Patents Assigned to Sheetak, Inc.
  • Publication number: 20160133814
    Abstract: An apparatus and method configured to provide electric power from a thermal source. The apparatus may include a thermoelectric generator and a heat source. The apparatus may include a fuel source. The heat source may be combustive or non-combustive. The apparatus may also include a thermal battery. The heat source may be configured to combust a hydrocarbon fuel to generated heat. The apparatus may include one or more thermal diodes and/or a heat sink to remove waste heat. The method may include converting thermal energy into electrical energy using the apparatus. The method may also include powering a light or other electrical load using the apparatus. The present disclosure includes a method for manufacturing the apparatus.
    Type: Application
    Filed: April 10, 2013
    Publication date: May 12, 2016
    Applicant: SHEETAK, INC.
    Inventors: Uttam GHOSHAL, Ayan GUHA, Key KOLLE, Himanshu POKHARNA, Ravi PRASHER, Ankita GHOSHAL
  • Publication number: 20150155413
    Abstract: The present disclosure is related to an apparatus for generating electric power from selected wavelengths of electromagnetic radiation and a method of manufacture of said apparatus. The apparatus may include a selective wavelength absorber that is thermally coupled to a thermoelectric generator. The selective wavelength absorber may include alternating absorber and dielectric layers configured to absorb and reflect selected wavelengths of electromagnetic radiation. Absorbed electromagnetic radiation may be converted to heat energy for driving the thermoelectric generator. The method may include manufacturing the selective wavelength absorber, including depositing the alternating layers on a substrate that has been formed to receive the electromagnetic radiation at a selected angle or range of angles.
    Type: Application
    Filed: May 15, 2013
    Publication date: June 4, 2015
    Applicant: SHEETAK, INC.
    Inventors: Uttam Ghoshal, Ayan Guha, Himanshu Pokharna
  • Publication number: 20150128614
    Abstract: The present disclosure is related to an apparatus for transporting heat using a thermoelectric converter. The apparatus may include a thermoelectric converter, such as a thin-film. The apparatus may include a heating loop in thermal communication with a hot side of the thermoelectric converter and a cooling loop in thermal communication with a cold side of the thermoelectric converter. The thermoelectric converter may include a stack of alternating thermoelement and constricted contact layers. The thermoelectric converter may have a counter-flow fluid loop that moves a fluid against the temperature gradient of the thermoelectric converter. The apparatus may be configured to provide heating or cooling of a fluid, such as air or water. The apparatus may include a thermal storage medium configured as a thermal battery.
    Type: Application
    Filed: May 8, 2013
    Publication date: May 14, 2015
    Applicant: SHEETAK, INC.
    Inventors: Uttam Ghoshal, Ayan Guha, Himanshu Pokhama
  • Publication number: 20140360545
    Abstract: The present invention relates to a thermoelement for use in thermoelectric energy converters for power generation as well as cooling applications. The thermoelement includes a thermoelectric layer with a first side and a second side. Further, the thermoelement includes a first high power factor electrode and a second high power factor electrode. The first high power factor electrode is thermally and electrically attached to the first side of the thermoelectric layer and the second high power factor electrode is thermally and electrically attached to the second side of the thermoelectric layer. Furthermore, the thermoelement includes a plurality of metal layers. The plurality of metal layers are attached to the first high power factor electrode and the second high power factor electrode. In an embodiment of the present invention, a thermoelement comprises a plurality of micro thermoelements that are configured to reduce thermal density at the electrodes.
    Type: Application
    Filed: May 3, 2012
    Publication date: December 11, 2014
    Applicant: Sheetak, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 8904808
    Abstract: In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: December 9, 2014
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Ayan Guha
  • Publication number: 20140318152
    Abstract: The present disclosure provides a method and a thermoelectric cooling apparatus for cooling a fluid. The thermoelectric cooling apparatus comprises one or more of thermoelectric devices, a hot sink, a cold sink, and a heat rejection apparatus which comprises condenser fins and a fan to attain a high figure of merit. The heat from the fluid is transferred to the hot sink and/or one or more heat pipes by the one or more thermoelectric devices. The heat from the one or more heat pipes is dissipated to the ambient through condenser fins and the fan.
    Type: Application
    Filed: November 17, 2011
    Publication date: October 30, 2014
    Applicant: SHEETAK, INC.
    Inventors: Uttam Ghoshal, Ayan Guha, Himanshu Pokharna
  • Publication number: 20140251403
    Abstract: The present disclosure provides a thermoelement with improved figure of merit for use in thermoelectric devices and a method of manufacturing the thermoelement. The thermoelement comprises metal layers, high power factor electrodes, a thermoelectric layer and a phonon blocking layer. The thickness of the thermoelectric layer is less than a thermalization length to achieve decoupling of phonons and electrons in the thermoelement. The phonon blocking layer reduces phonon conduction without significantly influencing electronic conduction. In an embodiment, the high power factor electrodes are made of materials with high Seebeck coefficient and high thermoelectric power factor that reduce thermal losses at interfaces of the thermoelement. The metal layers form outermost layers of the thermoelement and geometrically shaped to reduce heat flux in the thermoelement.
    Type: Application
    Filed: October 17, 2012
    Publication date: September 11, 2014
    Applicant: SHEETAK, INC.
    Inventor: Uttam Ghoshal
  • Publication number: 20130291564
    Abstract: The present disclosure provides a thermoelectric cooling system with improved performance. The thermoelectric cooling system comprises a thermoelectric cooling unit. The thermoelectric cooling unit comprises a thermoelectric device, heat pipes, condenser fins, a cold sink and a cold fan. The thermoelectric cooling unit can be easily assembled with a chamber which contains a fluid to be cooled. The thermoelectric cooling system comprises screws to attach the thermoelectric cooling unit to the chamber, and sealant rings to prevent heat leakage in the thermoelectric cooling system. Further, the present disclosure provides a thermoelectric cooling system with a freezer part and a refrigerator part. The freezer part encloses the cold sink and the cold fan. The freezer part is cooled by the thermoelectric device, and the refrigerator part is cooled by walls of the freezer part. Further, the present disclosure provides a thermoelectric cooling system for use as a wine cooler.
    Type: Application
    Filed: January 13, 2011
    Publication date: November 7, 2013
    Applicant: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Ayan Guha, Himanshu Pockhama