Patents Assigned to SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
  • Patent number: 11152230
    Abstract: An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group (105) disposed on one side of the press assembly. The press assembly includes a first chuck (103) and a rotatable second chuck (104). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate (301) is then loaded on the first chuck, and alignment marks (302) on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate (501) is loaded on the second chuck, and alignment marks (502) on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: October 19, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Zhi Zhu, Jianjun Zhao, Zhijun Huo
  • Patent number: 11119412
    Abstract: An exposure apparatus and method. The exposure apparatus includes a control system, light source system, plurality of illumination systems and plurality of projection objective lenses. The light source system is configured to emit a plurality of first illumination beams incident on the illumination systems. Each illumination system includes a variable attenuator and branch energy detector. The branch energy detector is configured to detect an illuminance level of a second illumination beam generated in the corresponding illumination system and feed it back to the control system. The control system is configured to adjust the illuminance levels of the second illumination beams in the respective illumination systems by controlling the respective variable attenuators therein. The exposure apparatus and method have improved exposure performance and allow finer and faster energy adjustments, thus enabling precise control and higher exposure accuracy.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: September 14, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Jun Qian, Sihong Zhai
  • Patent number: 11106005
    Abstract: A prism rotation adjustment mechanism, a photolithographic exposure system and a photolithography tool are disclosed. The prism rotation adjustment mechanism includes a frame (200), a flexible mechanism (100) and an actuation mechanism. The flexible mechanism (100) includes a fixing component (110), an actuating component (120), a connecting component (130) and a swinging component (140) that are flexibly articulated in a sequence. The fixing component (110) is fixed to the frame (200). The actuation mechanism is fixed to the frame (200) and coupled to the actuating component (120). On the swinging component (140) are secured a prism wherein an axis of articulation between the swinging component (140) and the fixing component (110) is in correspondence with a rotational center of the prism.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: August 31, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventor: Tongke Su
  • Patent number: 11106143
    Abstract: A mask fork, configured to transfer a mask from a standard mechanical interface pod. The standard mechanical interface pod includes a plurality of supports having a L-shaped cross section. Each of the plurality of supports includes a connecting section extending horizontally and a supporting section extending vertically, and the connecting section has a bottom to which a limiting section is fixed. The mask fork includes a fork body and two tines connected to the fork body in symmetry with each other. Each of the tines comprises a transfer member configured to support the mask during a transfer of the mask and anti-collision members including a first anti-collision member extending horizontally and a second anti-collision member extending vertically. The first anti-collision member is horizontally attached to a side of the transfer member facing away from the mask.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: August 31, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Gang Wang, Rongjun Zhang, Dongliang Huang
  • Patent number: 11107717
    Abstract: A cassette transport device is disclosed which includes a smart cart, a base expansion frame mounted on the smart cart and a cassette-loading frame fixed to the base expansion frame. The cassette-loading frame is partitioned into several segments each accommodating a plurality of cassette trays. Each of the cassette trays defines, on its surface, a first trough and a second trough in the first trough. The first trough is configured to retain a cassette of a first size, and the second trough is configured to retain a cassette of a second size. With the first and second troughs, each of the cassette trays is able to retain a cassette of either the first or second size, making the cassette transport device possible to be used in transportation of the both types of cassettes with a high yield. Moreover, the smart cart is capable of automated transportation without human intervention or track construction while enabling savings in transportation cost, time and labor.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: August 31, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Lingyu Li, Qixin Xu
  • Patent number: 11106139
    Abstract: An optical path compensation apparatus includes a wedge assembly, a driving mechanism and a preload unit. The wedge assembly includes a movable wedge and a fixed wedge. The movable wedge and the fixed wedge having equal wedge angles and respective wedge surfaces inclined in opposite directions. The preload unit is configured to elastically press the movable wedge on the fixed wedge, and the driving mechanism is configured to cause relative movement between the wedge surface of the movable wedge and the wedge surface of the fixed wedge. This optical path compensation apparatus is capable of achieving effective position correction of a focal plane of a measurement system for focusing and leveling in a smooth, convenient and precise way while not causing any error in other directions.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 31, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Shurong Li, Hailin Cheng
  • Patent number: 11081380
    Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: August 3, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD
    Inventors: Feibiao Chen, Hai Xia, Yuebin Zhu, Hailin Cheng, Xiaoyu Jiang, Lili Zhao, Donghao Zhang
  • Patent number: 11042099
