Patents Assigned to Shenzhen
  • Patent number: 12114556
    Abstract: Embodiments of the application disclose a display panel and a manufacturing method thereof. The driving circuit layer includes an auxiliary electrode, the auxiliary electrode includes a first conductive layer, a second conductive layer, and a third conductive layer that are stacked, the first conductive layer includes a protrusion portion protruding from the second conductive layer, and the third conductive layer includes an overhang portion protruding from the second conductive layer, wherein the overhang portion, the second conductive layer, and the protrusion portion define an undercut space; and the second electrode extends into the undercut space and is connected to the protrusion portion.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Gaobo Lin
  • Patent number: 12112110
    Abstract: The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: October 8, 2024
    Assignees: Huazhong University of Science and Technology, Shenzhen Union Semiconductor Co., LTD
    Inventors: Zhiqiang Wang, Yayong Yang, Yuxin Ge, Guoqing Xin, Xiaojie Shi
  • Patent number: 12114424
    Abstract: A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: October 8, 2024
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Mei Yang, Gang Yuan
  • Patent number: 12108800
    Abstract: An electronic atomizer having a child lock assembly and an application thereof. The atomizer includes: a supporting housing, on which a movable cover with one end rotatable around the supporting housing is arranged; an e-liquid bin arranged in a cavity of the supporting housing for storing e-liquid, where an e-liquid injection hole for injecting the e-liquid into the e-liquid bin is formed in the supporting housing; an atomization core arranged in the cavity of the supporting housing for heating and atomizing the e-liquid stored in the e-liquid bin; a smoke guiding tube having an inlet end communicated with the atomization core for introducing smoke and an outlet end for smoking; a mouthpiece communicated with the smoke guiding tube, where an elastic locking member is arranged between the mouthpiece and the cover, and the mouthpiece, the cover, and the elastic locking member form a child lock assembly.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN ZUN YI PIN TECHNOLOGY CO., LTD.
    Inventors: Miaowen Yang, Gang Huang, Yajiao Fu, Huifu Shuai, Yonghui Lin
  • Patent number: 12114546
    Abstract: An array substrate and a display panel are provided. The array substrate includes a substrate, a planarization layer, a connection layer, and an anode layer. The planarization layer is disposed on a side of the substrate and is provided with a first via hole. The connection layer includes a connecting portion. The connecting portion is disposed in the first via hole and extends to a surface of the planarization layer. The anode layer is disposed on a surface of the connecting portion away from the planarization layer. In the array substrate, the connecting portion is disposed between the planarization layer and the anode layer, which can prevent pixels of the display panel from generating black dots.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Ruonan Wang
  • Patent number: 12112556
    Abstract: An image recognition method includes: obtaining a target three-dimensional (3D) image; inputting the target 3D image to a first recognition model; and obtaining the image type of the target 3D image outputted by the first recognition model. The first recognition model is configured to perform image recognition on the target 3D image to obtain an image type of the target 3D image. A convolutional block of the first recognition model is the same as a convolutional block of a second recognition model, and configured to perform image recognition on the target 3D image. The second recognition model is obtained by training an original recognition model using a target training sample, the target training sample including cubes obtained by rotating and sorting N target cubes obtained from a 3D sample image, N being a natural number greater than 1.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: October 8, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Xinrui Zhuang, Yuexiang Li, Yefeng Zheng
  • Patent number: 12109852
    Abstract: The application discloses a tire pressure sensor communication method, device, electronic equipment and storage medium. The method comprises the follow steps: acquiring a first tire state when a tire pressure sensor is awakened; collecting first tire pressure data corresponding to the first tire state, and determining whether the first tire state meets a preset state switching condition according to the first tire pressure data; controlling the first tire state to switch to a corresponding second tire state if the first tire state meets the state switching condition; acquiring a preset tire pressure data transmission control parameter corresponding to the second tire state; collecting second tire pressure data corresponding to the second tire state according to the tire pressure data transmission control parameter, and sending the second tire pressure data to a vehicle-mounted tire pressure monitoring module.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Yunjia Intelligent Technology Co., Ltd.
