Abstract: Provided is an optical fiber glass preform in which a starting rod and a dummy glass are hardly separated from each other, and a method for manufacturing the glass preform. In the optical fiber glass preform, the dummy glass is fitted into one end of the starting rod, and a part of the dummy glass and the starting rod are surrounded by a clad glass. In the manufacturing method, at the time of connecting the starting rod and the dummy glass, a shape is adjusted in such a manner that an iron is brought into contact with a connection portion and is moved from a starting rod side toward a dummy glass side with appliance of a load.

Abstract: This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane which has a hydroxyl group or hydrolyzable group at both terminals of the molecular chain thereof; (B) 150-600 parts by mass of a hydrolyzable organopolysiloxane which has a specific hydrolyzable silyl group; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1-2 µm and in which, among the particles, the content of coarse grains having a particle diameter of 10 µm or more is 1 vol% or less relative to the total amount of component (D), as measured by the laser diffraction particle size distribution method; (E) 0.01-30 parts by mass of an adhesion promoter; and (F) 0.01-20 parts by mass of a pH indicator, wherein the thermal conductivity at 25° C. as measured by the hot disk method is 0.5 W/mK or more.

Abstract: Provided are an organopolysiloxane having a catechol structure per each molecule; and a powder treatment agent that is comprised of such organopolysiloxane. The organopolysiloxane is a catechol functional organopolysiloxane represented by the following formula (1): wherein each R1 independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms; each R2 independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms, or a substituent group represented by a formula (2); a, b, c and d each represent 0 or a positive number, and satisfy a+b+c+d=2 to 1,000; in each molecule, at least one R2 is the substituent group represented by the formula (2) being expressed as: wherein Y1 represents a substituted or unsubstituted divalent hydrocarbon group having 2 to 6 carbon atoms.

Abstract: The present invention is to provide a pellicle characterized by including a pellicle film and a pellicle frame, in which the pellicle film is stretched on the pellicle frame, and the pellicle film is an annealed pellicle film, and to provide a method for producing a pellicle by stretching a pellicle film on a pellicle frame, including the step of annealing the pellicle film alone before stretching the pellicle film on the pellicle frame, annealing the pellicle after stretching the pellicle film on the pellicle frame, or annealing the pellicle film alone and the pellicle both before and after stretching the pellicle film on the pellicle frame.

Abstract: A thermal conductive silicone composition includes (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm2/s; (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 ?m; and (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of ?20 to 100° C. The resulting thermal conductive silicone composition has excellent thermal conduction property.

Abstract: A material for forming an organic film using a polymer including an imide group for forming an organic underlayer film that cures under film-forming conditions in the air and in an inert gas, generates no by-product in heat resistance and embedding and flattening characteristics of a pattern formed on a substrate, also adhesiveness to a substrate for manufacturing a semiconductor apparatus, a method for forming an organic film, and a patterning process. The material includes (A) a polymer having a repeating unit represented by the following general formula (1A) whose terminal group is a group represented by either of the following general formulae (1B) or (1C), and (B) an organic solvent: wherein, W1 represents a tetravalent organic group, and W2 represents a divalent organic group: wherein, R1 represents any of the groups represented by the following formula (1D), and two or more of R1s may be used in combination.

Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.

Abstract: An apparatus for manufacturing polysilicon rod by a Siemens method has a base plate 20; and a holding body 100 provided on the base plate 20 so as to be movable in a horizontal direction and electrically connect between a core wire holder 1 and an electrode 4. The holding body 100 is configured to rotatably hold the core wire holder 1 with respect to the base plate 20.

Abstract: A synthetic quartz glass substrate is machined by bringing a surface of the synthetic quartz glass substrate as the workpiece into contact with and superposing it on a surface of a protective member made of synthetic quartz glass to effect optical contact bonding of the workpiece and the protective member, and passing a cutting tool through the optical contact bonding surfaces. This machining process is able to effectively prevent the generation of microdefects at the cutting tool entry site and extraction site during a cutting operation. Moreover, a fixing agent is not used to join the workpiece and the protective member, and so productivity is high because there is no need for the application and later removal of a fixing agent.

Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A) or (1B), and an organic solvent, where Ar1 and Ar2 represent a benzene ring or naphthalene ring which optionally have a substituent; X represents a single bond or methylene group; a broken line represents a bonding arm; R represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and W1 represents a hydroxyl group, an alkyloxy group having 1 to 10 carbon atoms, or an organic group having at least one aromatic ring optionally having a substituent. A composition for forming an organic film, the composition containing a polymer with high carbon content and thermosetting property as to enable high etching resistance and excellent twisting resistance; a patterning process using the composition; and a polymer suitable for the composition for forming an organic film.

Abstract: Provided is a transparent spinel sintered body which is formed from an Mg—Al spinel powder having an Al/Mg ratio of from 1.97 to 2.03 or a mixed powder of an Mg oxide and an Al oxide, and wherein the total content of metal impurities excluding Al and Mg is less than 100 ppm. A sample of this transparent spinel sintered body having a thickness of 3 mm has a total light transmittance of 80% or more in the thickness direction for the wavelength range of from 190 nm to 400 nm; and this transparent spinel sintered body is usable as a medium that transmits light from an ultraviolet light emitting element.

Abstract: A method for producing coated semiconductor nanoparticles, comprising a step of coating the surface of semiconductor nanoparticles with a metal oxide, wherein the surface of the semiconductor nanoparticles is coated with the metal oxide by treating a metal oxide precursor with microwave irradiation treatment.

Abstract: A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.

Abstract: Provided is a negative resist film laminate comprising a thermoplastic film, which is a first support body, and a negative resist film, wherein the negative resist film contains (A) an alkali-soluble resin having a phenolic hydroxy group, (B) a plasticizer containing polyester, (C) a photoacid generator, (D) an epoxy compound containing on average four or more epoxy groups per molecule, and (E) a benzotriazole compound and/or an imidazole compound.

Abstract: A cosmetic containing at least one organosiloxane represented by general formula (1), having a boiling point in a range of 205 to 255° C. and a viscosity of less than 5 mm 2/s at 25° C. In the formula, R's are identical to or different from one another and each independently represent a hydrogen group, hydroxy group, or a monovalent hydrocarbon group having 1 to 3 carbon atoms, but at least one R is a monovalent hydrocarbon group having 2 to 3 carbon atoms. “a” represents 1 to 5. Thus, a cosmetic which has light touch, good spread, and excellent water repellency, forms uniform cosmetic film, and successfully achieves favorable feeling on use with no strong oily feeling, and which has excellent stability over time and cosmetic persistence even when blended with various oil agents, such as silicone, hydrocarbon oil, and ester, an organic ultraviolet absorber, or an oily component solid at 25° C.

Abstract: Provided are a surface treatment agent for powder capable of being used to produce a dispersion superior in dispersibility, fluidity and temporal stability; and a dispersion containing a powder treated with such surface treatment agent for powder. The agent is a diblock copolymer whose main chain is comprised of a silicone graft copolymer block represented by a formula [I] and a polar copolymer block represented by a formula [II], wherein one end structure of the main chain is represented by a formula [III], and the other end structure of the main chain is represented by a formula [IV], the formulae [I] to [IV] being expressed as wherein A represents an organopolysiloxane-containing group; B represents a polar group-containing monovalent hydrocarbon group having 1 to 20 carbon atoms, an amino group or a hydroxyl group.

Abstract: A method and an apparatus for producing a porous glass preform by using organosiloxane raw material is provided. The apparatus for producing the porous glass preform 12 according to the present embodiment is configured to mix organosiloxane in a liquid state being a raw material with a carrier gas in a vaporizer 6, heat this mixture to be vaporized, supply this vapor to a burner 13 as a gas raw material, and produce a porous glass preform by depositing a glass fine particle produced by combusting the gas raw material on a starting material, herein the apparatus for producing a porous glass preform includes a moisture removing apparatus 8 configured to remove moisture in the carrier gas and supply the vaporizer with the carrier gas.

Abstract: This polymer having a reactive silicon-containing group is represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group. (In the formula, X represents a monovalent to trivalent organic group including a main chain backbone including a predetermined polymer such as a polyurethane, a poly(meth)acrylate, or a polysiloxane, R1 and R2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents O, S, or the like, A1 and A2 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.

Abstract: A one-pack type curable silicone gel composition which contains: 100 parts by mass of (A) a branched chain organopolysiloxane having a specific structure from 0.1 part by mass to 50 parts by mass of (B) a diorganopolysiloxane having both molecular chain ends blocked with diorganohydrogensiloxy groups; (C) a platinum-based catalyst; and (D) a phosphite compound represented by formula (3) (wherein R2 represents a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and X represents a hydrogen atom or a methyl group) in such an amount that more than 3 molecules hut not more than 15 molecules of the phosphite compound represented by formula (3) are present per one platinum atom in component (C). This one-pack type curable silicone gel composition is stable in terms of characteristics and physical properties even if exposed to a temperature more than 50° C. for a long period of time.

Abstract: A conductive polymer composition containing: (A) a polyaniline-based conductive polymer having a repeating unit represented by following general formula (1); and (B) polymer having structure represented by following general formula (2). In formulae, each of R1 to R4 represents hydrogen atom, acidic group, hydroxy group, alkoxy group, carboxy group, nitro group, halogen atom, or hydrocarbon group, R5 and R6 each independently represent a hydrogen atom, linear, branched, or cyclic alkyl group having 1-10 carbon atoms or a hydrocarbon group containing a hetero atom, Xa- represents anion, and “a” represents valence. An object of the invention provides a conductive polymer composition which has good filterability and film-formability of flat film on electron beam resist and can be used suitably for antistatic film for electron beam resist writing showing excellent antistatic property in electron beam writing process, and, reducing effect of acid diffused from film to minimum, and also having excellent peelability.