    Abstract: The lithography apparatus includes at least two exposure devices and one substrate device. The substrate device includes a substrate stage and a substrate supported by the substrate stage. The at least two exposure devices are disposed in symmetry to each other above the substrate with respect to a direction for scanning exposure and configured to simultaneously create two exposure fields onto the substrate to expose the portions of the substrate within the exposure fields.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 22, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Chang Zhou, Zhiyong Yang, Linlin Ma
  • Patent number: 11042101
    Abstract: A method for vertical control of a lithography machine includes step 1, prior to a scanning exposure, controlling vertical measurement sensors to measure workpiece to obtain overall surface profile data of the workpiece; step 2, performing a global leveling based on the overall surface profile data of the workpiece; and step 3, during the scanning exposure of each exposure field, measuring a local surface profile of the workpiece in real time by the vertical measurement sensors and controlling at least one of a mask stage, a workpiece stage and a projection objective to move vertically according to a Z-directional height value, an Rx-directional tilt value and an Ry-directional tilt value corresponding to the local surface profile of the workpiece, to compensate for the local surface profile of the workpiece in real time, so that an upper surface of each exposure field coincides with a reference focal plane for the exposure field.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: June 22, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Dan Chen, Xianying Wang, Zhiyong Yang
  • Patent number: 11037900
    Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: June 15, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Song Guo, Jianqi Sun, Feibiao Chen, Yuebin Zhu, Tianming Wang, Hai Xia
  • Patent number: 10983415
    Abstract: A shutter device includes a light blocking unit and a voice coil motor. The voice coil motor includes a permanent magnet module, a guide track assembly and a coil assembly. The coil assembly is arranged on the guide track assembly, and the permanent magnet module is adapted to produce a magnetic field in the guide track assembly. The light blocking unit includes two shutter blades both connecting to the coil assembly. When energized, the coil assembly will produce a magnetic field having a direction same as or opposite to the direction of the magnetic field in the guide track assembly so that the coil assembly moves forward or backward along the guide track assembly to drive the two shutter blades to open or close. A method controls the shutter device. An exposure dose control method is used with a photolithography machine including the shutter device.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: April 20, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Zhiyong Jiang, Fuping Zhang, Yanfei Wang
  • Patent number: 10983442
    Abstract: A projection objective, used for projecting an object space to an image space. The objective includes, from the object space along an optical axis in sequence: a first lens set (G1) having positive focal power, a second lens set (G2) having negative focal power, a third lens set (G3) having positive focal power, a fourth lens set (G4) having negative focal power, and a fifth lens set (G5) having positive focal power. Aspheric lenses are provided in the first lens set (G1), the second lens set (G2), the third lens set (G3), the fourth lens set (G4), and the fifth lens set (G5).
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: April 20, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Fuping An, Zhaoxiang Chu, Yinzhang Guo
  • Patent number: 10983448
    Abstract: An objective lens protection device, objective lens system and lithographic device. The objective lens protection device includes a main structure provided with, oppositely disposed, an air supply unit and extraction unit. The air supply unit is used to output air. The extraction unit extracts air output by the air supply unit to form at least one layer of air curtain between the air supply unit and extraction unit. The objective lens protection device can effectively control the flow rate of wind discharge, controlling wind in a laminar flow state and ensuring uniform flow field of the air curtain, and can effectively block organic matters volatilized from the bottom up, eliminate opportunity for a direct contact of the organic matters with the lens, and prevent objective lens from contamination by the volatilization of the organic matters of photoresist, thus ensuring the imaging quality of the objective lens.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: April 20, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Xianming Li, Baotong Hao
  • Patent number: 10985044
    Abstract: A machine vision system for substrate alignment includes first and second illumination sources (11, 12), first and second reflectors (21, 22), first and second objective lenses (31, 32) and first and second detectors (41, 42), each of which pair is symmetric with respect to an X-axis. Light beams emitted from the first and second illumination sources are irradiated on and reflected by respective substrates (1, 2), amplified by the respective objective lenses and received and detected by the respective detectors. An alignment apparatus is also disclosed. Disposing each of the pair of the first and second illumination sources, the first and second reflectors, the first and second objective lenses and the first and second detectors in symmetry with respect to the X-axis results in a significantly reduced footprint of the machine vision system along the orientation of lens barrels of the objective lenses and hence an expanded detection range thereof and improved alignment efficiency and accuracy.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 20, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Zhi Zhu, Zhijun Huo
  • Patent number: 10976673
    Abstract: A levellable reticle library assembly includes a reticle library assembly (4), a pivot assembly (3) and a frame assembly (2). The reticle library assembly (4) is disposed on the frame assembly (2) so that it is able to be leveled by the pivot assembly (3) via the frame assembly (2), and the reticle library assembly (4) can also be leveled by the frame assembly (2).
