Patents Assigned to Shenzhen
  • Patent number: 11645649
    Abstract: An apparatus including processing circuitry and a method are described. When receiving a cross-chain transaction request to transfer a resource from a first account to a second account, the processing circuitry is configured to generate a task corresponding to the first account. The task can indicate conditions for implementing events in transferring the resource. A first blockchain system provides services for the first account, and a second blockchain system different from the first blockchain system provides services for the second account. The processing circuitry transfers the resource to the second account based on the task when a first plurality of first nodes in the first blockchain system reaches a consensus on a generation event of the task and updates a task status of the task to being finished when a plurality of second nodes in the second blockchain system reaches a consensus on a transfer event of the resource.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 9, 2023
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Rui Guo, Maocai Li, Jun Liang, Jianjun Zhang, Zongyou Wang, Haitao Tu, Qi Zhao, Binhua Liu, Dawei Zhu, Qing Qin
  • Patent number: 11642962
    Abstract: A center information display system includes a center information display; a capturing device configured to obtain information on an occupant inside a vehicle; a rotating structure configured to adjust a view angle of the center information display; and a control device in communication with the capturing device, being configured to determine whether there is an occupant in a driver seat or a passenger seat, and control the rotating structure to rotate the center information display to a predetermined view angle.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 9, 2023
    Assignees: FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Chia-Yen Lee
  • Patent number: 11646509
    Abstract: A grounding elastic contact and an electronic device including the same. The grounding elastic contact includes an elastic core, and a double-sided polyethylene terephthalate (PET) tape, a polyimide (PI) film, and a conductive layer, where the PI film is laminated and bonded on an outer side of the double-sided PET tape; a middle region of the double-sided PET tape is attached to an upper surface of the elastic core; after passing through left and right sides of the elastic core respectively, two ends of the double-sided PET tape are laminated on a lower surface of the elastic core; the conductive layer includes one end bonded on the upper surface of the elastic core, and the other end passing through the left side of the elastic core; the double-sided PET tape includes a PET backing and an adhesive coated on two sides of the PET backing.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: May 9, 2023
    Assignee: Shenzhen Johan Material Technology Co., Ltd.
    Inventors: Mujiu Chen, Fang Chen, Qiao Chen, Jingyun Liu
  • Publication number: 20230138472
    Abstract: A display device including a beam emitter and a display panel is provided. The beam emitter emits a first beam; the display panel includes a display screen body and a light control layer. The light control layer includes photosensitive devices that outputs a sensing signal according to a sensing result, a control module for controlling turning on and turning off of the photosensitive devices, and a reading module for reading the sensing signal output by the photosensitive devices and determining a projection position of the first beam on the display panel according to the sensing signal.
    Type: Application
    Filed: May 15, 2020
    Publication date: May 4, 2023
    Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Miao JIANG, Lixuan CHEN, Xin ZHANG, Lei WEN, Bao ZHA
  • Publication number: 20230133153
    Abstract: Provided are composite array electrode, preparation method thereof and use thereof. The composite array electrode comprises a microelectrode array substrate, and a modification layer formed on a surface of a microelectrode of the microelectrode array substrate, wherein the modification layer comprises a plurality of electrically conductive layers arranged at intervals on the surface of the microelectrode, an insulating layer arranged on the surface of the microelectrode except the electrically conductive layers, and wherein material for the electrically conductive layers comprises one or more of nano platinum, nano iridium, conductive polymer and carbon nanotubes. The composite array electrode effectively eliminates the influence of edge effect such that the electric field distributes uniformly on the microelectrode surface of the composite array electrode, significantly improving electrochemical performance and detection capability of the electrode.
    Type: Application
    Filed: June 15, 2022
    Publication date: May 4, 2023
    Applicant: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY
    Inventors: Qi ZENG, Tianzhun WU
  • Publication number: 20230134077
    Abstract: A method for detecting a storage life of a pre-crosslinked material is provided. Tableting is performed on an unaged pre-crosslinked material to obtain crosslinked polyethylene. A crosslinking degree and a mechanical property of the crosslinked polyethylene are measured to obtain reference data. The pre-crosslinked material is heated to obtain a fast-aged pre-crosslinked material. The crosslinking degree and mechanical property of crosslinked polyethylene obtained from the fast-aged pre-crosslinked material are measured to obtain measurement results, which are compared with the reference data. If comparison results all fall within corresponding ranges, the time period of heating is increased by a step to repeat the above steps until the comparison results do not all fall within the corresponding ranges. A result obtained by subtracting the step from the time period of heating is converted into a time period of storage at the room temperature.
    Type: Application
    Filed: October 21, 2021
    Publication date: May 4, 2023
    Applicants: ELECTRIC POWER RESEARCH INSTITUTE. CHINA SOUTHERN POWER GRID, SHENZHEN POWER SUPPLY CO., LTD.
