Patents Assigned to Seoul Semiconductors Co., Ltd.
  • Patent number: 11350496
    Abstract: A lighting apparatus including a controller including a real time clock, an LED driver, and an LED luminaire including a first light emitting unit including a first LED to emit light having a peak wavelength between 300 to 470 nm and a wavelength converter, and at least one of a second light emitting unit to emit light having a peak wavelength between 286 to 304 nm to cause production of vitamin D, a third light emitting unit to emit light having a peak wavelength between 605 to 935 nm to cause production of a cell activating substance, and a fourth light emitting unit to emit light having a peak wavelength between 400 to 430 nm to sterilize pathogenic microorganisms, in which the controller controls the LED driver to change an irradiance of light emitted from at least one of the light emitting units according to time.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: May 31, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jun Ho Song, Bo Yong Han
  • Patent number: 11348907
    Abstract: A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: May 31, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jae Hyun Park, Seong Jin Lee, Jong Kook Lee
  • Patent number: 11335837
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: May 17, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Patent number: 11322484
    Abstract: The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: May 3, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Gundula Roth, Walter Tews, Chung-Hoon Lee
  • Publication number: 20220130805
    Abstract: A light emitting module includes a circuit board, and light emitting diode chips arranged in a plurality of regions on the circuit board. The light emitting diode chips are divided into a plurality of light emitting diode groups connected in series. The plurality of light emitting diode groups is connected in parallel to one another, and at least one of the light emitting diode chips in at least one of the plurality of light emitting diode groups is disposed in a region different from that of at least one other light emitting diode chip.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 28, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Yong YEO, Tae Jin CHUNG, Jingxian WANG, Pengfei WANG
  • Patent number: 11316076
    Abstract: A light emitting diode package includes a body part having a cavity at the upper part thereof and having a long shape in one direction; and a first lead frame and a second lead frame which are coupled to the bottom of the body part and spaced apart from each other in a transverse direction. The first lead frame includes a first mounting part exposed in the cavity; a first terminal part exposed to one side surface of the body part; and a first connection part exposed to the lower surface of the body part. The second lead frame includes a second mounting part exposed in the cavity; a second terminal part exposed to the other side surface of the body part along a one-side direction; and a second connection part exposed to the lower surface of the body part.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: April 26, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Ji Ho Kim
  • Patent number: 11304376
    Abstract: A plant cultivation light source includes at least two light sources selected from first, second, and third light sources that emit first, second, and third lights, respectively. The first light has a first peak at a wavelength from about 400 nanometers to about 500 nanometers, the second light has a second peak appearing at a wavelength, which is longer than the first peak, from about 400 nanometers to about 500 nanometers, and the third light has a third peak appearing at a wavelength, which is shorter than the first peak, from about 400 nanometers to about 500 nanometers. The first light is a white light and has a first sub-peak having an intensity lower than an intensity of the first peak at a wavelength from about 500 nanometers to about 700 nanometers. The first sub-peak has a full-width at half-maximum greater than a full-width at half-maximum of the first peak.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: April 19, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Mark McClear
  • Patent number: 11309469
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: April 19, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Patent number: 11300830
    Abstract: A display apparatus including a frame, a plurality of LEDs regularly arranged on the frame, an optical part disposed on the LEDs and including a display panel and at least one of a phosphor sheet and an optical sheet, and a light guide plate disposed between the frame and the optical part to cover the LEDs, in which the LEDs are arranged in a matrix to be separated from each other at a constant interval, each of the LEDs includes a light emitting diode chip and a reflector disposed on an upper surface of the light emitting diode chip and contacting the upper surface of the light emitting diode chip, the reflector being configured to reflect at least part of light emitted from the light emitting diode chip.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: April 12, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Eun Ju Kim
  • Patent number: 11302744
    Abstract: A light emitting diode unit including a blue light emitting diode package disposed on a substrate and configured to emit blue light to the outside, a red light emitting diode package disposed on the substrate and configured to emit red light to the outside, and a green light emitting diode package disposed on the substrate and configured to emit green light to the outside, in which each of the blue light emitting diode package, the red light emitting diode package, and the green light emitting diode package includes a wall to prevent light from being emitted to the sides thereof.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: April 12, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Sik Hong, Hyuck Jun Kim
  • Patent number: 11296142
