Abstract: Disclosed herein is a method of making an apparatus suitable for detecting x-ray, the method comprising: attaching a chip comprising an X-ray absorption layer to a surface of a substrate, wherein the surface is electrically conductive; thinning the chip; forming an electrical contact in the chip; bonding an electronic layer to the chip such that the electrical contact of the chip is electrically connected to an electrical contact of the electronic layer.

Abstract: Disclosed herein is an apparatus suitable for detecting x-ray, comprising: an X-ray absorption layer comprising an electrode; an electronics layer, the electronics layer comprising: a substrate having a first surface and a second surface, an electronics system in or on the substrate, an electric contact on the first surface, a via, and a redistribution layer (RDL) on the second surface; wherein the RDL comprises a transmission line; wherein the via extends from the first surface to the second surface; wherein the electrode is electrically connected to the electric contact; wherein the electronics system is electrically connected to the electric contact and the transmission line through the via.

Abstract: Disclosed herein is an apparatus suitable for detecting X-ray, the apparatus comprising: a first substrate comprising a plurality of first electric contacts; a first chip layer comprising a plurality of first chips, wherein each of the first chips comprises a first electrode and is bonded to the first substrate such that the first electrode is electrically connected to at least one of the first electrical contacts; a second substrate comprising a plurality of second electric contacts; and a second chip layer comprising a plurality of second chips, wherein each of the second chips comprises a second electrode and is bonded to the second substrate such that the second electrode is electrically connected to at least one of the second electrical contacts, wherein the first chip layer and the second chip layer are bonded to each other such that at least two second chips are bonded to a same first chip.

Abstract: Disclosed herein is a method of making an apparatus suitable for detecting x-ray, the method comprising: obtaining a substrate having a first surface and a second surface, wherein the substrate comprises an electronics system in or on the substrate, wherein the substrate comprises a plurality of electric contacts are on the first surface; obtaining a first chip comprising a first X-ray absorption layer, wherein the first X-ray absorption layer comprises an electrode; bonding the first chip to the substrate such that the electrode of the first X-ray absorption layer is electrically connected to at least one of the electrical contacts.