    Inventors: Huanjian Wu, Xiangyu Jin, Xianping Yang, Kai Wu
  • Patent number: 12111653
    Abstract: A diagonal equal-hop heterogeneous composite redundancy domain architecture of an intelligent vehicle, comprising: a central gateway, and ADAS domain controller, a vehicle-mounted audio and video domain controller, a vehicle chassis domain controller, and an energy domain controller. The central gateway is respectively communicatively connected to the ADAS domain controller, the vehicle-mounted audio and video domain controller, the vehicle chassis domain controller, and the energy domain controller, such that the central gateway, the ADAS domain controller, the vehicle-mounted audio and video domain controller, the vehicle chassis domain controller, and the energy domain controller form a star connection topological structure; and the ADAS domain controller, the vehicle-mounted audio and video domain controller, the vehicle chassis domain controller, and the energy domain controller form an annular connection topological structure.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN AUTOMOTIVE RESEARCH INSTITUTE, BEIJING INSTITUTE OF TECHNOLOGY (SHENZHEN RESEARCH INSTITUTE OF NATIONAL ENGINEERING LABORATORY FOR ELECTRIC VEHICLES)
    Inventors: Wanke Cao, Wenwei Wang, Jinrui Nan
  • Patent number: 12113953
    Abstract: This application provides a three-dimensionalization method and apparatus for a two-dimensional image, an electronic device, and a computer-readable storage medium. The method includes performing depth perception processing on a two-dimensional image, to obtain a depth value of each pixel in the two-dimensional image; performing migration processing on the two-dimensional image from multiple perspectives, to obtain a migration result of the two-dimensional image corresponding to each perspective; determining a color value of each pixel in a migration image corresponding to each perspective, based on the depth value of each pixel in the two-dimensional image and the migration result of the two-dimensional image corresponding to each perspective; generating, based on the color value of each pixel in the migration image of each perspective, the migration image corresponding to the perspective; and encapsulating the migration images of the multiple perspectives in an order, to obtain a three-dimensional video.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: October 8, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yue Luo, Yu Li, Ying Shan
  • Patent number: 12111979
    Abstract: A method for generating mark information in a virtual environment includes displaying a target-perspective picture showing the virtual environment, a sight bead pointing to an aiming position, and receiving a mark operation triggered on a mark control interface. The method further includes, in response to receiving the mark operation, generating, according to the received mark operation, mark information on a virtual object to which the aiming position points. The virtual object on which the mark information is generated is a movable object, a virtual prop, a virtual building, or a virtual landscape object in the virtual environment. The generated mark information is visible at a position of the virtual object in the virtual environment to one or more teammates of the virtual character.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: October 8, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventor: Junxiang Wang
  • Patent number: 12112043
    Abstract: A data flow control device in a streaming architecture chip includes at least one first data buffer module, at least one operation module and at least one second data buffer module. The second data buffer module is configured to send a flow control count signal to the first data buffer module, the flow control count signal being used for informing the first data buffer module of an amount of data that can be received of the second data buffer module. The first data buffer module is configured to send a data signal and a valid signal to the second data buffer module via the operation modules according to the flow control count signal, the valid signal being used for indicating that a corresponding data signal is valid.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Corerain Technologies Co., Ltd.
    Inventors: Chenchen Lu, Kuen Hung Tsoi, Xinyu Niu
  • Patent number: D1045486
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN YINGBOWEIYE TECHNOLOGY CO., LTD.
    Inventors: Jinghua Xie, Jingru Xie
  • Patent number: D1045773
    Type: Grant
    Filed: May 17, 2024
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Kuake Zhichuang Technology Co., Ltd.
    Inventor: Wenhua Li
  • Patent number: D1045781
    Type: Grant
    Filed: January 16, 2023
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Jiajiatong Plastic Mould Co., Ltd.
    Inventor: Jia Chen
  • Patent number: D1045791
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN YONGCHUANGCHENG TECHNOLOGY CO., LTD.
    Inventor: Lijuan Yang
  • Patent number: D1045827
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Xunweijia Technology Development Co., Ltd.
    Inventor: Qibin Mai
  • Patent number: D1045835
    Type: Grant
    Filed: June 14, 2024
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Beatime Technology Co., Ltd
    Inventor: Shuxian Hong
  • Patent number: D1046169
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Shuge Medical Beauty Devices Co., Ltd.
    Inventor: Zuowo Xie
  • Patent number: D1046247
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: October 8, 2024
    Assignee: Shenzhen Dilang Optoelectronics Co., Ltd
    Inventors: Aibin Hu, Changwei Min, Xuanhaolan Min, Xiong Li, Jinlong Tang, Xinnan Duan
  • Patent number: D1046275
    Type: Grant
    Filed: December 26, 2022
    Date of Patent: October 8, 2024
    Assignee: SHENZHEN VERDEWELL TECHNOLOGY LIMITED
    Inventor: Shaowen Li