    Inventors: Xiaolin LI, Mingli FU, Shuai HOU, Baojun HUI, Wenbo ZHU, Guoxing WU, Hong XIE, Xiao CHEN, Shu XU, Bin FENG, Yifan ZHANG
  • Publication number: 20230138863
    Abstract: A substituted amino heterocyclic carboxamide compound as represent by formula (?), or a pharmaceutically acceptable salt, a prodrug, a hydrate or a solvent compound, a crystal form, a stereoisomer or an isotopic variant of the compound, and a pharmaceutical composition thereof, and the use thereof as an FLT3/AXL kinase inhibitor for treating acute myelocytic leukemia.
    Type: Application
    Filed: October 25, 2022
    Publication date: May 4, 2023
    Applicant: Shenzhen TargetRx, Inc.
    Inventors: Yihan Wang, Huanyin Li
  • Publication number: 20230137793
    Abstract: The present disclosure provides a display screen and a display device. The display screen includes a display panel, a cover plate, and a shielding layer disposed between the two. The display screen further includes a bonding layer disposed between the shielding layer and the display panel. The bonding layer includes a glue layer including a first side close to the display panel and a second side away from the display panel; and a light guiding portion including a light incident side configured to input ultraviolet light and a light-emitting side configured to output the ultraviolet light to the first side or the second side.
    Type: Application
    Filed: July 1, 2020
    Publication date: May 4, 2023
    Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Mingjun Zhou
  • Publication number: 20230135069
    Abstract: Disclosed are a method for manufacturing a high-temperature structural material and a precursor. The method includes following operations: providing a precursor, wherein the precursor is made of a polymer or the polymer and a high-temperature material; processing the precursor into a precursor object with a preset shape; and converting the processed precursor object into a high-temperature material object through a preset processing method.
    Type: Application
    Filed: March 1, 2022
    Publication date: May 4, 2023
    Applicant: UNIVERSITY OF HONG KONG SHENZHEN FUTIAN RESEARCH INSTITUTE
    Inventors: Jian LU, Guo LIU, Jianan YIN, Xiaofeng ZHANG, Xinya LU
  • Publication number: 20230140130
    Abstract: An LED display panel is provided by the present application. Two adjacent LED devices located on both ends of a first splicing seam have a first splicing distance therebetween, and the first splicing distance is defined as D1+?A1. A first region is disposed with a plurality of first LED devices thereon. A pitch between at least portions of two adjacent first LED devices gradually decreases from an end close to the first splicing seam to an end away from the first splicing seam in the first region in a first direction, and a pitch between any two adjacent first LED devices is less than the first splicing distance and greater than a first target pitch.
    Type: Application
    Filed: August 4, 2020
    Publication date: May 4, 2023
    Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Lixuan CHEN, Xin ZHANG
  • Publication number: 20230135279
    Abstract: A high-performance, cost- effective cable-to-cable connector assembly is described for use in harsh environment applications, where reliable signal circuits are critical to operating performance. With thermoplastic housings and elastic seals, the connectors allow use over a wide operating temperature range and enhanced sealing performance to withstand conditions of extreme temperature and moisture for demanding interconnect architectures.
    Type: Application
    Filed: October 12, 2022
    Publication date: May 4, 2023
    Applicant: ITT Cannon Electronics Shenzhen Co Ltd
    Inventors: Shiyong WANG, Zhigang WANG
  • Publication number: 20230134064
    Abstract: Disclosed is an electronic atomizer, which includes a housing internally provided with an E-liquid storage cavity and an atomization gas channel, the E-liquid storage cavity is communicated with the atomization gas channel, and the housing is provided with a gas inlet and a smoking port; an atomizing assembly arranged in the housing and communicated with the atomization gas channel, the atomizing assembly is used for atomizing E-liquid in the E-liquid storage cavity; a power supply assembly arranged in the housing, the power supply assembly is electrically connected with the atomizing assembly; and a first E-liquid adsorbing member arranged between the power supply assembly and an inner wall of the housing, the first E-liquid adsorbing member is provided with an air channel; and the gas inlet, the air channel, the atomization gas channel and the smoking port are sequentially communicated to form at least a part of smoking flow channel.
    Type: Application
    Filed: April 5, 2022
    Publication date: May 4, 2023
    Applicant: SHENZHEN ZUN YI PIN TECHNOLOGY CO., LTD.
