Abstract: A method is provided for reconstructing images or video from output of neuromorphic vision (NMV) sensors in a low-light environment. The method includes passively sensing light by an array of NMV sensors in the low-light environment, integrating the sensed light by each of the NMV sensors, outputting a time-stamped event signal per sensor of the array of NMV sensors upon a value of the integration exceeding a threshold value, resetting each NMV sensor after outputting an event signal for new integration of sensed light, combining the event signals, and reconstructing an image and/or video based on the combined event signals.

Abstract: A method is provided for reconstructing images or video from output of neuromorphic vision (NMV) sensors in a low-light environment. The method includes passively sensing light by an array of NMV sensors in the low-light environment, integrating the sensed light by each of the NMV sensors, outputting a time-stamped event signal per sensor of the array of NMV sensors upon a value of the integration exceeding a threshold value, resetting each NMV sensor after outputting an event signal for new integration of sensed light, combining the event signals, and reconstructing an image and/or video based on the combined event signals.

Abstract: A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.

Abstract: A method includes forming an assembly of layers including an InP cap layer on an InGaAs absorption region layer, wherein the InGaAs layer is on an n-InP layer, and wherein an underlying substrate layer underlies the n-InP layer. The method includes removing a portion of the InP cap and n-InP layer by dry etching.

Abstract: A pixel system for an imaging device can include one or more pixels comprising a pulse trigger assembly configured to detect a pulse at one or more threshold voltages, a timer system forming part of and/or connected to the one or more pixels, the timer system comprising one or more trigger switches. The pulse trigger assembly can be configured to activate the one or more trigger switches in response to detecting the pulse at the one or more threshold values. The pixel system can include a time-of-flight (TOF) module operatively connected to the one or more pixels and/or the timer system to determine a TOF based on an output from the timer system while simultaneously performing either or both passive imaging and asynchronous laser pulse detection.

Abstract: A sensor includes a sensor array. The sensor array includes a plurality of passive imaging pixels and a plurality of time of flight (TOF) imaging pixels. A method of imaging includes collecting passive imaging data from a sensor array and collecting time of flight (TOF) imaging data from the sensor array. Collecting passive imaging data and collecting TOF imaging data can be performed at least partially at the same time and along a single optical axis without parallax.

Abstract: A time-of-flight sensor threshold circuit outputs a threshold voltage to a time-of-flight sensor, the threshold reducing over the duration of a time-of-flight measurement, which reduction can occur continually during the measurement. The circuit is provided with an initial threshold voltage portion to set the threshold voltage corresponding to a selected maximum threshold value, a time-dependent portion, to charge and discharge over time, to or from a current control portion, a threshold voltage ramp control portion to lower the threshold value over time by charging or discharging the time-dependent portion to or from the current control portion at a selected rate, and a synchronizing portion to synchronize current flow to or from the current control portion with a synchronizing input signal synchronized with an illumination pulse from a connected illuminator.

Abstract: A pixel system for an imaging device can include one or more pixels comprising a pulse trigger assembly configured to detect a pulse at one or more threshold voltages, a timer system forming part of and/or connected to the one or more pixels, the timer system comprising one or more trigger switches. The pulse trigger assembly can be configured to activate the one or more trigger switches in response to detecting the pulse at the one or more threshold values. The pixel system can include a time-of-flight (TOF) module operatively connected to the one or more pixels and/or the timer system to determine a TOF based on an output from the timer system while simultaneously performing either or both passive imaging and asynchronous laser pulse detection.

Abstract: A photodetector array (PDA) system includes metal traces. A dielectric passivation layer defines a front side of a stack. An absorption layer is on a back side of the stack relative to the dielectric passivation layer. An array of pixels is included, each having a respective diffusion feature between the dielectric passivation layer and the absorption layer. The diffusion features are operatively connected to the absorption layer for photodetection. A metal trace runs between respective diffusion features. The metal trace is at a depth in the stack closer to the front side of the stack than the absorption layer. The dielectric passivation layer electrically insulates the metal trace from a front side surface of the stack.

