Patents Assigned to Shin-Etsu Chemicals Co., Ltd.
  • Method for the preparation of fine globular silicone resin particles
    Publication number: 20020016434
    Abstract: The invention discloses a novel method for the preparation of globular particles of a silicone resin or, in particular, a polyorganosilsesquioxane resin having properties suitable as an adjuvant in hair-care toiletry preparations by the hydrolysis condensation reaction of an organotrialkoxy silane compound such as methyl trimethoxysilane in an aqueous alkaline medium. Characteristically, the aqueous reaction medium is alkalified with ammonia or, preferably, an amine compound, e.g., mono(n-alkyl) amine compound, to have a specified pH value of 10.0 to 13.0 and the hydrolysis condensation reaction of the starting silane compound in the aqueous medium is conducted in the presence of metallic ions or, in particular, magnesium ions in a specified concentration of 1×10−5 to 1×10−2 mole/liter.
    Type: Application
    Filed: August 1, 2001
    Publication date: February 7, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Yoshinori Inokuchi
  • Heat conductive silicone composition and semiconductor device
    Publication number: 20020014692
    Abstract: A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.
    Type: Application
    Filed: June 25, 2001
    Publication date: February 7, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiro Yamada, Kazuhiro Toba, Takayuki Takahashi, Kenichi Isobe
  • Novel lactone compounds having alicyclic structure and their manufacturing method
    Publication number: 20020016477
    Abstract: Lactone compounds of formula (1) are novel and useful as monomers to form base resins for use in chemically amplified resist compositions adapted for micropatterning lithography.
    Type: Application
    Filed: July 5, 2001
    Publication date: February 7, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takeshi Kinsho, Takeru Watanabe, Koji Hasegawa, Tsunehiro Nishi, Matsuo Nakashima, Seiichiro Tachibana, Jun Hatakeyama
  • Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
    Patent number: 6344309
    Abstract: A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the patterned coating, and immersing the substrate in an electroless plating bath for thereby chemically depositing a metal film on the patterned coating.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: February 5, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Motoo Fukushima, Kunio Ito, Shigeru Mori
  • Method of reducing surface tackiness of low-hardness thermally conductive silicone rubber sheet
    Patent number: 6344104
    Abstract: A reduction of the surface tackiness of a low-hardness thermally conductive silicone rubber sheet is performed by coating an organohydrogenpolysiloxane oil evenly on a resin film, and pasting together the oil-coated side of the resin film and an addition-cured low-hardness thermally conductive silicone rubber sheet having an Asker C hardness of from 1 to 80. Pasting can be done, for example, by passage between two rolls to supply the organohydrogenpolysiloxane oil to the surface of the silicone rubber sheet. Then, in only the surface part of the sheet, a cross-linking reaction is caused to reduce the tackiness of the sheet surface.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: February 5, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tokio Sekiya, Akio Nakano
  • Silicone-based pressure-sensitive adhesive composition
    Publication number: 20020013386
    Abstract: The invention discloses a silicone-based pressure-sensitive adhesive composition which comprises, as a curing agent of a conventional silicone ingredient consisting of a diorganopolysiloxane and a so-called MQ siloxane resin, a 4,4′-dialkyl dibenzoyl peroxide or, in particular, 4,4′-dimethyl dibenzoyl peroxide instead of conventional organic peroxides such as dibenzoyl peroxide compounds. The inventive pressure-sensitive adhesive composition is advantageous in respect of the excellent adhesion performance which can be exhibited by curing under moderate conditions of temperature and time as compared with conventional silicone-based pressure-sensitive adhesive compositions.
    Type: Application
    Filed: June 14, 2001
    Publication date: January 31, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Polymers, resist compositions and patterning process
    Publication number: 20020012871
    Abstract: Polymers comprising recurring units of formula (1) are provided wherein R1 is a straight, branched or cyclic divalent C1-20 hydrocarbon group or a bridged cyclic hydrocarbon group, R is hydrogen atom or an acid labile group, 0≦m≦3, 0≦n≦3 and 0≦m+n≦6.
