Patents Assigned to Shikoku Chemicals Corporation
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Patent number: 11807596Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).Type: GrantFiled: October 25, 2018Date of Patent: November 7, 2023Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Naoto Okumura, Akihito Otsuka, Takeshi Kumano, Kazuyuki Fujikawa, Yusuke Araki
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Patent number: 11773207Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.Type: GrantFiled: December 23, 2019Date of Patent: October 3, 2023Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Naoto Okumura, Yusuke Araki, Takeshi Kumano
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Patent number: 11702507Abstract: This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.Type: GrantFiled: March 26, 2020Date of Patent: July 18, 2023Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Akihito Otsuka, Takashi Kashiwabara, Kazunori Aoki, Takeshi Kumano
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Patent number: 11680076Abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.Type: GrantFiled: April 5, 2018Date of Patent: June 20, 2023Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Noriaki Yamaji, Takahito Imamine, Masahiko Tsujino, Hirohiko Hirao
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Patent number: 11472823Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.Type: GrantFiled: February 24, 2021Date of Patent: October 18, 2022Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
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Publication number: 20220185960Abstract: This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.Type: ApplicationFiled: March 26, 2020Publication date: June 16, 2022Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Akihito OTSUKA, Takashi KASHIWABARA, Kazunori AOKI, Takeshi KUMANO
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Publication number: 20220112330Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.Type: ApplicationFiled: December 23, 2019Publication date: April 14, 2022Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Naoto OKUMURA, Yusuke ARAKI, Takeshi KUMANO
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Patent number: 11225788Abstract: To provide a roof structure free from generation of a dead space, capable of reducing a load moment. A roof structure including a roof (1) supported by a post (2) is a cantilever structure having the front end of the roof (1) formed in a free end and the rear end connected to the upper end of the post (2). The lower end of the post (2) is fixed in a concrete foundation (5). The post (2) is tilted with the upper end directed backward and with the lower end directed forward. A counter moment cm generated on the post (2) at the time of application of a load to the roof (1) reduces a load moment (M) generated by the load, thereby bringing the post (2) into an advantageous state in strength. The configuration of the post (2) with two post members and a vertical connecting member (10) connecting the post members facilitates the construction of the post (2) to be tilted at a desired angle.Type: GrantFiled: August 22, 2018Date of Patent: January 18, 2022Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Koji Sakaguchi, Shinji Sagawa
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Patent number: 11078450Abstract: A stabilized solid bleaching agent which has good solubility in water without undergoing the occurrence of foaming and without generating residues has been demanded. The present invention provides a stabilized solid-bleaching-agent-containing material having a coating layer formed therein, wherein the coating layer contains at least one component selected from the group consisting of an alkali metal salt of an aromatic carboxylic acid, an alkali metal salt of a non-cyclic dicarboxylic acid, an alkali metal salt of a non-cyclic monocarboxylic acid having 1 to 7 carbon atoms and mixtures thereof.Type: GrantFiled: April 21, 2017Date of Patent: August 3, 2021Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Akihiro Norimoto, Koichi Sahiro, Tsuyoshi Toyota, Yoshiya Iwasaki
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Publication number: 20210179642Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.Type: ApplicationFiled: February 24, 2021Publication date: June 17, 2021Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Noriaki YAMAJI, Takayuki MURAl, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Takahito IMAMINE, Masahiko TSUJINO, Tomoya MAE, Hirohiko HIRAO
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Patent number: 11014946Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.Type: GrantFiled: July 31, 2018Date of Patent: May 25, 2021Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
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Patent number: 10975108Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.Type: GrantFiled: July 31, 2018Date of Patent: April 13, 2021Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
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Patent number: 10913731Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.Type: GrantFiled: October 15, 2018Date of Patent: February 9, 2021Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Kazunori Aoki, Naoto Okumura, Takashi Kashiwabara, Yusuke Araki, Akihito Otsuka, Takeshi Kumano
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Publication number: 20200369606Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).Type: ApplicationFiled: October 25, 2018Publication date: November 26, 2020Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Naoto OKUMURA, Akihito OTSUKA, Takeshi KUMANO, Kazuyuki FUJIKAWA, Yusuke ARAKI
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Publication number: 20200270236Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.Type: ApplicationFiled: October 15, 2018Publication date: August 27, 2020Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Kazunori AOKI, Naoto OKUMURA, Takashi KASHIWABARA, Yusuke ARAKI, Akihito OTSUKA, Takeshi KUMANO
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Publication number: 20200223875Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.Type: ApplicationFiled: July 31, 2018Publication date: July 16, 2020Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Noriaki YAMAJI, Takayuki MURAl, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Takahito IMAMINE, Masahiko TSUJINO, Tomoya MAE, Hirohiko HIRAO
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Patent number: 10550131Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.Type: GrantFiled: March 10, 2016Date of Patent: February 4, 2020Assignees: SHIKOKU CHEMICALS CORPORATION, NAMICS CORPORATIONInventors: Akikazu Matsuda, Naoto Okumura, Takeshi Kumano
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Publication number: 20200031852Abstract: The abstract of the international application is being replace by the following abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.Type: ApplicationFiled: April 5, 2018Publication date: January 30, 2020Applicant: SHIKOKU CHEMICALS CORPORATIONInventors: Takayuki MURAI, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Noriaki YAMAJI, Takahito IMAMINE, Masahiko TSUJINO, Hirohiko HIRAO
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Patent number: 10405422Abstract: The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom.Type: GrantFiled: May 30, 2013Date of Patent: September 3, 2019Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Shusaku Iida, Takayuki Murai, Hirohiko Hirao
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Patent number: 10398028Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.Type: GrantFiled: November 15, 2016Date of Patent: August 27, 2019Assignee: SHIKOKU CHEMICALS CORPORATIONInventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai