Patents Assigned to Seoul Semiconductor Co., Ltd.
  • Patent number: 10892386
    Abstract: Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: January 12, 2021
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Won Cheol Seo, Dae Sung Cho
  • Patent number: 10879437
    Abstract: Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: December 29, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Won Cheol Seo, Dae Sung Cho
  • Publication number: 20200367442
    Abstract: A plant cultivation light source includes at least two light sources selected from first, second, and third light sources that emit first, second, and third lights, respectively. The first light has a first peak at a wavelength from about 400 nanometers to about 500 nanometers, the second light has a second peak appearing at a wavelength, which is longer than the first peak, from about 400 nanometers to about 500 nanometers, and the third light has a third peak appearing at a wavelength, which is shorter than the first peak, from about 400 nanometers to about 500 nanometers. The first light is a white light and has a first sub-peak having an intensity lower than an intensity of the first peak at a wavelength from about 500 nanometers to about 700 nanometers. The first sub-peak has a full-width at half-maximum greater than a full-width at half-maximum of the first peak.
    Type: Application
    Filed: July 9, 2019
    Publication date: November 26, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Mark McClear
  • Publication number: 20200357965
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Myung Jin KIM, Kwang Yong OH
  • Patent number: 10833057
    Abstract: A display apparatus includes: a transparent substrate; a panel substrate; a light emitting diode disposed between the transparent substrate and the panel substrate; an insulation layer covering side surfaces of the light emitting diode; a first connection electrode electrically connected to the light emitting diode and disposed on the insulation layer between the insulation layer and the panel substrate; a second connection electrode on the panel substrate; and an electrode connector electrically connecting the first connection electrode to the second connection electrode, wherein the first connection electrode has an overlapping portion overlapping with the light emitting diode and a non-overlapping portion laterally extending from the overlapping portion on the insulation layer.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: November 10, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim
  • Patent number: 10825969
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: November 3, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Patent number: 10809507
    Abstract: A light emitting module including a circuit board, light emitting elements disposed on the circuit board, each light emitting element including light emitting diode chips and a wavelength conversion layer coated on the light emitting diode chips, and a lens disposed on the light emitting elements and configured to diffuse light emitted from the light emitting elements, in which the lens includes a concave part having a light incident surface and an upper surface through which light exits out from the lens, the upper surface includes a convex portion including sections, at least two of the sections having different curvatures from each other, and the at least two of the sections each has a thickness equal to or greater than 1 ?m, and less than the width of the light emitting element.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: October 20, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Eun Ju Kim, Ki Bum Nam
  • Patent number: 10811572
    Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 20, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
  • Patent number: 10797027
    Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: October 6, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Seong Su Son, Jong Ik Lee, Jae Hee Lim, Jong Hyeon Chae, Seung Sik Hong
  • Patent number: 10791597
    Abstract: An LED lighting apparatus capable of color temperature control includes a color temperature controller to receive a color temperature selection signal and output first and second control signals; a LED driver connected a plurality of LED groups; and a LED selection circuit including a first switch connected to a first node to which a rectified voltage is applied and receiving the first control signal, a first LED group selectively connected to the first node by the first switch, a second LED group connected in series with the first LED group, a third LED group selectively connected to the first node by the first switch, a fourth LED group connected in series with the third LED group, and a second switch for selectively connecting the output terminal of the second LED group or the fourth LED group to the LED driver by receiving the second control signal.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: September 29, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Keith Hopwood, Sung Ho Jin, Hyung Jin Lee, Sang Wook Han
  • Publication number: 20200300444
    Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Chung Hoon LEE
  • Patent number: 10784239
    Abstract: A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 22, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Seung Ryeol Ryu
  • Patent number: 10784415
    Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 22, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jung Hwa Jung, Seoung Ho Jung, Sung Ki Hwang
  • Patent number: 10775667
    Abstract: A display apparatus including a light emitting part including a plurality of light emitting diodes spaced apart from each other, and a light conversion part configured to convert light emitted from the light emitting part, in which the light emitting diodes include at least one first light emitting diode and at least one second light emitting diode, the light conversion part emits red light through wavelength conversion of light emitted from the at least one first light emitting diode, and the at least one second light emitting diode emits green light.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: September 15, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim
  • Patent number: 10760752
    Abstract: A light emitting device module including a substrate including a plurality of light emitting areas, light emitting devices disposed in each light emitting area and to emit light, windows disposed on the substrate, each of the windows covering one of the light emitting areas and having an asymmetrical shape with respect to one direction, and a holder for coupling the windows, the holder including a plurality of openings each having an asymmetrical shape, in which each of the windows is individually disposed in a corresponding one of the openings and is detachably coupled to the holder.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: September 1, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Ming Jun Zhang, Zhisheng Zhang
  • Patent number: 10757781
    Abstract: A lighting apparatus including an LED circuit including a plurality of serially connected stages configured to receive a modulated rectified voltage, each of the stages including a first path including a first resistor and a first LED connected in series, and a second path connected to the first path in parallel and including a second LED configured to emit light having a color temperature different from that emitted from the first LED, and a driving current controller configured to adjust an intensity of light output from the LED circuit by adjusting currents applied to driving nodes connected to the stages, depending on a dimming signal associated with a dimming level of the rectified voltage, in which a threshold voltage of the first LED is lower than that of the second LED.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: August 25, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Keith Hopwood, Hyung Jin Lee, Sung Ho Jin, Sang Wook Han, In Seok Baek
  • Publication number: 20200256526
    Abstract: A light-emitting device includes a substrate including a first electrode group and a second electrode group, a first light emitting unit, a second light emitting unit, and a side wall. The first light emitting unit is provided on the upper surface of the substrate and electrically connected to the first electrode group. The second light emitting unit is provided on the upper surface of the substrate and electrically connected to the second electrode group. The side wall surrounds the first light-emitting unit and the second light-emitting unit. The first light emitting unit and the second light emitting unit are arranged side by side such that a separation space between the first light emitting unit and the second light emitting unit is smaller than a space between the second light emitting unit and an outer peripheral surface of the side wall.
    Type: Application
    Filed: April 17, 2020
    Publication date: August 13, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Yoon Seop LEE, Da Hye KIM, Sang Hong LEE, Byoung Kyu PARK, Dae Wook KIM, Jae Hyun PARK
  • Patent number: D892067
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: August 4, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: SeungRi Choi, SeMin Bang, MyungHee Lee
  • Patent number: D892068
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: August 4, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: SeungRi Choi, SeMin Bang, MyungHee Lee
  • Patent number: D894853
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: September 1, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: MyungHee Lee, SeungRi Choi, SeMin Bang