Patents Assigned to Sensor, Inc.
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Publication number: 20220178877Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: ApplicationFiled: March 1, 2022Publication date: June 9, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20220125312Abstract: Monitoring of one or more key indicators can provide powerful insights into operation and state of different physical systems. For example, continuous monitoring of multiple analyte in body will allow for detailed insights into personal health and will allow for preventative health management. In this application, we present an ultra-small scale wireless sensing platform capable of long-term wireless in-vivo sensing. The key for extreme miniaturization lies in ultra-low-power compact design and lithographic integration of key system components. The key to low cost is using standard technologies and scalable manufacturing. For example, using standard semiconductor technologies for sensing, processing and wireless operation paves way to a low-cost integrated wireless sensing technology. Modern semiconductor technologies provide the capability to provide low-power and yet powerful electronics functionality in a small (mm-scale) size and wireless operation at high frequency.Type: ApplicationFiled: December 14, 2021Publication date: April 28, 2022Applicant: Integrated Medical Sensors, Inc.Inventors: Meisam Honarvar Nazari, Muhammad Mujeeb-U-Rahman, Mehmet Sencan
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Patent number: 11294001Abstract: An optical fiber-mounted field sensor for measuring an electric or magnetic field includes an optical fiber configured to receive light from a laser source, a polarizer, a polarization manipulator, electro-optical material or magneto-optical material adjacent to the polarization manipulator, and a high reflection coating. The polarizer is adjacent to an output of the fiber, while the polarization manipulator is adjacent to the polarizer and opposite of the optical fiber. The electro-optical material or magneto-optical material is adjacent to the polarization manipulator, and the high reflection coating is adjacent to the electro-optical material or magneto-optical material. An optical mainframe for sending and receiving optical beams to and from the optical fiber-mounted field sensor is also described.Type: GrantFiled: June 30, 2020Date of Patent: April 5, 2022Assignee: Advanced Fiber Sensors, Inc.Inventors: Kyoung Yang, John Whitaker
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Patent number: 11284814Abstract: There is provided a device for measuring a user's oxygen-consumption. The device includes a venturi tube. The venturi tube has a first tapered portion, a second tapered portion that is more tapered compared to the first tapered portion, and a constriction between the portions thereof. The device includes at least one pressure sensor in communication with the constriction and the first tapered portion of the venturi tube. The device includes an oxygen sensor in communication with the constriction and the first tapered portion of the venturi tube.Type: GrantFiled: April 13, 2017Date of Patent: March 29, 2022Assignee: VO2 Master Health Sensors Inc.Inventors: Peter O'Brien, Kyle Halliday, Kenneth Chau, Joshua Brinkerhoff
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Patent number: 11282760Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.Type: GrantFiled: October 22, 2019Date of Patent: March 22, 2022Assignee: Obsidian Sensors, Inc.Inventors: Yaoling Pan, Tallis Young Chang, John Hyunchul Hong
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Patent number: 11284031Abstract: A low-power image sensor includes a plurality of light-sensitive pixel cells, a plurality of analog-to-digital converters (ADCs) and image processing circuitry. The image sensor can be disposed in multiple semiconductor layers such that the pixel cells are disposed in a first layer and various other components are disposed in the second layer or between the first layer and the second layer. The image sensor is configured such that the analog output of a pixel cell is sampled by a first ADC and a second ADC within respective first and second dynamic ranges, the second dynamic range being greater than the first dynamic range. The first ADC and the second ADC sample the analog output with different sampling resolutions. The digital outputs of the first ADC and the second ADC are subsequently used by an image processor to generate a pixel value for an image frame.Type: GrantFiled: August 3, 2020Date of Patent: March 22, 2022Assignee: OBSIDIAN SENSORS, INC.Inventor: Lester Joseph Kozlowski
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Publication number: 20220082525Abstract: A sensor device comprises at least one transducer and a sensing material disposed on the transducer. The sensing material adsorbs or absorbs an amount of analyte (e.g., a target gas) that depends on a temperature of the sensing material and a concentration of the analyte. At least one detector is arranged to measure responses of the transducer to sorption or desorption of the analyte in the sensing material while the sensing material is heated and/or cooled according to at least one temperature profile. The device also comprises a humidity sensor that is arranged to detect a humidity level of the environment or sample containing the analyte. A processor or controller is programmed to determine the quantity (e.g.Type: ApplicationFiled: September 9, 2021Publication date: March 17, 2022Applicant: MATRIX SENSORS, INC.Inventors: David K Britt, Paul R Wilkinson, Steven Yamamoto
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Patent number: 11268933Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: October 27, 2017Date of Patent: March 8, 2022Assignee: JENTEK SENSORS, INC.Inventors: Neil J. Goldfine, Todd M. Dunford
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Patent number: 11268931Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.Type: GrantFiled: June 18, 2019Date of Patent: March 8, 2022Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Andrew P Washabaugh, Todd M Dunford, Zachary M Thomas