    Abstract: An LED package set including a substrate, a first LED package disposed on the substrate and including at least one first LED chip, a second LED package disposed on the substrate and including at least one second LED chip, and a resistor disposed on the substrate, connected to the first LED package in series, and connected to the second LED package in parallel, in which the second LED package is connected in parallel to the first LED package and the resistor, and the first LED package and the second LED package are configured to emit light having different color temperatures.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: April 5, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seong Jin Lee, Jong Kook Lee
  • Patent number: 11282820
    Abstract: A display device including light emitting modules having signal lines and common lines arranged thereon, each including light emitting diodes mounted on an upper surface thereof and electrically connected to the signal lines and the common lines, respectively, a motherboard coupled to the light emitting modules, and a bonding layer having electrical conductivity and coupling the light emitting modules to the motherboard, in which each of the light emitting modules includes signal line terminals and common line terminals disposed on a lower surface thereof and electrically connected to the signal lines and the multiple common lines, respectively, and the motherboard includes board signal line terminals and board common line terminals disposed on an upper surface thereof at locations corresponding to the signal line terminals and the common line terminals of the light emitting modules.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: March 22, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Sung Su Son, Jong Ik Lee, Seung Sik Hong
  • Patent number: 11264547
    Abstract: A light-emitting device includes a substrate, a first light-emitting chip, a first wavelength conversion member, and a barrier member. The first light-emitting chip is mounted on the substrate. The first wavelength conversion member covers the upper surface of the first light-emitting chip. A first reflective member covers the side surface of the first wavelength conversion member. Further, the barrier member includes an outer wall surrounding the side surfaces of the first light-emitting chip and the first reflective member.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: March 1, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Hye In Kim, Jung Hun Son
  • Patent number: 11251351
    Abstract: A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 15, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Se Min Bang
  • Publication number: 20220003378
    Abstract: A lighting apparatus includes a light source part having a first light source and a second light source provided away from the first light source, a reflective part provided away from the first light source and second light source and reflecting light emitted from the first light source and second light source, and a support part facing the reflective part and supporting the light source part. The reflective part includes a plurality of reflective plates which are continuously provided. Each of the reflective plates provided adjacent to one another has a reflective surface which is shaped differently from one another.
    Type: Application
    Filed: September 17, 2021
    Publication date: January 6, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Jang Weon LEE
  • Publication number: 20210399041
    Abstract: A method of fabricating a light emitting module includes mounting a plurality of unit pixels on a circuit board, applying a molding material to cover the unit pixels, placing a plate on the molding material to press the molding material with the plate, and curing the molding material to form a molding member.
    Type: Application
    Filed: June 7, 2021
    Publication date: December 23, 2021
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jae Hyun PARK, Seung Sik HONG
  • Patent number: 11199307
    Abstract: A lens including a light entering part having a concave shape in a lower region of the lens, and on which light emitted from a light emitting device is to be incident, and a light exiting part through which the incident light is emitted to the outside, in which each of the light entering part and the light exiting part has a major axis and a minor axis in plan view, and the major axis of the light entering part is orthogonal to the major axis of the light exiting part, and the light entering part includes a light incident vertical surface extending from a lower surface of the lens and a light incident inclined surface extending upward from the light incident vertical surface.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: December 14, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Eun Ju Kim, Jae Eun Park
  • Publication number: 20210348725
    Abstract: A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.
    Type: Application
    Filed: July 26, 2021
    Publication date: November 11, 2021
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jae Hyun PARK, Seong Jin LEE, Jong Kook LEE
  • Patent number: 11171264
    Abstract: A light emitting module including a base substrate, a first light emitting diode disposed on the base substrate, and a second light emitting diode disposed on the base substrate and spaced apart from the first light emitting diode, in which each of the first light emitting diode and the second light emitting diode includes a first light emitting region and a second light emitting region, the second light emitting region being spaced apart from the first light emitting region and surrounding the first light emitting region.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: November 9, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jong Min Lee, Bang Hyun Kim, Jae Ho Lee
  • Publication number: 20210336102
    Abstract: A backlight unit includes one or more light sources operable to emit light and a light guide plate arranged adjacent to the one or more light sources, reflected lights exiting the one or more light sources via the second surfaces and entering the light guide plate. A light source includes a light emitting device having a substrate and a semiconductor stack disposed on the substrate. The reflector is structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 28, 2021
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Young Jun SONG, Da Hye KIM, Seoung Ho JUNG