    Inventors: MIAOWEN YANG, YONGHUI LIN, SHIMEI PAN, HUIFU SHUAI, WEILIN ZHANG, JIANGTAO LI
  • Publication number: 20230135498
    Abstract: Embodiments of the present disclosure relate to a semiconductor package, a method of forming the package and an electronic device. For example, the semiconductor package may comprise a first substrate assembly comprising a first surface and a second surface opposite the first surface. The semiconductor package may also comprise one or more chips connected or coupled to the first surface of the first substrate assembly by a first thermally and electrically conductive connecting material. In addition, the semiconductor package further comprises a second substrate assembly comprising a third surface and a fourth surface opposite the third surface, the third surface and the first surface being arranged to face each other, and the third surface being connected to one or more chips by a second thermally and electrically conductive connecting material. At least one of the first surface and the third surface is shaped to have a stepped pattern to match a surface of the one or more chips.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 4, 2023
    Applicants: STMICROELECTRONICS S.r.l., SHENZHEN STS MICROELECTRONICS CO., LTD.
    Inventors: Yi Ming LIANG, Roberto TIZIANI, Qian LIU, Feng DING
  • Publication number: 20230134241
    Abstract: The present application discloses a manufacturing method for a display module and a display screen. The method includes: forming a semiconductor device by pre-processing a semiconductor epitaxial wafer; forming a first transparent layer on a substrate surface of the semiconductor device; forming a first opening exposing the substrate by etching the first transparent layer; forming a first quantum dot layer on the substrate surface exposed by the first opening and the surface of the first transparent layer; etching away the first quantum dot layer in the outer region of the first opening, and remaining the first quantum dot layer inside the first opening; and forming a DBR film layer that filters blue light.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 4, 2023
    Applicant: SHENZHEN SITAN TECHNOLOGY CO., LTD.
    Inventors: Zhaojun LIU, Guocai WU, Weijing MO
  • Publication number: 20230140340
    Abstract: A printing device includes: a base; a printing platform, the printing platform being connected to the base; a printing bracket, the printing bracket being fixed on the base; and a printing head assembly, the printing head assembly being connected to the printing bracket and being arranged above the printing platform, and the printing head assembly including a bearing member, a discharging assembly and an optical assembly. The discharging assembly and the optical assembly are both arranged on the bearing member, the discharging assembly is used for providing printing materials of at least two colors for the printing platform, and the optical assembly is used for curing the printing materials on the printing platform. The printing device can implement three-dimensional color printing.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 4, 2023
    Applicant: Shenzhen Anycubic Technology Co., Ltd.
    Inventors: Gaocheng FENG, Xinqiao DENG
  • Publication number: 20230133423
    Abstract: A flexible substrate, a manufacturing method thereof, and a flexible display device are provided. The method includes: step S10, forming a first aerogel layer with a cross-linked structure and a nanoporous structure on a substrate; step S20: forming an inorganic layer on the first aerogel layer; step S30, forming a second flexible substrate layer on the first aerogel layer, and allowing the second flexible substrate layer to cover the inorganic layer; and step S40, peeling the first aerogel layer, the inorganic layer, and the second flexible substrate layer from the substrate to form the flexible substrate.
    Type: Application
    Filed: October 14, 2020
    Publication date: May 4, 2023
    Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Linshuang LI
  • Publication number: 20230138316
    Abstract: The present disclosure relates to electronic equipment, and especially relates to an alternating current transmission circuit. The alternating current transmission circuit includes power supply circuit and a switch circuit coupled with the power supply circuit. The switch circuit includes a main control circuit, a surge detection circuit, and a first switch device connected in series in the power supply circuit. The main control circuit is signal connected with the first switch device and configured to control on-off of the power supply circuit by controlling the first switch device. An input terminal of the surge detection circuit is connected with the power supply circuit, and an output terminal of the surge detection circuit is connected with the main control circuit.
    Type: Application
    Filed: March 24, 2022
    Publication date: May 4, 2023
    Applicant: Shenzhen Baseus Technology Co.,Ltd
    Inventors: Shiyou HE, Longkou CHEN, Dengyu GUI
  • Patent number: 11641538
    Abstract: The present disclosure relates to a speaker device including a circuit housing, an ear hook, a rear hook, and a speaker assembly. The speaker assembly may include a headphone core and a housing for accommodating the headphone core, the housing may include a housing panel facing a human body and a housing back opposite to the housing panel, and the headphone core may cause the housing panel and the housing back to vibrate. An absolute value of a difference between a first phase of a vibration of the housing panel and a second phase of a vibration of the housing back may be less than 60 degrees when a frequency of each of the vibration of the housing panel and the vibration of the housing back is between 2000 Hz and 3000 Hz.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: May 2, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Yongjian Li, Wenbing Zhou, Jinbo Zheng, Zhuyang Jiang, Xin Qi, Fengyun Liao
  • Patent number: D985275
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 9, 2023
    Assignee: SHENZHEN LIYI99.COM, LTD.
    Inventor: Xuzhong Wang
  • Patent number: D985832
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: May 9, 2023
    Assignee: SHENZHEN RELX TECHNOLOGY CO., LTD.
    Inventors: Aiqing Liu, Chen Chen