Patents Assigned to Sheetak, Inc.
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Patent number: 11903317Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.Type: GrantFiled: September 20, 2022Date of Patent: February 13, 2024Assignee: Sheetak, Inc.Inventor: Uttam Ghoshal
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Patent number: 11892204Abstract: The present disclosure is related to nested cooling and heating systems. The cooling system includes an outer cooling assembly with an inner cooling assembly inserted within the outer cooling system. The inner cooling assembly includes thermoelectric coolers, and the outer cooling assembly may thermoelectric or vapor compression driven. Additional intermediate cooling assemblies may be nested together with the inner and outer cooling assemblies to increase the cooling effect in the innermost cooling assembly. Similarly, the heating system uses nested thermoelectric heating assemblies, and hot temperatures can be increased by adding intermediate nested heating assemblies. Intermediate and/or inner assemblies may be removed from the outer assembly to allow for easy transport.Type: GrantFiled: December 31, 2020Date of Patent: February 6, 2024Assignee: Sheetak, Inc.Inventors: Uttam Ghoshal, Brandon Lee Noska
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Patent number: 11856857Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder.Type: GrantFiled: October 19, 2020Date of Patent: December 26, 2023Assignee: Sheetak, Inc.Inventor: Uttam Ghoshal
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Publication number: 20230375233Abstract: The present disclosure is related to thermoelectric panels and their use in cooling and heating systems. The cooling/heating systems may include a cylindrical plurality of thermoelectric panels. The panels may include thermoelectric devices embedded between a housing formed by heat conductive layers and edge structures for preserve a low thermal conductivity volume.Type: ApplicationFiled: August 1, 2023Publication date: November 23, 2023Applicant: Sheetak, Inc.Inventors: UTTAM GHOSHAL, KEY KOLLE
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Publication number: 20230371380Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically nonconductive and thermally conductive substrate with direct bonded or electroplated copper. Thermoelement pairs are formed on a barrier layer deposited on the outer layers of the substrate in gaps formed from insulator material deposited on the barrier layer. Openings in the barrier layer may be filled with an insulator to isolate thermoelements, which may then be bridged by a metal layer. Thermoelement pairs may be combined to form larger devices.Type: ApplicationFiled: May 11, 2023Publication date: November 16, 2023Applicant: Sheetak, Inc.Inventors: Uttam Ghoshal, Key Kolle
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Patent number: 11713908Abstract: The present disclosure is related to thermoelectric panels and their use in cooling and heating systems. The cooling/heating systems may include a plurality of thermoelectric panels. The panels may include thermoelectric devices embedded between a housing formed by heat conductive layers and edge structures for preserve a low thermal conductivity volume.Type: GrantFiled: October 24, 2018Date of Patent: August 1, 2023Assignee: Sheetak, Inc.Inventors: Uttam Ghoshal, Key Kolle
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Publication number: 20230138483Abstract: The present disclosure is related to thermoelectric energy harvesting and powering of Internet-of-Things (IoT) devices and systems. The thermoelectric energy harvesting device includes a thermoelectric converter electrically coupled to voltage rectifier and a power storage medium. The first side of the thermoelectric converter is exposed to ambient air with fluctuating temperatures, while the second side is anchored to a stable temperature. Power generated across the temperature differential can be captured in the power storage medium. The harvester may also include a device to move the harvester relative to the air and, by generating convection cooling of the first side, increase the net energy harvested.Type: ApplicationFiled: April 13, 2021Publication date: May 4, 2023Applicant: Sheetak, Inc.Inventor: Uttam Ghoshal
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Publication number: 20230012332Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.Type: ApplicationFiled: September 20, 2022Publication date: January 12, 2023Applicant: Sheetak, Inc.Inventor: Uttam Ghoshal
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Publication number: 20220384703Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder.Type: ApplicationFiled: October 19, 2020Publication date: December 1, 2022Applicant: Sheetak, Inc.Inventor: Uttam GHOSHAL
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Patent number: 11462669Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.Type: GrantFiled: March 19, 2018Date of Patent: October 4, 2022Assignee: Sheetak, Inc.Inventor: Uttam Ghoshal
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Publication number: 20220163242Abstract: The present disclosure is related to nested cooling and heating systems. The cooling system includes an outer cooling assembly with an inner cooling assembly inserted within the outer cooling system. The inner cooling assembly includes thermoelectric coolers, and the outer cooling assembly may thermoelectric or vapor compression driven. Additional intermediate cooling assemblies may be nested together with the inner and outer cooling assemblies to increase the cooling effect in the innermost cooling assembly. Similarly, the heating system uses nested thermoelectric heating assemblies, and hot temperatures can be increased by adding intermediate nested heating assemblies.Type: ApplicationFiled: December 31, 2020Publication date: May 26, 2022Applicant: Sheetak, Inc.Inventors: Uttam Ghoshal, Brandon Lee Noska
