Abstract: A sensor assembly includes a rectangular-shaped pressure sensor element and an electronic circuitry coupled to receive a signal from the pressure sensor element. An open-ended fluid-tight passageway of the sensor assembly conveys fluid from a portal opening of the sensor assembly to a surface of the rectangular-shaped pressure sensor element. The sensor assembly further includes a closed-ended fluid-tight passageway, at least a portion of which is fabricated from metal. The closed-ended fluid tight passageway extends from at least from the portal opening of the sensor assembly to the electronic circuitry on at least a portion of a path adjacent to the rectangular-shaped ceramic pressure sensor element. The sensor assembly includes a temperature sensor element disposed in an end of the closed-ended fluid-tight passageway. Conductive links disposed in the closed-ended fluid tight passageway electrically couple the temperature sensor element to the electronic circuitry.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: January 20, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Nicholas G. Papadeas, Jeffrey Peter Silveria, Omar Rashid Ghani, Jared E. Girroir, Albert Ferdinand Zwijze, Paulus Thomas Johannes Gennissen, Edward Norberg
  • Patent number: 8820170
    Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 2, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
  • Patent number: 8770009
    Abstract: An arrangement and method for providing compensation to a cyclical input signal is disclosed. The arrangement comprises a first detection unit (20) for detecting a first event in a cyclical output signal; a compensation signal generation unit (14) for generating a compensation signal; and a signal combination unit (8) for combining the compensation signal and the cyclical input signal to obtain the cyclical output signal. The compensation signal generation unit (14) is arranged to adjust the compensation signal at an instant which has a determined relationship with the detection of the first event. By adjusting the compensation signal at the right instant in a cycle of the cyclical output signal, the adjustment will not influence the further processing of the cyclical output signal. The method can be used to compensate the offset and sensitivity characteristics of a sensor.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: July 8, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Tim Tiek, Paulus Thomas Gennissen
  • Patent number: 8733182
    Abstract: The force sensor assembly has axis of measurement along an axial direction of the force sensor assembly and comprises a force ring provided with at least two sensing elements, a printed circuit board having electronic components thereon, a covering plate for holding the printed circuit board onto the force ring, and a sensor cap covering the printed circuit board and covering plate and attached to the force ring. Manufacturing is easily accomplished using stacking, fixing and welding.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: May 27, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Alex Huizinga, Robert Zwijze, Martijn Pijpers, Bennie Berkel
  • Patent number: 8710386
    Abstract: A pressure responsive electric switch is described having an elongated base containing an electrical switch and terminals. The base is attached to a sensor assembly which actuates and de-actuates the electric switch in response to pressure to be measured. The sensor assembly has a composite actuator member comprising a plurality of stacked snap-acting disc members which includes at least one snap-acting disc member of a chosen low coefficient of thermal expansion and at least one snap-acting disc member of chosen high coefficient of thermal expansion material so as to provide precise pressure activation/deactivation points over a wide temperature range. In a second embodiment, the composite actuator member includes a thermal adjustment member.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: April 29, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Peter J. Tavilla, Richard T. Gordon, Adam M. Haag, Bryan J. Dague
  • Patent number: 8707774
    Abstract: Techniques disclosed herein include systems and methods for sensor systems for measuring pressure in an exhaust conduit of a combustion engine. The sensor system includes an electronics module assembly and a housing assembly for housing the electronics module assembly. The electronics module assembly can include several components such as sensing element carrier element with a sensing element, an electronics module carrier element carrying electronic components. Electrical connections can be provided between the electronic module carrier element and the sensing element carrier element. Another component includes a main carrier element for supporting the sensing element carrier element and the electronic module carrier element.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: April 29, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Erik Eduard Krommenhoek, Frank Gerald Daniel Morsink, Arnout Gerbrand van den Bos, David J. DiPaola
  • Patent number: 8632366
    Abstract: This invention provides a socket for a circuit board that adds function of electrical resistive element to a contact. A socket includes a socket body extending at a longitudinal direction; and a plurality of contacts disposed in two lines along the longitudinal direction of the socket body. When a memory module is connected to the socket body, terminals formed on opposite surfaces of the memory module are electrically and elastically connected by the contacts. The contact includes a contact portion which contacts the terminal, a bent portion for generating an elastic force, and a base portion. The contact is made of a conductive metal having elastic properties, and the contact used for carrying signal is provided with a resistor of an electrical resistive material that is different from the conductive metal. The resistor is connected in a current path between the base portion and the terminal of the memory module.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: January 21, 2014
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Hideki Sano, Hiroyuki Abe, Yasushi Ishikawa, Toyokazu Ezura, Yasuhisa Tsukada
  • Patent number: 8602805
    Abstract: A socket (100) of the present invention includes a base member (20), a cover member (30), a plurality of contacts (40), a latch member (60A) that is rotatably supported by the base member (20) and rotates in response to movement of the cover member (30), an adaptor (50) providing a mounting surface for an IC package and attached with the base member (20) so as to move in an up and down direction in response to the movement of the cover member (30), and a latch plate (200) rotatably attached with the adaptor (50A) and urged by an elastic member. The adaptor (50A) is formed with a latch guide (58) that moves the latch plate (200) in the vertical direction when the latch plate (200) presses the IC package.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: December 10, 2013
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Hideyuki Takahashi, Hideki Sano