    Type: Application
    Filed: June 1, 2001
    Publication date: January 31, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun Hatakeyama, Toshiaki Takahashi, Toshinobu Ishihara, Jun Watanabe, Tohru Kubota, Yoshio Kawai
  • Base sheet for flexible printed circuit board
    Publication number: 20020012780
    Abstract: The subject matter of the invention is a base sheet for the preparation of a flexible printed circuit board which is a three-layered laminate consisting of (a) an electrically insulating film of a plastic resin such as a polyimide, (b) an epoxy resin-based adhesive layer and (c) a copper foil bonded to the film (a) with intervention of the adhesive layer (b). The base sheet can exhibit excellent performance in respect of peeling resistance, soldering heat resistance, dimensional stability and solvent resistance as well as workability into a printed circuit board only when each of the layers (a), (b) and (c) has a specified thickness in a narrow range of 10-30 &mgr;m, 5-15 &mgr;m and 5-15 &mgr;m, respectively.
    Type: Application
    Filed: July 2, 2001
    Publication date: January 31, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masahiro Yuyama, Hitoshi Arai, Yoshitsugu Eguchi
  • Room temperature curable organopolysiloxane composition and making method
    Patent number: 6342575
    Abstract: A room temperature curable organopolysiloxane composition comprising (1) a hydroxyl end-blocked organopolysiloxane having a viscosity of 10-1,000,000 centistokes at 25° C. in admixture with a premix of (2) methyltriacetoxysilane or a partial hydrolyzate thereof as a curing agent and (3) methanol is improved in shelf stability, physical properties and outer appearance as well as adhesion to aluminum.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: January 29, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masatoshi Miyake, Masaya Arakawa
  • Epoxy resin composition and semiconductor device
    Patent number: 6342309
    Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: January 29, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Shigeki Ino, Yasuo Kimura, Takayuki Aoki, Kazuhiro Arai, Hidenori Mizushima
  • R-Fe-B base permanent magnet materials
    Publication number: 20020007875
    Abstract: A R—Fe—B base permanent magnet material is composed of a R—Fe—B magnet alloy which contains 87.5-97.5 vol % of a Fe14R2B1 primary phase and 0.1-3 vol % of a rare earth oxide or a rare earth and transition metal oxide. The alloy contains as a major component in its metal structure a compound selected from among zirconium-boron compounds, niobium-boron compounds and hafnium-boron compounds. The compound has an average grain size of at most 5 &mgr;m and is uniformly distributed within the alloy such that the maximum interval between neighboring grains of the compound is at most 50 &mgr;m. Rare-earth permanent magnet materials of this composition and structure have excellent magnetic properties.
    Type: Application
    Filed: June 13, 2001
    Publication date: January 24, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kenji Yamamoto, Koro Tatami, Takehisa Minowa
  • Room temperature rapid-curable silicone composition
    Publication number: 20020010251
    Abstract: A room temperature rapid-curable silicone composition is provided which includes (A) an organopolysiloxane terminated with hydroxyl groups, having a viscosity of from 25 mPa.s to 1,000,000 mPa.s at 25° C.
    Type: Application
    Filed: June 29, 2001
    Publication date: January 24, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironobu Muramatsu, Tsuneo Kimura
  • Synthetic quartz glass manufacturing process
    Patent number: 6339940
    Abstract: A process for manufacturing synthetic quartz glass involves feeding a quartz glass-forming raw material to a high-temperature gas zone within a chamber, converting the quartz glass-forming raw material into quartz soot, and forming synthetic quartz glass from the soot. A suspended soot-discharging gas which has been flow-straightened in a suspended soot discharging direction flows through the chamber in the vicinity of the high-temperature gas zone. This process keeps free suspended soot from settling onto the surface of the quartz ingot where fusion and growth take place, thereby preventing the formation of bubbles within the quartz glass under growth.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: January 22, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Motoyuki Yamada, Hisatoshi Otsuka, Koji Matsuo
  • Coating solution and method for forming dielectric film
    Patent number: 6340735
    Abstract: A coating solution of a poly(phenylsilsesquioxane) ladder polymer having a weight average molecular weight of 4,000-100,000 in a suitable solvent is spin coated and heated to form a dense dielectric film having a low dielectric constant.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: January 22, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Fujio Yagihashi
  • Novel ester compounds, polymers, resist compositions and patterning process
    Publication number: 20020007031
    Abstract: An ester compound of the following formula (1) is provided.
