Patents Assigned to Sheetak, Inc.
  • Patent number: 12618594
    Abstract: The present disclosure is related to nested heating systems. The heating system uses nested thermoelectric heating assemblies, and hot temperatures can be increased by adding intermediate nested heating assemblies. Intermediate and/or inner assemblies may be removed from the outer assembly to allow for easy transport.
    Type: Grant
    Filed: January 31, 2024
    Date of Patent: May 5, 2026
    Assignee: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Publication number: 20260092726
    Abstract: A portable, independent thermoelectric temperature regulated system for providing active cooling to one or more payloads. The system includes a thermally insulated housing, a phase change material, one or more thermoelectric converters embedded in the thermally insulated housing, and a power source. The system includes a control circuit for managing temperature of the payload(s) based on user selections. The phase change material may be charged and discharged to provide passive cooling or heating when the thermoelectric converter is not active.
    Type: Application
    Filed: December 5, 2025
    Publication date: April 2, 2026
    Applicant: Sheetak, Inc.
    Inventors: Uttam Ghoshal, James Borak, Key Kolle, Dan Grimm
  • Patent number: 12593610
    Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically nonconductive and thermally conductive substrate with direct bonded or electroplated copper. Thermoelement pairs are formed on a barrier layer deposited on the outer layers of the substrate in gaps formed from insulator material deposited on the barrier layer. Openings in the barrier layer may be filled with an insulator to isolate thermoelements, which may then be bridged by a metal layer. Thermoelement pairs may be combined to form larger devices.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: March 31, 2026
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Key Kolle
  • Patent number: 12516854
    Abstract: A portable, independent thermoelectric temperature regulated system for providing active cooling to one or more payloads. The system includes a thermally insulated housing, a phase change material, one or more thermoelectric converters embedded in the thermally insulated housing, and a power source. The system includes a control circuit for managing temperature of the payload(s) based on user selections. The phase change material may be charged and discharged to provide passive cooling or heating when the thermoelectric converter is not active.
    Type: Grant
    Filed: May 10, 2024
    Date of Patent: January 6, 2026
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, James Borak, Key Kolle, Dan Grimm
  • Patent number: 12446467
    Abstract: The present disclosure is related to thermoelectric energy harvesting and powering of Internet-of-Things (IoT) devices and systems. The thermoelectric energy harvesting device includes a thermoelectric converter electrically coupled to voltage rectifier and a power storage medium. The first side of the thermoelectric converter is exposed to ambient air with fluctuating temperatures, while the second side is anchored to a stable temperature. Power generated across the temperature differential can be captured in the power storage medium. The harvester may also include a device to move the harvester relative to the air and, by generating convection cooling of the first side, increase the net energy harvested.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: October 14, 2025
    Assignee: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Publication number: 20250295034
    Abstract: The disclosure is related to structures and methods of making thermoelectric devices. The methods may include preparing an electrically and thermally nonconductive substrate covered with gold-nickel-gold layers. In another step, cylindrical or frustum-shaped tunnels may be formed through the substrate and the gold-nickel-gold layers. Another step may include depositing a barrier layer on the walls of the tunnels that resists diffusion. N-type and p-type thermoelectric materials may be individually associated with and deposited on the barrier layers of the tunnels, and a metal layer may be deposited on the thermoelectric materials. The thermoelectric layers may be formed by combining alternating layers of thermoelectric materials and interlayers of phonon blocking materials. The method may include forming notches in the gold-nickel-gold layers to break electrical continuity. The method may also include a step of partially or fully capping the tunnels with sintered nano-silver or solder.
    Type: Application
    Filed: May 30, 2025
    Publication date: September 18, 2025
    Applicant: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 12342721
    Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder.
    Type: Grant
    Filed: December 22, 2023
    Date of Patent: June 24, 2025
    Assignee: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Publication number: 20240310086
    Abstract: A portable, independent thermoelectric temperature regulated system for providing active cooling to one or more payloads. The system includes a thermally insulated housing, a phase change material, one or more thermoelectric converters embedded in the thermally insulated housing, and a power source. The system includes a control circuit for managing temperature of the payload(s) based on user selections. The phase change material may be charged and discharged to provide passive cooling or heating when the thermoelectric converter is not active.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 19, 2024
    Applicant: Sheetak, Inc.