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: April 13, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Yongwei Fan, Huaiyang Chen
  • Patent number: 10971380
    Abstract: A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 6, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Yuying Gao, Wei Wei
  • Patent number: 10942458
    Abstract: An exposure system (10), an exposure apparatus and an exposure method are disclosed. The exposure system (10) includes: a laser unit (11), a light spot switching unit (12) and a lens unit (13); the laser unit (11) is configured for producing a laser beam; the light spot switching unit (12) is configured to direct the laser beam to travel along one of different optical paths based on a desired size of a light spot for a workpiece to be exposed so that a laser beam in correspondence with the desired size of the light spot is obtained; and the lens unit (13) is configured for altering a direction in which the laser beam is incident on the workpiece. The light spot switching unit (12) enables the laser beam to be switched between the different optical paths so as to form light spots sized in different ranges, which can satisfy different needs of workpieces with various critical dimensions.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: March 9, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Ke Lan, Yaping Ge, Yonghui Chen
  • Patent number: 10942063
    Abstract: A device and method for measuring amplitude of a scanning mirror are disclosed. The device includes a light source (20) for outputting an optical signal; a diaphragm (21) for modifying size and shape of a light spot of the optical signal output by the light source (20); a scanning mirror retainer for placing a scanning mirror (22) to be measured, the scanning mirror, after being retained, being able to periodically reflect the optical signal; a photoelectric sensor (23) including three or more sensing elements and configured to detect and collect the optical signal reflected by the scanning mirror (22); and a signal acquisition and processing unit (24) for processing a signal collected by the photoelectric sensor (23) to derive an amplitude of the scanning mirror (22). Therefore, it is possible to characterize the scanning mirror (22) before the scanning mirror (22) is used, determining performance of the scanning mirror (22).
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: March 9, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Xinghai Wang, Mingbo Yuan, Haijiang Wang
  • Patent number: 10942129
    Abstract: An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit (10) for emitting light of at least two wavelengths; a beam splitter (40) for receiving the light emitted by the light source unit (10) and splitting it into a first portion and a second portion, the first portion of the light reflected by a die (60) surface under inspection and thereby forming a detection beam; a reference unit (70) for receiving the second portion of the light and processing it into a reference beam; and a detection unit (90) for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (90), based on which a defect parameter of the die (60) surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: March 9, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Pengli Zhang, Hailiang Lu, Fan Wang
  • Patent number: 10937151
    Abstract: An automatic optical inspection (AOI) method for inspecting defects on a surface of an object is provided. The method includes: providing at least two different illumination systems; acquiring, by at least one detector, at least two pieces of image information of the object, each piece of image information being acquired under illumination of a corresponding one of the illumination systems; obtaining at least two pieces of surface defect information of the object by analyzing the acquired at least two pieces of image information using a computer and storing at least one of the obtained at least two pieces of surface defect information by the computer; and combining, by the computer, all of the at least two pieces of surface defect information to de-duplicate the at least two pieces of surface defect information and obtain a piece of combined surface defect information.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: March 2, 2021
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Fan Wang, Hailiang Lu, Kai Zhang