    Type: Application
    Filed: April 26, 2001
    Publication date: January 17, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsunehiro Nishi, Koji Hasegawa, Takeru Watanabe, Takeshi Kinsho, Mutsuo Nakashima, Seiichiro Tachibana, Jun Hatakeyama
  • Method for preparation of organopolysilixame having branched molecular structure
    Publication number: 20020007007
    Abstract: The invention discloses a method for the preparation of an organopolysiloxane having a branched molecular structure which comprises the steps of:
    Type: Application
    Filed: July 11, 2001
    Publication date: January 17, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinji Irifune, Masahiko Ogawa
  • Process for regenerating unreacted vinyl chloride monomers recovered
    Patent number: 6339132
    Abstract: A process for regenerating unreacted vinyl chloride monomers is provided which has the step of compressing by means of an compressor an unreacted vinyl chloride monomer recovered from a process of vinyl chloride polymer production; compressing the same in contact with a lubricating oil fed into the compressor. In this process, the lubricating oil contains a polymerization inhibitor. Hence, even when this lubricating oil is circulated and reused as a lubricating oil after its separation from the unreacted vinyl chloride monomer, any vinyl chloride monomer remaining in the lubricating oil can effectively be kept from polymerizing in lubricating-oil circulation lines.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: January 15, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takashi Kobayashi, Fumiaki Adachi, Fujio Sato, Tadashi Amano
  • Resist compositions and patterning process
    Patent number: 6338931
    Abstract: A chemical amplification type resist composition contains as a photoacid generator a sulfonyldiazomethane compound of the formula (1): wherein R1 is C1-10 alkyl or C6-14 aryl, R2 is C1-6 alkyl, G is SO2 or CO, R3 is C1-10 alkyl or C6-14 aryl, p is an integer of 0 to 4, q is an integer of 1 to 5, 1≦p+q≦5, n is 1 or 2, m is 0 or 1, and n+m=2. The composition is suited for microfabrication, especially by deep UV lithography because of many advantages including improved resolution, minimized line width variation or shape degradation even on long-term PED, minimized debris after coating, development and peeling, and improved pattern profile after development.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: January 15, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori Maeda, Takeshi Nagata, Satoshi Watanabe, Youichi Ohsawa, Jun Watanabe, Shigehiro Nagura
  • Silicone rubber compositions
    Patent number: 6339124
    Abstract: A silicone rubber composition comprising an organopolysiloxane containing at least two alkenyl radicals and having a degree of polymerization of at least 100, an organopolysiloxane or organosilane, reinforcing silica, and an alkali metal salt of phosphoric acid has minimized plasticity recovery with time and improved storage stability and cures with an organic peroxide or addition reaction curing agent into a silicone rubber having improved compression set and yellowing resistance.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: January 15, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Minoru Igarashi, Yutaka Hagiwara
  • Process for preparing organohalosilanes
    Patent number: 6339167
    Abstract: Organohalosilanes are prepared by reacting metallic silicon with a halogenated hydrocarbon in the presence of a copper or copper compound catalyst and an activated aluminum, aluminum alloy or aluminum carbide promotor. The reaction is carried out at a temperature of 250-400° C. in a stirred tank reactor or a fluidized bed reactor. The inventive process shortens the time required for activation in the Rochow reaction and increases the selectivity for desirable diorganodihalosilanes. The steady state is thus prolonged and conversion of the silicon enhanced, resulting in an improved reaction performance.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: January 15, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Mikio Aramata, Kazutoshi Fujioka, Masahiro Yuyama