Abstract: A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.

Abstract: In accordance with at least one aspect of this disclosure, a photodiode structure can include a charge layer comprised of undoped InP, and a detector active area forming a junction with the charge layer and having edges configured to prevent edge breakdown. The location of the junction can be controlled through a diffusion of the detector active area or through an epitaxially grown doped region, for example. The photodiode structure can also include a charge control layer comprised of doped InP. The charge control layer can include a thickness and carrier concentration configured to achieve a predetermined gain, high speed, low dark current, and low break down voltage.

Abstract: An imaging system and a method of imaging are provided. The imaging system includes a single optics module configured for focusing light reflected or emanated from a dynamic scene in the infrared spectrum and a synchronous focal plane array for receiving the focused light and acquiring infrared images having a high spatial resolution and a low temporal resolution from the received focused light. The imaging system further includes an asynchronous neuromorphic vision system configured for receiving the focused light and acquiring neuromorphic event data having a high temporal resolution, and a read-out integrated circuit (ROIC) configured to readout both the infrared images and event data.

Abstract: A method includes forming an assembly of layers including an InP cap layer on an InGaAs absorption region layer, wherein the InGaAs layer is on an n-InP layer, and wherein an underlying substrate layer underlies the n-InP layer. The method includes removing a portion of the InP cap and n-InP layer by dry etching.

Abstract: A method includes flashing an object with a first illumination pulse at a first illumination power level, flashing the object with a second illumination pulse at a second illumination power level different from the first illumination power level, integrating at least a portion of a first return pulse which is the first illumination plus returning from the object to determine a first return time, and integrating at least a portion of a second return pulse which is the second illumination pulse returning from the object to determine a second return time. The method includes using the first and second return times to determine distance to the object independent of reflectivity of the object.

Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. The diffusion layer and absorption layer are in contact with one another along an interface that is inside of a mesa. A trench is defined in the absorption layer surrounding the mesa. An overflow contact is seated in the trench.

Abstract: An optical assembly includes a window having an interior surface and an opposed exterior surface. A perimeter surface connects between the interior surface and the exterior surface. A metal layer is bonded to the perimeter surface of the window. An anti-reflective coating (ARC) is bonded to the interior surface of the window. A metallic lid is joined to the metal layer for enclosing a focal plane array (FPA) aligned with the window.

Abstract: A system comprises a photodetector array (PDA) including a plurality of imaging pixels configured to generate electrical signals indicative of an imaged scene, and an integrated circuit (IC) operatively connected to the PDA to receive the electrical signals from the imaging pixels to form image data.

Abstract: A method of medical imaging is provided. The method includes receiving pulsed light emissions from fluoroscopic material in a target field of a patient, wherein the target field was treated with fluoroscopic material that emitted the pulsed light emissions in response to a pulsed laser signal. The pulsed laser signal has a wavelength that was selected to excite the fluoroscopic material. The method further includes capturing a passive image of the target field and asynchronously detecting pulses of the pulsed light emissions. The method further includes determining pulse-source coordinates in the image, wherein the pulse-source coordinates correspond to a location of the fluoroscopic material that emitted the pulsed light emissions.

Abstract: An identification system for a digital air traffic control center includes a sensor with a field of view and having a pulse detection array, a user interface to display air traffic objects in the field of view of the sensor, and a controller. The controller includes a pulse detection module disposed in communication with the pulse detection array to identify an air traffic object using pulsed illumination emitted by a pulsed illuminator carried by the air traffic object within the field of view of the sensor. Digital air traffic control centers, airfields, and air traffic object identification methods are also described.

Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. A transparent conductive oxide (TCO) is electrically connected to the diffusion layer. An overflow contact is in electrical communication with the TCO. The overflow contact can be spaced apart laterally from the diffusion layer. The pixel can be one of a plurality of similar pixels arranged in a grid pattern, wherein each pixel has a respective overflow contact, forming an overflow contact grid offset from the grid pattern.