    Inventors: Uttam Ghoshal, James Borak, Key Kolle, Dan Grimm
  • Publication number: 20240167737
    Abstract: The present disclosure is related to nested heating systems. The heating system uses nested thermoelectric heating assemblies, and hot temperatures can be increased by adding intermediate nested heating assemblies. Intermediate and/or inner assemblies may be removed from the outer assembly to allow for easy transport.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 23, 2024
    Applicant: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 11982473
    Abstract: A portable, independent thermoelectric temperature regulated system for providing active cooling to one or more payloads. The system includes a thermally insulated housing, one or more thermoelectric converters embedded in the thermally insulated housing, and a power source. The system may include one or more optional payload containers. Multiple payload containers may be used in the same housing. The system includes a control circuit for managing temperature of the payload(s) based on user selections. The housing may be hard or soft, and the multiple payload containers may be maintained at different temperatures. Optional phase change materials may be included that may be charged by the active thermoelectric converter discharged as a source of passive cooling or heating.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 14, 2024
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, James Borak, Key Kolle, Dan Grimm
  • Patent number: 11903317
    Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: February 13, 2024
    Assignee: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 11892204
    Abstract: The present disclosure is related to nested cooling and heating systems. The cooling system includes an outer cooling assembly with an inner cooling assembly inserted within the outer cooling system. The inner cooling assembly includes thermoelectric coolers, and the outer cooling assembly may thermoelectric or vapor compression driven. Additional intermediate cooling assemblies may be nested together with the inner and outer cooling assemblies to increase the cooling effect in the innermost cooling assembly. Similarly, the heating system uses nested thermoelectric heating assemblies, and hot temperatures can be increased by adding intermediate nested heating assemblies. Intermediate and/or inner assemblies may be removed from the outer assembly to allow for easy transport.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: February 6, 2024
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Brandon Lee Noska
  • Patent number: 11856857
    Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: December 26, 2023
    Assignee: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Publication number: 20230375233
    Abstract: The present disclosure is related to thermoelectric panels and their use in cooling and heating systems. The cooling/heating systems may include a cylindrical plurality of thermoelectric panels. The panels may include thermoelectric devices embedded between a housing formed by heat conductive layers and edge structures for preserve a low thermal conductivity volume.
    Type: Application
    Filed: August 1, 2023
    Publication date: November 23, 2023
    Applicant: Sheetak, Inc.
    Inventors: UTTAM GHOSHAL, KEY KOLLE
  • Publication number: 20230371380
    Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically nonconductive and thermally conductive substrate with direct bonded or electroplated copper. Thermoelement pairs are formed on a barrier layer deposited on the outer layers of the substrate in gaps formed from insulator material deposited on the barrier layer. Openings in the barrier layer may be filled with an insulator to isolate thermoelements, which may then be bridged by a metal layer. Thermoelement pairs may be combined to form larger devices.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 16, 2023
    Applicant: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Key Kolle
  • Patent number: 11713908
    Abstract: The present disclosure is related to thermoelectric panels and their use in cooling and heating systems. The cooling/heating systems may include a plurality of thermoelectric panels. The panels may include thermoelectric devices embedded between a housing formed by heat conductive layers and edge structures for preserve a low thermal conductivity volume.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: August 1, 2023
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Key Kolle
  • Publication number: 20230138483
    Abstract: The present disclosure is related to thermoelectric energy harvesting and powering of Internet-of-Things (IoT) devices and systems. The thermoelectric energy harvesting device includes a thermoelectric converter electrically coupled to voltage rectifier and a power storage medium. The first side of the thermoelectric converter is exposed to ambient air with fluctuating temperatures, while the second side is anchored to a stable temperature. Power generated across the temperature differential can be captured in the power storage medium. The harvester may also include a device to move the harvester relative to the air and, by generating convection cooling of the first side, increase the net energy harvested.
    Type: Application
    Filed: April 13, 2021
    Publication date: May 4, 2023
    Applicant: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Publication number: 20230012332
    Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.
    Type: Application
    Filed: September 20, 2022
    Publication date: January 12, 2023
    Applicant: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Publication number: 20220384703
    Abstract: The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder.
    Type: Application
    Filed: October 19, 2020
    Publication date: December 1, 2022
    Applicant: Sheetak, Inc.
    Inventor: Uttam GHOSHAL
  • Patent number: 11462669
    Abstract: The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: October 4, 2022
    Assignee: Sheetak, Inc.
    Inventor: Uttam Ghoshal