Abstract: A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and either R2 and R3 represent chlorine and R4 and R5 represent hydrogen, or R2 and R3 represent hydrogen and R4 and R5 represent chlorine.

Abstract: A compression molded product of effervescent chlorinated isocyanuric acid, comprising (a) chlorinated isocyanuric acid, (b) organic acid, (c) carbonate salt and (d) sodium sulfate.

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux. Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.

Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

Abstract: Novel molten-salt type polyelectrolytes are disclosed which contain as an essential ingredient a molten salt polymer obtained by reacting an imidazolium derivative, such as a 1,3-dialkylimidazolium halide, 1,2,3-trialkylimidazolium halide, 1-vinyl-3-alkylimidazolium halide, or 1-vinyl-2,3-alkylimidazolium halide, with an acid monomer, a poly(vinylsulfonamide), trifluoromethanesulfonimide, or the like. The electrolytes show high ionic conductivity at room temperature and have excellent stability to temperature fluctuations and excellent mechanical properties.

Abstract: A surface treating agent for copper and a copper alloy, comprising an aqueous solution containing an imidazole compound or a benzimidazole compound, a complexon, and iron ions. The agent forms a chemical film selectively on the surface of copper while forming no film on other metals.

Abstract: A polyarylene sulfide resin composition having an excellent fluidability and a good moldability is disclosed. The resin composition is useful as a material for an optical pick-up part which has a high reliability and a high tenacity and does not generate deviation of an optical axis with changes in environmental conditions such as temperature and humidity. The polyarylene sulfide resin composition comprises, as main components, a polyarylene sulfide resin, a fibrous filler and a particulate filler, and, optionally, a silane coupling agent and an alicyclic hydrocarbon.

Abstract: A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.

Abstract: A process for preparing, on an industrial scale, 4-halo-5-(hydroxymethyl) imidazole compounds that are useful as intermediates for medicines. A 4-chloro-5-(hydroxymethyl) imidazole compound, a 4-bromo-5-(hydroxymethyl) imidazole compound or a like compound is synthesized by reacting a 4,5-bis(hydroxymethyl) imidazole compound with a halogenating agent such as an N-chlorosuccinimide, an N-bromosuccinimide, a chlorinated isocyanuric acid compound or the like compound.

Abstract: An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserves excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredient, a 2-arylimidazole compound represented by the following formula, ##STR1## wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, ##STR2## wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case where R, R1 and R2 are all hydrogen atoms.

Abstract: An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding a nitrogen-containing heterocyclic compound, an aliphatic amine or an aromatic amine to an epoxy compound having one, two or more epoxy groups in one molecule, with (2) a boric acid compound or (3) a boric acid compound and a phenolic compound, exhibits high curing property and storage stability, and can be favorably used as a curing agent for the epoxy resin composition. The epoxy resin composition prepared by mixing the epoxy resin with (1) and (2) or (1) and (3), exhibits excellent curing property and storage stability.

Abstract: An organic solvent alone or together with a rubber process oil is added to a powder of .mu.-sulfur, the mixture is granulated, and the granulation product is heated at a temperature lower than 120.degree. C. to evaporate the organic solvent, whereby granular .mu.-sulfur having an improved flowability is obtained. This granular .mu.-sulfur is valuable as a rubber-vulcanizing agent.

Abstract: Disclosed is a process for the surface treatment of copper or a copper alloy, which comprises immersing the surface of copper or a copper alloy in an aqueous solution containing a benzimidazole compound having an alkyl group of at least 3 carbon atoms at the 2-position and an organic acid.

Abstract: A cut flower is immersed in an aqueous solution containing chloroisocyanuric acid or its salt. By this treatment, freshness of the color and gloss of the cut flower is maintained over a long period and a high life-prolonging effect is attained.

Abstract: A mixture comprising (i) an oxide, hydroxide or oxyhydroxide of aluminum, (ii) an aluminum-containing sulfate, (iii) an oxide or oxyacid of boron or an alkali metal salt thereof and (iv) an alkali metal sulfate is heated at a temperature of 900 to 1200.degree. C. to grow an aluminum borate whisker. In this process, the reaction is advanced apparently in the solid phase, and this process is advantageous over the conventional processes in that the yield is high and the isolation and purification of the reaction product is facilitated.

Abstract: An aluminum borate whisker is prepared by heating and reacting aluminum sulfate and an oxide of boron, an oxyacid of boron or an alkali metal salt thereof in the presence of an alkali metal sulfate and an alkali metal carbonate. In this process, the reaction is advanced apparently in the solid phase, and this process is advantageous over the conventional processes in that the yield is high and the withdrawal of the reaction product is facilitated.

Abstract: Disclosed is a process for the preparation of a 1-benzylimidazole compound represented by the following general formula: ##STR1## wherein R.sub.2 represents a lower alkyl group or phenyl group, and R.sub.4 represents a hydrogen atom or a methyl group,which comprises heating and to react a 1-unsubstituted imidazole compound represented by the following general formula: ##STR2## wherein R.sub.2 and R.sub.4 are as defined above, with benzyl alcohol in the presence of a carboxylic acid, a carboxylic anhydride, a benzyl ester thereof or a lower alkyl ester thereof, and neutralizing the reaction product with an alkali.

Abstract: Disclosed is a metal-based composite material comprising aluminum or an aluminum alloy combined with a whisker of aluminum borate represented by the chemical formula of 9Al.sub.2 O.sub.3.2B.sub.2 O.sub.3 or 2Al.sub.2 O.sub.3.B.sub.2 O.sub.3. This composite material has excellent mechanical properties such as high tensile strength and high hardness.

Abstract: Disclosed is a process for the preparation of an aluminum borate whisker, which comprises mixing a trialkali aluminum trisulfate represented by the following general formula:M.sub.3 Al(SO.sub.4).sub.3wherein M represents an alkali metal, with at least one boric anhydride source component selected from the group consisting of boron oxides, boron oxyacids and alkali metal salts thereof, and carrying out reaction and growth at a temperature of from 700.degree. to 1200.degree. C.

Abstract: Disclosed is a positively chargeable toner comprising, as a charge-controlling agent, an acid adduct, metal complex or derivative of a 2-alkylimidazole represented by the following formula: ##STR1## wherein R.sub.2 stands for an alkyl group having 11 through 17 carbon atoms, and R.sub.4 stands for a hydrogen atom or a methyl group.In this toner, a high charge-controlling effect is attained with a small amount of the charge-controlling agent, and since the charge-controlling agent has a white color or light color, this toner is advantageously used as an electrostatic photographic toner for the color printing.