Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.

Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket.

Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket.

Abstract: An imaging method includes imaging a scene having a pulsed light source and associating a symbol with the light source. The image is enhanced by inserting a symbol into the image indicative of location of the pulsed light source in the scene. The symbol overlays the image in spatial registration with the location of the pulsed light source in the scene to augment indication of the location provided by the pulsed light source. Imaging systems are also described.

Abstract: A method of forming bump structures for interconnecting components includes dry etching a layer of insulating material to create a pattern for bump structures. A seed layer is deposited on the insulating material over the pattern. The seed layer is patterned with a photo resist material. The method also includes forming bump structures over the seed layer and the photo resist material with a plating material to form bump structures in the pattern, wherein the bump structures are isolated from one another.

Abstract: An imaging method includes assigning pixels within the extent of a focal plane array active area to a first readout range and a second readout range. Image data is read out from the pixels assigned to the first readout range and the second readout range. Pixels located within the extend of the focal plane array active area and not assigned to the first readout range or the second readout range are left unread. Imaging systems and hyperspectral imaging arrangements are also described.

Abstract: A photodiode has an absorption layer and a cap layer operatively connected to the absorption layer. A pixel is formed in the cap layer and extends into the absorption layer to receive charge generated from photons therefrom. The pixel defines an annular diffused area to reduce dark current and capacitance. A photodetector includes the photodiode. The photodiode includes an array of pixels formed in the cap layer. At least one of the pixels extends into the absorption layer to receive charge generated from photons therefrom. At least one of the pixels defines an annular diffused area to reduce dark current and capacitance.

Abstract: A laser alignment arrangement includes a first stage configured to structurally support a laser at a first longitudinal position of the laser, the first stage being configured to adjust the first longitudinal position of the laser in at least one direction orthogonal to an axis of the laser, and a second stage configured to structurally support the laser at a second longitudinal position of the laser, the second stage being configured to adjust the second longitudinal position of the laser in at least one direction orthogonal to the axis of the laser.

Abstract: A multimode pixel of a pixel array is provided. The multimode pixel includes a photodetector, an image sensing circuit having a first plurality of transistors, and a laser range finding (LRF) circuit having a second plurality of transistors. At least one transistor of the second plurality of transistors, but not all of the second plurality of transistors, is included in the first plurality of transistors. The LRF circuit being configured to perform LRF operations and the image sensing circuit is configured to perform passive imaging operations. The image sensing circuit and the LRF circuit are configured to perform concurrently.

Abstract: A pixel of a pixel array is provided. The pixel includes a low frequency path configured to receive an input signal from a corresponding photodetector. The low frequency path includes a passive imaging circuit provided along the low frequency path, the passive imaging circuit configured to output an analog imaging signal and a flash analog to digital converter (ADC) that receives the analog imaging signal and processes the analog imaging signal to output a coarse digitized signal.

Abstract: A configurable analog to digital converter (ADC) is provided. The configurable ADC includes a comparator receiving and comparing a first analog voltage signal to a second analog voltage signal V-DAC and outputting a signal C-OUT that is responsive to a result of the comparison, an integrator operating on C-OUT and outputting an N-bit value, a digital-to analog converter (DAC) converting the N-bit value to the second analog voltage signal V-DAC, and an integrator, the integrator including the N-bit memory, which is coupled to an arithmetic logic unit (ALU), the N-bit memory and ALU cooperating to perform operations using both the N-bit value and C-OUT. The configurable ADC is configured to operate in more than one mode selected from a plurality of selectable ADC modes.

Abstract: A photodiode includes an absorption layer. A cap layer is disposed on a surface of the absorption layer. A pixel diffusion area within the cap layer extends beyond the surface of the absorption layer and into the absorption layer to receive a charge generated from photons therefrom. A mesa trench is defined through the cap layer surrounding the pixel diffusion area, wherein the mesa trench defines a floor at the surface of the absorption layer and opposed sidewalls extending away from the surface of the absorption layer. An implant is aligned with the mesa trench and extends from the floor of the mesa trench through the absorption layer surrounding a portion of the absorption layer proximate the pixel diffusion area.

Abstract: An optics arrangement includes a polarized beam splitter arranged along an collection axis, a first quarter waveplate arranged along the collection axis, and a second quarter waveplate. The second quarter waveplate is arranged along the collection axis and is optically coupled to the first quarter waveplate by the polarized beam splitter to limit return of polarized illumination originating in a scene being illuminated for retroreflector detection. Retroreflector detectors and methods of imaging a scene are also described.

Abstract: A laser alignment arrangement includes a first stage configured to structurally support a laser at a first longitudinal position of the laser, the first stage being configured to adjust the first longitudinal position of the laser in at least one direction orthogonal to an axis of the laser, and a second stage configured to structurally support the laser at a second longitudinal position of the laser, the second stage being configured to adjust the second longitudinal position of the laser in at least one direction orthogonal to the axis of the laser.

Abstract: A method of correcting lag in an imaging pixel includes receiving a current frame pixel value and determining a current filter coefficient using the current frame pixel value. A pixel output is determined from a product of the current frame pixel value and current frame filter coefficient. The product of a first prior frame pixel value and corresponding first prior frame filter coefficient is added to the pixel output to generate a corrected pixel output to more closely indicates incident illumination on the imaging pixel during an integration period from which the current frame pixel value was obtained.

Abstract: A configurable analog to digital converter (ADC) is provided. The configurable ADC includes a comparator receiving and comparing a first analog voltage signal to a second analog voltage signal V-DAC and outputting a signal C-OUT that is responsive to a result of the comparison, an integrator operating on C-OUT and outputting an N-bit value, a digital-to analog converter (DAC) converting the N-bit value to the second analog voltage signal V-DAC, and an integrator, the integrator including the N-bit memory, which is coupled to an arithmetic logic unit (ALU), the N-bit memory and ALU cooperating to perform operations using both the N-bit value and C-OUT. The configurable ADC is configured to operate in more than one mode selected from a plurality of selectable ADC modes.

Abstract: A pixel of a pixel array is provided. The pixel includes a low frequency path configured to receive an input signal from a corresponding photodetector. The low frequency path includes a passive imaging circuit provided along the low frequency path, the passive imaging circuit configured to output an analog imaging signal and a flash analog to digital converter (ADC) that receives the analog imaging signal and processes the analog imaging signal to output a coarse digitized signal.

Abstract: An imaging apparatus includes a camera with a solid-state sensor and an illumination selector. The illumination selector is arranged for optical coupling with the sensor and arranged for communicating electromagnetic radiation within a shortwave infrared narrowband to the sensor. The shortwave infrared narrowband includes a peak absorption or peak reflection wavelength of moisture to infrared illumination to image moisture disposed within a solar cell array.

Abstract: A method for diagnosing a condition of a subject includes imaging an abdominal area of the subject to obtain one or more images of the abdominal area. Separation between rectus abdominis muscles in the abdominal area is located from the one or more images. Distance of the separation between the rectus abdominis muscles is quantified. The results of the quantified distance and one or more images are outputted on one or more display units.

Abstract: A method of enhancing an image includes constructing an input histogram corresponding to an input image received at a focal plane array, the input histogram representing a pixel intensity distribution corresponding to the input image and performing an analytical operation on the input histogram to produce a modified cumulative distribution, wherein the analytical operation is a function of camera temperature. The input image is transformed using the modified cumulative distribution to produce an enhanced output image corresponding to the input image, wherein at least a portion of the input image is enhanced in the output image. In addition to or in lieu of the non-linear operation, the binning edges of the input histogram can be adjusted based on at least one of camera temperature and sensitivity state to construct an adjusted cumulative distribution.