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Publication number: 20210285698Abstract: A portable, independent thermoelectric temperature regulated system for providing active cooling to one or more payloads. The system includes a thermally insulated housing, one or more thermoelectric converters embedded in the thermally insulated housing, and a power source. The system may include one or more optional payload containers. Multiple payload containers may be used in the same housing. The system includes a control circuit for managing temperature of the payload(s) based on user selections. The housing may be hard or soft, and the multiple payload containers may be maintained at different temperatures. Optional phase change materials may be included that may be charged by the active thermoelectric converter discharged as a source of passive cooling or heating.Type: ApplicationFiled: January 18, 2019Publication date: September 16, 2021Applicant: Sheetak, Inc.Inventors: Uttam Ghoshal, James Borak, Key Kolle, Dan Grimm
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Publication number: 20200248934Abstract: The present disclosure is related to thermoelectric panels and their use in cooling and heating systems. The cooling/heating systems may include a plurality of thermoelectric panels. The panels may include thermoelectric devices embedded between a housing formed by heat conductive layers and edge structures for preserve a low thermal conductivity volume.Type: ApplicationFiled: October 24, 2018Publication date: August 6, 2020Applicant: Sheetak, Inc.Inventors: UTTAM GHOSHAL, KEY KOLLE
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Publication number: 20200075828Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.Type: ApplicationFiled: March 19, 2018Publication date: March 5, 2020Applicant: Sheetak, Inc.Inventor: Uttam Ghosal
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Publication number: 20180366629Abstract: A thermoelectric device may include a first substrate, a second substrate, and a plurality of thermoelectric elements positioned between the first and second substrates. The thermoelectric device may also include a first attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the first substrate, and a second attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the second substrate. The first attachment material may have a higher liquidus temperature than a liquidus temperature of the second attachment material.Type: ApplicationFiled: August 28, 2018Publication date: December 20, 2018Applicant: Sheetak, Inc.Inventors: Uttam GHOSHAL, Ravi PRASHER, Ayan GUHA
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Patent number: 10032975Abstract: A thermoelectric device may include first and second insulating substrates. An array of electrically conductive first metallizations may be positioned on one side of the first substrate, and an array of electrically conductive second metallizations may be positioned on a mating side of the second substrate. A plurality of thermoelectric elements may be positioned between the first and second substrates and interconnected together through the first and second metallizations in one of a square shaped network pattern or a delta shaped network pattern.Type: GrantFiled: June 29, 2016Date of Patent: July 24, 2018Assignee: Sheetak Inc.Inventor: Uttam Ghoshal
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Publication number: 20160380174Abstract: A thermoelectric device may include first and second insulating substrates. An array of electrically conductive first metallizations may be positioned on one side of the first substrate, and an array of electrically conductive second metallizations may be positioned on a mating side of the second substrate. A plurality of thermoelectric elements may be positioned between the first and second substrates and interconnected together through the first and second metallizations in one of a square shaped network pattern or a delta shaped network pattern.Type: ApplicationFiled: June 29, 2016Publication date: December 29, 2016Applicant: Sheetak Inc.Inventor: Uttam GHOSHAL
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Patent number: 9435571Abstract: A method and system for efficiently cooling a fluid is provided. A cooling system includes a first chamber containing a first fluid, and a second chamber connected to the first chamber and containing a second fluid. The cooling system further includes one or more thermoelectric devices for cooling the second fluid in the second chamber, and a first body that acts as a thermal diode. The first body enables unidirectional transfer of heat from the thermoelectric devices to the first fluid. Further, the cooling system can be installed with one or more phase change materials or heat pipes that enhance the cooling efficiency of the cooling system. The thermoelectric devices are switched on for a certain time period, after which they are switched off and on repeatedly in cycles, depending on the temperature of the second fluid.Type: GrantFiled: March 3, 2009Date of Patent: September 6, 2016Assignee: Sheetak Inc.Inventors: Uttam Ghoshal, Ayan Guha, James Borak
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Patent number: 9373771Abstract: In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements that transfer heat across the ends of the thermoelectric device. A method for creating the thermoelectric device includes forming a metal substrate, and etching one or more surfaces of the metal substrate to form etched portions. The unetched flat portions on the metal substrate are referred to as mesa cores. Thereafter, thermoelectric films are deposited on the one or more surfaces of the metal substrate. The deposition of the thermoelectric films on the mesa cores results in the formation of a thermoelement.Type: GrantFiled: November 27, 2009Date of Patent: June 21, 2016Assignee: SHEETAK INC.Inventors: Uttam Ghoshal, Ayan Guha, James Borak
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Publication number: 20160133814Abstract: An apparatus and method configured to provide electric power from a thermal source. The apparatus may include a thermoelectric generator and a heat source. The apparatus may include a fuel source. The heat source may be combustive or non-combustive. The apparatus may also include a thermal battery. The heat source may be configured to combust a hydrocarbon fuel to generated heat. The apparatus may include one or more thermal diodes and/or a heat sink to remove waste heat. The method may include converting thermal energy into electrical energy using the apparatus. The method may also include powering a light or other electrical load using the apparatus. The present disclosure includes a method for manufacturing the apparatus.Type: ApplicationFiled: April 10, 2013Publication date: May 12, 2016Applicant: SHEETAK, INC.Inventors: Uttam GHOSHAL, Ayan GUHA, Key KOLLE, Himanshu POKHARNA, Ravi PRASHER, Ankita GHOSHAL