Abstract: A display apparatus including a display panel, a light source unit configured to provide light to the display panel, and a light guide member disposed between the display panel and the light source unit and covering the light source unit such that the light source unit is buried in the light guide member, the light guide member having a surface roughness on an upper surface thereof to diffuse light and including a substrate, and a light emitting device disposed on the substrate and including a blocking pattern to have an intensity of light emitted in an upward direction to be equal to or less than about 80% of a maximum light intensity of the light emitting device.

Abstract: A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.

Abstract: A method of repairing a display panel and a repaired display panel are provided. The display panel includes a panel substrate, a plurality of micro LEDs arranged on the panel substrate, and a molding member covering the plurality of micro LEDs. The molding member includes a first molding member and a second molding member disposed in a region surrounded by the first molding member. The second molding member has a composition or a shape different from that of the first molding member, and the second molding member surrounds at least one side surface of the plurality of micro LEDs.

Abstract: A lighting apparatus including at least one light emitting diode (LED) chip configured to emit blue light; a green phosphor having a light emission peak in a range of 500 nm to 550 nm; and a red phosphor having a light emission peak in a range of 600 nm to 650 nm, in which the red phosphor includes a first red phosphor having a light emission peak in a range of 620 nm to 630 nm and a second red phosphor having a light emission peak in a range of 630 nm to 640 nm, and the full widths at half maximum of the first and second red phosphors are in a range of 20 nm to 60 nm, respectively.

Abstract: A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

Abstract: A light emitting module including a substrate, a light emitting device disposed on the substrate, and a lens disposed above the light emitting device to disperse light, the lens including a light incident portion through which light emitted from the light emitting device enters the lens and a light exit portion through which the light exits the lens, in which each of the light incident portion and the light exit portion has a major axis and a minor axis in plan view, the major axis of the light incident portion is disposed at a right angle with respect to the major axis of the light exit portion, the lens includes a plurality of legs formed on a lower surface of the lens to support the lens, and at least one of the legs includes a leg protrusion protruding downwards from a lower surface thereof.

Abstract: A method of manufacturing a display apparatus including steps of forming a plurality of light emitting diode chips spaced apart from one another at a predetermined interval on a first manufacturing substrate and transferring the light emitting diode chips to a second manufacturing substrate by laser irradiation, in which the light emitting diode chips include a light emitting structure including a first-type semiconductor layer and a second-type semiconductor layer, a first-type electrode disposed on the first-type semiconductor layer, and a second-type electrode disposed on the second-type semiconductor layer.

Abstract: A light emitting diode including a circuit board, at least one light emitting diode chip disposed on the circuit board, the light emitting diode chip including a substrate, a light emitting structure disposed under the substrate and including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a transparent electrode layer disposed on a lower surface of the light emitting structure, first and second electrode pads electrically connected to the first and second conductivity type semiconductor layers, respectively, a reflective layer covering at least part of the lower surface of the light emitting structure, a reflective member covering an upper surface of the light emitting diode chip and including at least one of a distributed Bragg reflector (DBR) and metal, and a light transmitting resin surrounding the light emitting diode chip and the reflective member on the circuit board.

Abstract: A light emitting diode package including a light emitting diode chip, a phosphor layer disposed to cover an upper portion of the light emitting diode chip, the phosphor layer being configured to convert a wavelength of light emitted from the light emitting diode chip, and a color filter layer disposed to cover an upper portion of the phosphor layer, the color filter being configured to block light having a predetermined wavelength range from being emitted through the phosphor layer.

Abstract: A light emitting device including at least one first light emitting unit including an ultraviolet or violet light emitting diode chip and a first wavelength converter, at least one second light emitting unit including an ultraviolet or violet light emitting diode chip and a second wavelength converter, and at least one third light emitting unit including an ultraviolet or violet light emitting diode chip and a third wavelength converter, in which color coordinates of the first light emitting unit, the second light emitting unit, and the third light emitting unit define a triangular region in a CIE-1931 coordinate system, the triangular region including at least a portion of the Plankian locus, and a maximum color temperature of the Plankian locus included in the triangular region is 5000K or higher, and a minimum color temperature of the Plankian locus included in the triangular region is 3000K or lower.

Abstract: A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.

Abstract: Disclosed are a display apparatus and a method of manufacturing the same. The display apparatus includes a light emitting part including a plurality of light emitting diodes; and a thin film transistor (TFT) panel part configured to drive the plurality of light emitting diodes. The plurality of light emitting diodes are electrically connected to the plurality of TFTs, respectively, by a layer disposed between the light emitting diode part and the TFT panel part.

Abstract: According to one embodiment, there is provided a white light source system. P(?), B(?) and V(?) satisfy an equation (1) below in a wavelength range of 380 nm to 780 nm. The white light source system satisfies an expression (2) below in a wavelength range of 400 nm to 495 nm: ? 380 780 ? P ? ( ? ) ? V ? ( ? ) ? d ? ? ? = ? 380 780 ? B ? ( ? ) ? V ? ( ? ) ? d ? ? ? ( 1 ) where P(?) is a light emission spectrum of white light, B(?) is a light emission spectrum of blackbody radiation of a color temperature correspond to a color temperature of the white light, and V(?) is a spectrum of a spectral luminous efficiency.

Abstract: A light emitting device includes a light emitting diode chip, a light transmitting member, a white barrier member, and a conductive adhesive member. The light emitting diode chip has a bump pad formed on the lower surface thereof. The light transmitting member covers the side surfaces and the upper surface of the light emitting diode chip, and the upper surface of the light transmitting member has a rectangular shape having long sides and short sides. The conductive adhesive member is formed to extend through the white barrier member from the bottom of the light emitting diode chip. The upper surface of the conductive adhesive member is connected to the bump pad of the light emitting diode chip, and the lower surface of the conductive adhesive member is exposed at the lower surface of the white barrier member.

Abstract: A light emitting device including at least one main light emitting unit including a light emitting diode chip and a wavelength converter, and configured to emit white light, in which the light emitting diode chip includes at least one of an ultraviolet chip, a violet chip, and a blue chip, and the light emitting device is configured to be adjustable to emit light corresponding to a spectral power distribution of morning sunlight, light corresponding to a spectral power distribution of afternoon sunlight, and light corresponding to a spectral power distribution of evening sunlight.

Abstract: A display apparatus includes: a transparent substrate; a panel substrate; a light emitting diode disposed between the transparent substrate and the panel substrate; an insulation layer covering side surfaces of the light emitting diode; a first connection electrode electrically connected to the light emitting diode and disposed on the insulation layer between the insulation layer and the panel substrate; a second connection electrode on the panel substrate; and an electrode connector electrically connecting the first connection electrode to the second connection electrode, wherein the first connection electrode has an overlapping portion overlapping with the light emitting diode and a non-overlapping portion laterally extending from the overlapping portion on the insulation layer.

Abstract: A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

Abstract: A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

Abstract: A unit pixel including a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, an adhesive layer bonding the light emitting devices to the transparent substrate, a step adjusting layer covering the light emitting device and bonded to the adhesive layer, a plurality of connection layers disposed on the step adjustment layer and electrically connected to the light emitting devices, in which the step adjustment layer has a concave-convex pattern along an edge thereof.

Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.