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Publication number: 20220001414Abstract: A method is provided for coating a surface of a material with a film of porous coordination polymer. A first substrate having a first surface to be coated is positioned in a processing chamber such that the first surface is placed in an opposing relationship to a second surface. The second surface may be provided by a wall of the processing chamber, or in some cases the second surface may be provided by a second substrate to be coated. The first substrate is held such that a gap exists between the first and second surfaces, and the gap is filled with at least one reaction mixture comprising reagents sufficient to form the crystalline film on at least the first surface. A thin gap (e.g., less than 2 mm) between the first and second surfaces is effective for producing a high quality film having a thickness less than 100 ?m. Confining the volume of the reaction mixture to a thin layer adjacent the substrate surface significantly reduces problems with sedimentation and concentration control.Type: ApplicationFiled: September 15, 2021Publication date: January 6, 2022Applicant: MATRIX SENSORS, INC.Inventors: David K. Britt, Paul R. Wilkinson, Steven Yamamoto
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Patent number: 11204664Abstract: A highly configurable controller is described that includes a number of different types of control mechanisms that emulate a wide variety of conventional control mechanisms using pressure and location sensitive sensors that generate high-density control information which may be mapped to the controls of a wide variety of devices and software.Type: GrantFiled: September 3, 2020Date of Patent: December 21, 2021Assignee: BeBop Sensors, IncInventors: Keith A. McMillen, Daniel Eric McAnulty
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Publication number: 20210387161Abstract: An apparatus and method is provided for coating a surface of a substrate with at least one film of porous coordination polymer. A body has an interior space for holding the substrate to be coated, at least one inlet, and at least one outlet in communication with the interior space to permit fluid to flow in a downstream direction from the inlet, across the surface of the substrate in the interior space, and through the outlet. A plurality of flow channels are arranged to flow a plurality of different reagent solutions from respective supply sources to the at least one inlet. The flow channels merge into at least one mixing region, positioned upstream of the interior space, to mix the solutions prior to the mixture contacting the surface of the substrate in the interior space.Type: ApplicationFiled: August 27, 2021Publication date: December 16, 2021Applicant: Matrix Sensors, Inc.Inventors: David K. Britt, Paul R. Wilkinson, Steven Yamamoto
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Publication number: 20210372968Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: ApplicationFiled: August 16, 2021Publication date: December 2, 2021Applicant: JENTEK Sensors, Inc.Inventors: Scott A. Denenberg, Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Andrew P. Washabaugh, Don Straney, Brian L. Manning
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Patent number: 11175351Abstract: Optical sensing methods and systems for power applications, and the construction thereof, are described herein. An example method of constructing a winding assembly includes mounting a sensing component to a coil former, and winding a coil onto the coil former so that the sensing component is positioned within the coil. A system and method for detecting operating conditions within a transformer using the described winding assemblies are described.Type: GrantFiled: October 15, 2019Date of Patent: November 16, 2021Assignee: Hyperion Sensors Inc.Inventors: Gerald Manuelpillai, Ilya Tchaplia, Anselm Viswasam, Guang Zeng
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Patent number: 11147510Abstract: Sensor systems are described that are designed to be integrated with gloves for the human hand. An array of sensors detects forces associated with action of a hand in the glove, and associated circuitry generates corresponding control information that may be used to control a wide variety of processes and devices.Type: GrantFiled: May 22, 2018Date of Patent: October 19, 2021Assignee: BeBop Sensors, Inc.Inventors: Keith A. McMillen, Kyle Lobedan, Maxime Stinnett
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Publication number: 20210306535Abstract: An imaging device comprising two camera apertures and a method of capturing two fields of view using two camera apertures are disclosed.Type: ApplicationFiled: March 26, 2021Publication date: September 30, 2021Applicant: Obsidian Sensors, Inc.Inventors: John HONG, Bing WEN, Tallis CHANG
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Publication number: 20210294093Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.Type: ApplicationFiled: March 19, 2021Publication date: September 23, 2021Applicant: Obsidian Sensors, Inc.Inventors: John HONG, Tallis CHANG, Bing WEN, Edward CHAN, Sean ANDREWS, Heesun SHIN
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Publication number: 20210285126Abstract: An apparatus and method is provided for coating a surface of a material with a film of porous coordination polymer. A first substrate having a first surface to be coated is positioned in a processing chamber such that the first surface is placed in a substantially opposing relationship to a second surface. In some embodiments, the second surface is provided by a wall of the processing chamber, and in other embodiments the second surface is provided by a second substrate to be coated. The first substrate is held such that a gap exists between the first and second surfaces, and the gap is filled with at least one reaction mixture comprising reagents sufficient to form the crystalline film on at least the first surface. A thin gap (e.g., having a thickness less than 2 mm) between the first and second surfaces is effective for producing a high quality film having a thickness less than 100 ?m.Type: ApplicationFiled: March 10, 2021Publication date: September 16, 2021Applicant: MATRIX SENSORS, INC.Inventors: David K. Britt, Paul R. Wilkinson, Steven Yamamoto
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Publication number: 20210278432Abstract: A high precision rotation sensor comprises an inertial mass suspended from a base wherein the mass is responsive to rotational inputs that apply loads to load-sensitive resonators whose changes in resonant frequency are related to the applied loads.Type: ApplicationFiled: March 5, 2020Publication date: September 9, 2021Applicant: Quartz Seismic Sensors, Inc.Inventors: Jerome M. Paros, Krishna Venkateswara
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Patent number: 11092571Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: GrantFiled: June 6, 2019Date of Patent: August 17, 2021Assignee: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Don Straney